Light unit

Patent metadata

Field	Value
Publication number	US-9625642-B2
Application number	US-201113885368-A
Country	US
Kind code	B2
Filing date	Sep 2, 2011
Priority date	Nov 15, 2010
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

A light unit is provided. The light unit includes a PCB mounted with a plurality of LEDs, and a light guide member having a plurality of reception grooves piercing therethrough and receiving the LEDs, wherein the light guide member includes one surface and the other surface opposite to the one surface, and the one surface of the light guide member is further coated with the resin material. The reception grooves are formed in the light guide member and are filled with a fluid resin material, thus preventing the damage to the LED caused by the difference between the thermal expansion rates of the components such as the light guide member, the reflection film and the PCB.

First claim

The invention claimed is:

1. A light unit comprising:
a printed circuit board (PCB) mounted with a plurality of light emitting diodes (LEDs); and
a light guide member having a plurality of reception grooves receiving the LEDs,
wherein the reception grooves are filled with a resin material,
wherein the resin material has a predetermined fluidity and is configured to diffuse light emitted from the LEDs,
wherein the resin material is in direct physical contact with the light guide member,
wherein a bottom surface of the resin material lies in a same plane as a bottom surface of the light guide member,
wherein the light guide member includes a first surface and a second surface opposite to the first surface,
wherein the second surface of the light guide member includes a first density pattern region and a second density pattern region, and
wherein the second density pattern region has a higher pattern density than the first density pattern region,
wherein the first density pattern region and the second density pattern region comprise convex polygonal pyramid patterns, a bottom inclination angle of the polygonal pyramid pattern of the first density pattern region has a value of 35 to 50 degrees, and a bottom inclination angle of the polygonal pyramid pattern of the second density pattern region has a value of 50 to 70 degrees.

2. The light unit of claim 1 , wherein the reception grooves are formed to pierce the light guide member, and the first surface of the light guide member is further coated with the resin material.

3. The light unit of claim 1 , wherein the resin material comprises an ultraviolet (UV)-curing resin material.

4. The light unit of claim 3 , further comprising a plurality of light-diffusing beads included in the resin material.

5. The light unit of claim 4 , wherein the beads are included at 0.01% to 0.3% with respect to the total weight of the resin material.

6. The light unit of claim 1 , wherein the first density pattern region is nearer to a light emission surface of the LED than is the second density pattern region.

7. The light unit of claim 6 , wherein the first density pattern region and the second density pattern region comprise a plurality of concave patterns that overlap each other or are spaced apart from each other.

8. The light unit of claim 7 , wherein the concave patterns comprise concave polygonal pyramid patterns or hemispherical patterns toward the inside of the surface of the light guide member.

9. A light unit comprising:
a printed circuit board (PCB) mounted with a plurality of light emitting diodes (LEDs); and
a light guide member having a plurality of reception grooves receiving the LEDs;
wherein the reception grooves are filled with a resin material;
wherein the reception grooves are formed to pierce the light guide member, the light guide member includes a first surface and a second surface opposite to the first surface, and the first surface of the light guide member is further coated with the resin material;
wherein a first density pattern region and a second density pattern region, which has a higher pattern density than the first density pattern region, are formed on the second surface of the light guide member, and the first density pattern region is nearer to a light emission surface of the LED than is the second density pattern region, and
wherein a third density pattern region, and a fourth density pattern region that has a higher pattern density than the third density pattern region, are formed on the first surface of the light guide member or on a top surface of the resin material layer formed on the first surface of the light guide member, and the fourth density pattern region is nearer to the light emission surface of the LED than is the third density pattern region.

10. The light unit of claim 9 , wherein the third density pattern region and the fourth density pattern region comprise a plurality of convex patterns that overlap each other or are spaced apart from each other.

11. The light unit of claim 10 , wherein the convex patterns comprise polygonal pyramid patterns or hemispherical patterns.

12. The light unit of claim 9 , wherein the first to fourth density pattern regions comprise convex or concave polygonal pyramid patterns, wherein a bottom inclination angle of the polygonal pyramid pattern has a value of 35 to 70 degrees.

13. The light unit of claim 1 , wherein an optical film layer comprising a microlens array pattern is stacked on the first surface of the light guide member or on a top surface of the resin material layer formed on the first surface of the light guide member.

14. A light unit comprising:
a printed circuit board (PCB) mounted with a plurality of light emitting diodes (LEDs); and
a light guide member having a plurality of reception grooves receiving the LEDs;
wherein the reception grooves are filled with a resin material;
wherein the reception grooves are formed to pierce the light guide member, the light guide member includes a first surface and a second surface opposite to the first surface, and the first surface of the light guide member is further coated with the resin material;
wherein an optical film layer comprising a microlens array pattern is stacked on the first surface of the light guide member or on a top surface of the resin material layer formed on the first surface of the light guide member, and
wherein the optical film layer comprises a fifth density pattern region and a sixth density pattern region having a higher pattern density than the fifth density pattern region, and the sixth density pattern region is nearer to a light emission surface of the LED than is the fifth density pattern region.

15. The light unit of claim 14 , wherein the resin material comprises a mixture of 10˜21 wt % urethane acrylate oligomer and 10˜21 wt % polyacryl.

16. The light unit of claim 15 , wherein the resin material further comprises 10˜21 wt % IBOA (isobornyl Acrylate), 10˜21 wt % HPA (Hydroxypropyl Acrylate), and 10˜21 wt % 2-HEA (2-Hydroxyethyl Acrylate).

17. The light unit of claim 16 , wherein the resin material further comprises 1˜5 wt % photo initiator and 0.5˜1 wt % antioxidant.

Assignees

• Kim Jong Sun
• Park Sang Jun
• Jang Jae Hyuk
• Park Hyung Min
• Ahn Kyoung Soo
• Lee Jeong Oh
• Lee Yong In
• Lg Innotek Co Ltd

Inventors

• Kim Jong Sun
• Park Sang Jun
• Jang Jae Hyuk
• Park Hyung Min
• Ahn Kyoung Soo
• Lee Jeong Oh
• Lee Yong In

Classifications

• G02B6/0091

  of the light source relative to the light guide (G02B6/0021 takes precedence) · CPC title

• G02B6/0073 Primary

  Light emitting diode [LED] · CPC title

• G02B6/0068

  Arrangements of plural sources, e.g. multi-colour light sources · CPC title

• G02F1/133606

  including a specially adapted diffusing, scattering or light controlling members · CPC title

• G02B6/0083

  Details of electrical connections of light sources to drivers, circuit boards, or the like · CPC title