Test socket for testing semiconductor chip package and method of manufacturing the same
US-9983229-B2 · May 29, 2018 · US
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Lee Yong-In patents
Lee Yong-In is listed as an inventor on 1 patent in our database. Major assignees and classification codes are summarized below.
| Metric | Value |
|---|---|
| Inventor | Lee Yong-In |
| Total patents | 1 |
| First publication | May 29, 2018 |
| Latest publication | May 29, 2018 |
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Major assignees
Companies most often associated with this inventor's publications.
| Assignee | Patents |
|---|---|
| Samsung Electronics Co Ltd | 1 |
Top CPC classifications
Most common classification codes across this inventor's patents.
| CPC | Patents |
|---|---|
| H01B1/02 | 1 |
| G01R1/0433 | 1 |
| G01R31/26 | 1 |
| H01R13/03 | 1 |
| H01B1/04 | 1 |