Methods and apparatuses for selective chemical etching

Patent metadata

Field	Value
Publication number	US-9624430-B2
Application number	US-201514712208-A
Country	US
Kind code	B2
Filing date	May 14, 2015
Priority date	May 14, 2015
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Methods, apparatuses and systems are disclosed for chemically etching parts by generating an enclosed chemical etching chamber in contact with a part surface and directing a flow of chemical etchant solution in contact with a part region to be etched.

First claim

What is claimed is:

1. A method for chemically etching a part surface, the method comprising steps of:
positioning an etching device proximate to the part surface wherein said etching device comprises:
a chamber:
a chamber boundary, said chamber boundary comprising an inner O-ring;
at least one chamber inlet;
at least one chamber outlet;
an outer O-ring extending circumferentially about the chamber, said outer O-ring and inner O-ring defining an area between said outer O-ring and inner O-ring;
a vacuum port located beyond the chamber boundary, said vacuum port in communication with a vacuum source;

engaging the etching device to the part surface;
delivering a negative pressure to the area between said outer O-ring and inner O-ring;
sealing the etching device to the part surface; and
directing a flow of etchant solution into the chamber inlet, such that the etchant solution contacts the part surface for a predetermined amount of time before exiting the chamber outlet.

2. The method of claim 1 , wherein the chamber boundary surrounds at least a region of the part surface exposed for chemical etching.

3. The method of claim 1 , wherein the etching device further comprises at least one sealing mechanism on the device, said sealing mechanism contacting the part surface.

4. The method of claim 1 , wherein a mechanical means maintains the etching device chamber in contact with the part surface with sufficient force to maintain a substantially leak-proof seal at an interface of the chamber boundary and the part surface.

5. The method of claim 4 , wherein the mechanical means generates a force ranging from about 10 to about 100 pounds per linear inch at the interface of the chamber boundary and the part surface.

6. The method of claim 1 , wherein the chamber boundary comprises at least one O-ring.

7. The method of claim 1 , wherein the flow of etchant solution ranges from about one gallon per hour to about one gallon per minute.

Assignees

• Boeing Co

Inventors

• Nansen David S
• Beauchamp Walter A
• Firth Lee C

Classifications

• C23F1/02 Primary

  Local etching · CPC title

• C23F1/08

  Apparatus, e.g. for photomechanical printing surfaces (photo- mechanical reproduction G03F) · CPC title

• B05C5/00

  Apparatus in which liquid or other fluent material is projected, poured or allowed to flow on to the surface of the work (B05C7/00 takes precedence; essentially involving spraying or electrostatic projection B05B) · CPC title

• C23F1/04

  Chemical milling · CPC title

• C09K13/00 Primary

  Etching, surface-brightening or pickling compositions (for glass C03C15/00, {C03C25/66; for mortars, concrete, artificial or natural stone or ceramics C04B41/5338}; for metallic material C23F, C23G1/00, C25F1/00; {for semi-conductors H10P52/40}) · CPC title