Substrate processing apparatus for coating liquid composed of first coating liquid and second coating liquid on substrate with slit-shaped ejection port

Patent metadata

Field	Value
Publication number	US-9623435-B2
Application number	US-201514813590-A
Country	US
Kind code	B2
Filing date	Jul 30, 2015
Priority date	Aug 11, 2014
Publication date	Apr 18, 2017
Grant date	Apr 18, 2017

Abstract

Disclosed is a substrate processing apparatus. The substrate processing apparatus includes a moving mechanism that moves a wafer in a horizontal direction, coating sections that eject the coating liquid to the wafer, and dry sections that dries the coating liquid, and a controller that controls the drying sections, the coating sections, and the moving mechanism. In each coating section, the wafer is moved in the horizontal direction while causing the coating liquid to be in contact with the wafer so that the coating liquid is coated on the entire surface.

First claim

What is claimed is:

1. A substrate processing apparatus for coating a coating liquid including a first coating liquid and a second coating liquid on a substrate, the apparatus comprising:
a first coating nozzle having a first ejection port which is slit-shaped and configured to eject the first coating liquid to a surface of the substrate from the first ejection port;
a second coating nozzle having a second ejection port which slit-shaped and configured to eject the second coating liquid to a surface of the first coating liquid;
a moving driver configured to relatively move the substrate and the first coating nozzle, and the second coating nozzle in a horizontal direction; and
a controller configured to control the first coating nozzle, the second coating nozzle, and the moving driver,
wherein the controller is programmed to control the first coating nozzle, the second coating nozzle, and the moving driver to sequentially perform:
disposing the first coating nozzle at a height of a first target film thickness by the moving driver such that the first coating liquid ejected from the first coating nozzle is in contact with the surface of the substrate, to form a liquid pool of the first coating liquid between the first ejection port of the first coating nozzle and an outer peripheral portion of the substrate;
moving the substrate and the first coating nozzle relatively with each other in the horizontal direction while causing the first coating liquid to be in contact with the surface of the substrate such that the first coating liquid is coated on an entire surface of the substrate, to form a hump having a height greater than the first target film thickness on an entire outer peripheral portion of the substrate;
disposing, by the moving driver, the second coating nozzle at a height of a second target film thickness from a surface of the first coating liquid except for the hump such that the second coating liquid supplied from a second supply source is in contact with the hump, to form a liquid pool of the second coating liquid between the second ejection port of the second coating nozzle and the hump; and
moving the substrate and the second coating nozzle relatively with each other in the horizontal direction while causing the second coating liquid to be in contact with the surface of the first coating liquid and controlling such that a supply amount of the second coating liquid ejected from the second ejection port to the hump is smaller than a supply amount of the second coating liquid ejected from the second ejection port to the surface of the first coating liquid except for the hump, to coat the second coating liquid on an entire surface of the first coating liquid.

2. The substrate processing apparatus according to claim 1 wherein, in the moving the substrate and the first coating nozzle relatively, the controller is programmed to control the first coating nozzle to eject and coat the first coating liquid only to the outer peripheral portion of the substrate.

3. The substrate processing apparatus according to claim 1 , wherein the controller is programmed to set the first target film thickness of the first coating liquid and the second target film thickness of the second coating liquid to be equal to each other.

4. The substrate processing apparatus according to claim 2 , wherein the controller is programmed to set the first target film thickness of the first coating liquid and the second target film thickness of the second coating liquid to be equal to each other.

5. The substrate processing apparatus according to claim 1 , wherein the controller is programmed to control the second coating nozzle and the moving driver to perform the moving the substrate and the second coating nozzle relatively with each other multiple times.

6. The substrate processing apparatus according to claim 5 , wherein, in coating steps including the moving the substrate and the first coating nozzle and the moving the substrate and the second coating nozzle relatively with each other multiple times, the controller is programmed to set the first target film thicknesses of the first coating liquid and the second target film thickness of the second coating liquid in respective coating steps to be equal to each other.

7. The substrate processing apparatus according to claim 1 , further comprising:
a first dryer configured to dry the first coating liquid coated on the entire surface of the substrate; and
a second dryer configured to dry the second coating liquid coated on the entire surface of the first coating liquid,
wherein the controller is programmed to control the first dryer and the second dryer to perform:
drying the first coating liquid coated in the moving the substrate and the first coating nozzle relatively by the first drying section, after the moving the substrate and the first coating nozzle relatively and before the moving the substrate and the second coating nozzle relatively; and
drying the second coating liquid coated in the moving the substrate and the second coating nozzle relatively by the second drying section, after the moving the substrate and the second coating nozzle relatively.

8. The substrate processing apparatus according to claim 7 , wherein the first coating nozzle, the second coating nozzle, the first dryer, and the second dryer are disposed in the same processing apparatus.

9. The substrate processing apparatus according to claim 7 , wherein the first coating nozzle and the first dryer are disposed in different processing apparatus, and
the second coating nozzle and the second dryer are disposed in different processing apparatuses.

10. The substrate processing apparatus according to claim 7 , wherein the first dryer and the second dryer and configured to dry the first coating liquid and the second coating liquid, respectively by heating the substrate.

11. The substrate processing apparatus according to claim 7 , wherein the first dryer and the second dryer are configured to dry the first coating liquid and the second coating liquid, respectively by decompressing an atmosphere around the substrate.

Assignees

• Tokyo Electron Ltd

Inventors

• Wakamoto Yukihiro

Classifications

• H10P72/0456

  in-line arrangement · CPC title

• H10P72/0451

  Apparatus for manufacturing or treating in a plurality of work-stations · CPC title

• H10P72/0448

  Apparatus for applying a liquid, a resin, an ink or the like · CPC title

• H10P72/0414

  using mainly spraying means, e.g. nozzles · CPC title

• B05C5/0216

  by relative movement of article and outlet according to a predetermined path · CPC title