Heat-sink device intended for at least one electronic component and corresponding method

Patent metadata

Field	Value
Publication number	US-9622382-B2
Application number	US-201113877752-A
Country	US
Kind code	B2
Filing date	Sep 27, 2011
Priority date	Oct 5, 2010
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

A heat-sink device intended for at least one electronic component ( 12 ), includes: a heat-sink; a substrate ( 11 ) for the at least one electronic component ( 12 ), said substrate covering the heat-sink; and thermal coupling provided between the substrate and the heat-sink and made from a material different from that of the heat-sink. The heat-sink comprises of a set of independent fins ( 10 ), and the thermal-coupling ( 13 ) is made from a heat-conductive polymer material and also serve as mechanical coupling between the substrate ( 11 ) and the fins ( 10 ).

First claim

The invention claimed is:

1. A method for obtaining a heat-sink device, said heat-sink device being intended for at least one electronic component ( 12 ) and including:
heat-sink means,
a substrate ( 11 ) for said at least one electronic component ( 12 ), covering said heat-sink means, and
thermal coupling means between the substrate and the heat-sink means and made from a material different from that of the heat-sink means,
wherein, the heat-sink means consist of a set of discrete fins ( 10 , 10 ′) and the thermal coupling means ( 13 ) are made from a heat-conductive polymer and also provide a mechanical coupling between said substrate ( 11 ) and said fins ( 10 ),
said method including the following steps:
(a) the discrete set of fins ( 10 ) is obtained,
(b) the fins are positioned and held, the fins defining between them a particular gap “e”,
(c) an assembly formed of the substrate ( 11 ) and the at least one electronic component ( 12 ) is obtained,
(c1) a part ( 71 ) is inserted over the free edges ( 100 ) of the fins ( 10 ),
(c2) a sacrificial material ( 74 ) is molded between the part ( 71 ) and a support ( 4 ), and
(c3) said part is then removed,

(d) said assembly is positioned on the edges ( 100 ) of the fins ( 10 ), said substrate ( 11 ) being in at least partial contact with said fins,
(e) the heat conductive material ( 13 ) is molded between said substrate and said fins, and in which method the sacrificial material ( 74 ) is removed after step (e).

2. The method claimed in claim 1 , in which a support ( 4 ) of the fins ( 10 ) is removed after the step (e) or the step (c 3 ).

3. The method claimed in claim 1 , in which the following steps are carried out after the step (e):
(f) another assembly formed of a substrate ( 11 ′) and at least one electronic component ( 12 ′) is obtained,
(g) said other assembly ( 11 ′, 12 ′) is positioned on the free edges ( 101 ) of the fins ( 10 ) opposite said assembly ( 11 , 12 ),
(h) a heat conductive material ( 13 ′) is molded between said other substrate ( 11 ′) and said fins ( 10 ).

4. The method claimed in claim 1 , in which the material used during the steps (e) and/or (h) is a polymer material injected at raised temperature, the method then including a cooling step after the steps (e) and/or (h).

Assignees

• Gasse Adrien
• Revirand Pascal
• Commissariat Energie Atomique

Inventors

• Gasse Adrien
• Revirand Pascal

Classifications

• H10W40/251

  Organics · CPC title

• H10W40/226

  characterised by projecting parts, e.g. fins to increase surface area (leadframes for cooling H10W70/461) · CPC title

• H10W40/037 Primary

  Assembling together parts thereof · CPC title

• H10W40/22

  characterised by their shape, e.g. having conical or cylindrical projections · CPC title

• F21Y2115/10

  Light-emitting diodes [LED] · CPC title