Wireless communications package with integrated antennas and air cavity

Patent metadata

Field	Value
Publication number	US-9620464-B2
Application number	US-201514663702-A
Country	US
Kind code	B2
Filing date	Mar 20, 2015
Priority date	Aug 13, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

Antenna package structures are provided to implement wireless communications packages. For example, an antenna package includes a package carrier and a package cover. The package carrier includes an antenna ground plane and an antenna feed line. The package cover includes a planar lid having a planar antenna element formed on a first surface of the planar lid. The package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element aligned to the antenna ground plane and the antenna feed line of the package carrier, wherein the first surface of the planar lid is disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the package carrier.

First claim

We claim:

1. An antenna package, comprising:
a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid;
wherein the package cover is bonded to a first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the planar antenna element on the first surface of the planar lid aligned to the antenna ground plane and the antenna feed line of the package carrier; and
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the planar antenna element and the first surface of the package carrier,
wherein a first portion of the antenna feed line is disposed on the first surface of the package carrier and wherein a second portion of the antenna feed line extends through the package carrier from a second surface of the package carrier to the first surface of the package carrier.

2. The antenna package of claim 1 , wherein the package cover comprises a sidewall structure disposed around a peripheral region of the first surface of the planar lid, wherein the sidewall structure is bonded to the first surface of the package carrier.

3. The antenna package of claim 2 , wherein the package cover is bonded to the first surface of the package carrier using an array of solder bump connections between the sidewall structure and the package carrier.

4. The antenna package of claim 2 , wherein the package cover is bonded to the first surface of the package carrier using an adhesive material between the sidewall structure and the package carrier.

5. The antenna package of claim 1 , wherein the first surface of the planar lid is bonded to the first surface of the package carrier using a ball grid array of solder connections.

6. The antenna package of claim 1 , wherein the package cover comprises a rectangular frame structure that is bonded to the planar lid using a first array of solder bump connections, and wherein the rectangular frame structure is bonded to the first surface of the package carrier using a second array of solder bump connections.

7. The antenna package of claim 1 , wherein the antenna ground plane is embedded within the package carrier below the first surface of the package carrier.

8. The antenna package of claim 1 , wherein the planar lid comprises an array of patch antenna elements formed on the first surface of the package lid.

9. The antenna package of claim 1 , further comprising one or more support structures disposed in the air space between the first surfaces of the planar lid and package carrier to support the planar lid.

10. A wireless communications package comprising the antenna package of claim 1 , wherein the wireless communications package comprises an RFIC (radio frequency integrated circuit) chip flip-chip bonded to a second surface of the package carrier opposite the first surface of the package carrier; and
an application board bonded to the second surface of the package carrier.

11. An antenna package, comprising:
a package carrier comprising an antenna ground plane and an antenna feed line; and
a package cover comprising a planar lid, the planar lid comprising a planar antenna element formed on a first surface of the planar lid and a metallization pattern formed on a second surface of the planar lid, opposite the first surface of the planar lid;
wherein the metallization pattern on the second surface of the planar lid comprises a footprint that is similar to, and aligned with, a metallization pattern of the planar antenna element formed on the opposing first surface of the planar lid, wherein the metallization pattern on the second surface of the planar lid is configured to provide structural support to the planar lid and compensate for thermal expansion of the metallization pattern of the planar antenna element.

12. A wireless communications package, comprising:
an antenna package comprising:
a package carrier having a first surface and a second surface, wherein the package carrier comprises an antenna ground plane and a plurality of an antenna feed lines, and an array of bonding pads formed on the second surface, wherein a first portion of each antenna feed line is disposed on the first surface of the package carrier and wherein a second portion of each antenna feed line extends through the package carrier from a second surface of the package carrier to the first surface of the package carrier; and
a package cover comprising a planar lid, the planar lid comprising an array of planar antenna elements formed on a first surface of the planar lid;
wherein the package cover is bonded to the first surface of the package carrier with the first surface of the planar lid facing the first surface of the package carrier, and with the array of planar antenna elements on the first surface of the planar lid aligned to the antenna ground plane and to corresponding ones of the first portions of the antenna feed lines on the first surface of the package carrier; and
wherein the package cover is bonded to the package carrier with the first surface of the planar lid fixedly disposed at a distance from the first surface of the package carrier to provide an air space between the array of planar antenna elements and the first surface of the package carrier;

an RFIC (radio frequency integrated circuit) chip flip-chip bonded to bonding pads on the second surface of the package carrier; and
an application board bonded to bonding pads on the second surface of the package carrier.

13. The wireless communications package of claim 12 , wherein the package cover comprises a sidewall structure disposed around a peripheral region of the first surface of the planar lid, wherein the sidewall structure is bonded to the first surface of the package carrier.

14. The wireless communications package of claim 12 , wherein the antenna ground plane is embedded within the package carrier below the first surface of the package carrier.

15. The wireless communications package of claim 12 , further comprising one or more support structures disposed in the air space between the first surfaces of the planar lid and package carrier to support the planar lid.

16. The wireless communications package of claim 12 , further comprising a metallization pattern formed on a second surface of the planar lid, opposite the first surface of the planar lid, wherein the metallization pattern comprises a footprint that is similar to, and aligned with, a metallization pattern of the array of planar antenna elements formed on the first surface of the planar lid, wherein the metallization pattern on the second surface of the planar lid is configured to provide structural support to the planar lid and compensate for thermal expansion of the metallization pattern of the array of planar antenna elements.

Assignees

• IBM

Inventors

• Baks Christian Wilhelmus
• Gu Xiaoxiong
• Liu Duixian
• Valdes-Garcia Alberto

Classifications

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W90/724

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W72/877

  Bump connectors and die-attach connectors · CPC title

• H10W72/252

  comprising solid metals or solid metalloids, e.g. PbSn, Ag or Cu · CPC title

• H10W44/248

  for antennas · CPC title