Linearity performance for radio-frequency switches

Patent metadata

Field	Value
Publication number	US-9620424-B2
Application number	US-201414534149-A
Country	US
Kind code	B2
Filing date	Nov 5, 2014
Priority date	Nov 12, 2013
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

Improved linearity performance for radio-frequency (RF) switches. In some embodiments, a switching device can include a first terminal and a second terminal, and a plurality of switching elements connected in series to form a stack between the first terminal and the second terminal. The switching elements can have a non-uniform distribution of a parameter that results in the stack having a first linearity performance that is better than a second linearity performance corresponding to a similar stack having a substantially uniform distribution of the parameter.

First claim

What is claimed is:

1. A switching device comprising:
a first terminal and a second terminal; and
a plurality of field-effect transistors (FETs) connected in series to form a stack between the first terminal and the second terminal, each FET including a plurality of rectangular shaped source fingers and a plurality of rectangular shaped drain fingers arranged in an alternating manner, the FET further including a plurality of rectangular shaped gate fingers arranged such that each neighboring pair of source and drain fingers includes a gate finger therebetween, the plurality of gate fingers of the FET having a gate length value, the stack having a non-uniform distribution of a parameter gate length values of the FETs resulting in the stack having a first linearity performance that is better than a second linearity performance corresponding to a similar stack having a substantially uniform distribution of gate length values.

2. The switching device of claim 1 wherein the stack further has a first voltage handling capacity that is at least as high as a second voltage handling capacity corresponding to the similar stack.

3. The switching device of claim 1 wherein the stack further has a first ON-resistance (Ron) value that is less than a second Ron value corresponding to the similar stack.

4. The switching device of claim 1 wherein the FET is implemented as a silicon-on-insulator (SOI) device.

5. The switching device of claim 1 wherein the the stack has a non-uniform distribution of gate area values of the FETs based on the non-uniform distribution of the gate length values of the FETs.

6. The switching device of claim 1 wherein the non-uniform distribution of the gate length values is based on a non-uniform distribution of another parameter associated with the FETs.

7. The switching device of claim 6 wherein the other parameter includes a distribution of voltage VDS across each of the FETs.

8. The switching device of claim 7 wherein the non-uniform distribution of the gate length values is selected to yield a scaled version of the voltage VDS distribution.

9. The switching device of claim 8 wherein the gate length of at least one of the FETs is greater than the value of the uniform distribution of the gate length values.

10. The switching device of claim 9 wherein at least some of the FETs have gate lengths that are less than the value of the uniform distribution of the gate length.

11. The switching device of claim 8 wherein the sum of the VDS values of the FETs for the non-uniform distribution of the gate length is greater than the sum of the VDS values of the FETs for the uniform distribution of the gate length.

12. The switching device of claim 11 wherein the sum of the gate lengths of the FETs for the non-uniform distribution of the gate length is greater than the sum of the gate length of the FETs for the uniform distribution of the gate length.

13. The switching device of claim 6 wherein the non-uniform distribution of the gate length values includes a plurality of groups of gate length values, each group having a common value of the gate length.

14. The switching device of claim 6 wherein the first linearity performance includes a first ON-resistance (Ron) value that is less than a second Ron value corresponding to the second linearity performance.

15. The switching device of claim 1 wherein at least some of the FETs include different values of gate widths.

16. A switching device comprising:
a first terminal and a second terminal; and
a plurality of switching elements connected in series to form a stack between the first terminal and the second terminal, the switching elements having a non-uniform distribution of a parameter, the non-uniform distribution resulting in the stack having a first linearity performance that is better than a second linearity performance corresponding to a similar stack having a substantially uniform distribution of the parameter, each switching element including a field-effect transistor (FET) having a source, a drain and a gate formed on an active region, the FET being implemented as a finger configuration device such that the gate includes a number of rectangular shaped gate fingers, each gate finger implemented between a rectangular shaped source finger of the source and a rectangular shaped drain finger of the drain, the parameter including a length of the gate of the FET.

17. A semiconductor die comprising:
a semiconductor substrate; and
a plurality of field-effect transistors (FETs) connected in series to form a stack, each FET including a plurality of rectangular shaped source fingers and a plurality of rectangular shaped drain fingers arranged in an alternating manner, the FET further including a plurality of rectangular shaped gate fingers arranged such that each neighboring pair of source and drain fingers includes a gate finger therebetween, the plurality of gate fingers of the FET having a gate length value, the stack having a non-uniform distribution of pate length values of the FETs resulting in the stack having a first linearity performance that is better than a second linearity performance corresponding to a similar stack having a substantially uniform distribution of pate length values.

18. A wireless device comprising:
a transmitter;
a power amplifier in communication with the transmitter, the power amplifier configured to amplify a radio-frequency (RF) signal generated by the transmitter;
an antenna configured to transmit the amplified RF signal; and
a switching circuit configured to route the amplified RF signal from the power amplifier to the antenna, the switching circuit including a plurality of field-effect transistors (FETs) connected in series to form a stack, each FET including a plurality of rectangular shaped source fingers and a plurality of rectangular shaped drain fingers arranged in an alternating manner, the FET further including a plurality of rectangular shaped gate fingers arranged such that each neighboring pair of source and drain fingers includes a gate finger therebetween, the plurality of gate fingers of the FET having a gate length value, the stack having a non-uniform distribution of gate length values of the FETs resulting in the stack having a first linearity performance that is better than a second linearity performance corresponding to a similar stack having a substantially uniform distribution of pate length values.

Assignees

• Skyworks Solutions Inc

Inventors

• Blin Guillaume Alexandre
• Joshi Aniruddha B
• Masse Christophe

Classifications

• H10W90/754

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title

• H10W74/114

  by a substrate and the encapsulations · CPC title

• H10W74/00

  Encapsulations, e.g. protective coatings · CPC title

• H10W72/9445

  Top-view layouts, e.g. mirror arrays · CPC title

• H10W72/932

  Plan-view shape, i.e. in top view · CPC title