Au-containing layer for charged particle beam processing

Patent metadata

Field	Value
Publication number	US-9617641-B2
Application number	US-81428310-A
Country	US
Kind code	B2
Filing date	Jun 11, 2010
Priority date	Jun 12, 2009
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

The invention provides a method for providing an Au-containing layer onto a surface of a work piece, which method comprises:
providing 510 a deposition fluid comprising Au(CO)Cl; depositing 520 the fluid on at least part of the surface of the work piece; and directing 530 a charged particle beam toward the surface of the work piece onto which at least part of the fluid is deposited to decompose Au(CO)Cl thereby forming the Au-containing layer on the surface of the work piece.

By using Au(CO)Cl as a precursor for charged particle induced deposition, a gold Au layer may be deposited with a very high purity compared to methods known in the art.

First claim

I claim as follows:

1. A method for providing an Au-containing layer onto a surface of a work piece, the method comprising:
providing a deposition fluid comprising Au(CO)Cl;
adsorbing the deposition fluid on at least part of the surface of the work piece; and
directing a charged particle beam toward the surface of the work piece onto which at least part of the deposition fluid is deposited to decompose Au(CO)Cl, thereby forming the Au-containing layer on the surface of the work piece.

2. The method according to claim 1 , wherein the deposition of the deposition fluid is carried out at a pressure of less than 10 −5 mbar.

3. The method according to claim 1 , wherein the deposition is carried out in a high-vacuum chamber.

4. The method according to claim 1 , wherein the charged particle beam is an ion beam or an electron beam.

5. The method according to claim 1 , wherein the charged particle beam is configured to transfer a pattern to the surface in the Au-containing layer.

6. The method according to claim 5 , wherein the charged particle beam is a pencil beam and the pattern is formed by scanning the pencil beam over the surface in a predetermined sequence.

7. The method according to claim 5 , wherein a mask is provided to intersect the charged particle beam, whereby an intensity of the charged particle beam is modulated in correspondence with a pattern on the mask.

8. The method according to claim 5 , wherein the pattern transferred to the surface comprises features smaller than 100 nm.

9. The method according to claim 5 , wherein the pattern transferred to the surface comprises features smaller than 50 nm.

10. The method according to claim 5 , wherein the pattern transferred to the surface comprises features smaller than 10 nm.

11. The method according to claim 1 , wherein forming the Au-containing layer on the surface of the work piece comprises forming an Au-containing layer comprising greater than or equal to 80 atomic percent Au.

12. A system for providing an Au-containing layer onto a surface of a work piece, the system comprising:
a work piece holder, configured to position the surface of the work piece at an irradiation position;
a charged particle source, configured to provide a charged particle beam to the irradiation position;
Au(CO)Cl precursor;
a fluid injector, configured to provide a deposition fluid comprising the Au(CO)Cl precursor to the irradiation position; and
a computer loaded with a computer program that, when executed, directs the system to carry out a method of charged-particle-beam induced deposition that causes the formation of a layer of Au, wherein the method comprises:
injecting the deposition fluid toward the irradiation position using the fluid injector, wherein the deposition fluid is provided to the irradiation position at a desired partial pressure;
adsorbing at least part of the deposition fluid onto the surface of the work piece at the irradiation position; and
decomposing the adsorbed Au(CO)Cl precursor by irradiating the work piece at the irradiation position with the charged particle beam.

13. The system according to claim 12 , wherein the fluid injector comprises a reservoir containing the deposition fluid.

14. The system according to claim 12 further comprising a reservoir containing the Au(CO)Cl precursor.

15. The system according to claim 12 , wherein the Au(CO)Cl precursor is a powder, wherein the fluid injector is configured to provide the deposition fluid to the irradiation position by injecting the deposition fluid toward the irradiation position, and wherein the fluid injector is configured to heat the powder to a temperature such that the Au(CO)Cl precursor will flow when deposition fluid is injected toward the irradiation position.

16. The system according to claim 15 , wherein the fluid injector is positioned at a distance of less than 1 mm from the irradiation position.

17. The system according to claim 12 , wherein computer program that, when executed, directs the system to carry out a method of electron beam induced deposition that causes the formation of a layer of greater than or equal to 80 atomic percent Au.

Assignees

• Mulders Johannes Jacobus Lambertus
• Fei Co

Inventors

• Mulders Johannes Jacobus Lambertus

Classifications

• C23C16/487

  using electron radiation · CPC title

• C23C16/047 Primary

  using irradiation by energy or particles · CPC title

• C23C16/486

  using ion beam radiation · CPC title

• C23C16/06

  characterised by the deposition of metallic material · CPC title

• C23C16/18

  from metallo-organic compounds · CPC title