Organic-inorganic hybrid resin, molding composition, and photoelectric device employing the same

Patent metadata

Field	Value
Publication number	US-9617411-B2
Application number	US-201514596693-A
Country	US
Kind code	B2
Filing date	Jan 14, 2015
Priority date	Jan 15, 2014
Publication date	Apr 11, 2017
Grant date	Apr 11, 2017

Abstract

An organic-inorganic hybrid resin, a molding composition, and a photoelectric device employing the same are disclosed. The organic-inorganic hybrid resin is a reaction product of a composition, wherein the composition includes: 0.1-10 parts by weight of reactant (a), and 100 parts by weight of reactant (b). In particular, the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and the metal oxide cluster includes Ti, Zr, Zn, or a combination thereof. The reactant (b) includes an epoxy resin.

First claim

What is claimed is:

1. An organic-inorganic hybrid resin, which is a reaction product of a first composition, wherein the first composition comprises:
0.1-10 parts by weight of reactant (a), wherein the reactant (a) is a silsesquioxane prepolymer with metal oxide clusters, and wherein the metal oxide cluster comprises titanium, zirconium, zinc, or combination thereof; and
100 parts by weight of reactant (b), wherein the reactant (b) comprises siloxane-modified resin having a structure represented by Formula (IV):

wherein R 1 is independently C 1-10 alkyl; R 5 is independently C 1-10 alkyl, or phenyl; R 6 is epoxycyclohexylethyl, or epoxycyclohexylpropyl; R 7 is independently C 1-10 alkyl, epoxycyclohexylethyl, or epoxycyclohexylpropyl; and, 1≦c≦150, and 0≦d≦15, wherein, when d is greater than 0, c/d is between 1 and 10; and when d is equal to 0, at least one R 7 is epoxycyclohexylethyl, or epoxycyclohexylpropyl.

2. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the composition further comprises:
1-35 parts by weight of reactant (c), wherein the reactant (c) is an anhydride.

3. The organic-inorganic hybrid resin as claimed in claim 2 , wherein the reactant (c) comprises succinic anhydride, maleic anhydride, phthalic anhydride (PA), tetrahydrophthalic anhydride (THPA), hexahydrophthalic anhydride (HHPA), methyltetrahydrophthalic anhydride (MTHPA), methyl hexahydrophthalic anhydride (MHHPA), or a combination thereof.

4. The organic-inorganic hybrid resin as claimed in claim 2 , wherein the equivalence ratio between an anhydride group of the reactant (c) and an epoxy group of the reactant (b) is between 0.001 and 0.5.

5. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the reactant (a) is a reaction product of a second composition, wherein the second composition comprises:
1-10 parts by weight of reactant (d), wherein the reactant (d) has a structure represented by Formula (I):

wherein R 1 is independently C 1-10 alkyl, and n is a positive integer from 4 to 31;
100 parts by weight of reactant (e), wherein the reactant (e) is titanium alkoxide, zirconium alkoxide, zinc alkoxide, or a combination thereof; and
5-20 parts by weight of reactant (f), wherein the reactant (f) has a structure represented by Formula (II):

wherein R 2 is independently C 1-3 alkoxy, and R 3 is C 3-12 epoxy group, C 3-12 acrylate group, C 4-12 alkylacryloxy group, or C 3-12 alkenyl group.

6. The organic-inorganic hybrid resin as claimed in claim 5 , wherein the reactant (e) comprises zirconium ethoxide, zirconium isopropoxide, zirconium n-propoxide, zirconium n-butoxide, zirconium tert-butoxide, zinc ethoxide, zinc isopropoxide, zinc n-proxide, zinc n-butoxide, zinc tert-butoxide, titanium ethoxide, isopropanol titanium, titanium n-propoxide, titanium n-butoxide, titanium tert-butoxide, or a combination thereof.

7. The organic-inorganic hybrid resin as claimed in claim 5 , wherein the reactant (f)comprises 2-(3,4-epoxycyclohexyl)-ethyltrimethoxysilane, 3-glycidoxypropyltrimethoxysilane, 3-glycidoxypropyl methoxydiethoxysilane, 3-glycidoxypropyl triethoxysilane, 3-methacryloxypropyl trimethoxysilane, 3-methacryloxypropyl triethoxysilane, or 3-acryloxypropyl trimethoxysilane.

8. The organic-inorganic hybrid resin as claimed in claim 5 , wherein the second composition further comprises:
3-10 parts by weight of reactant (g), wherein the reactant (g) is water, ammonium hydroxide, or a combination thereof.

9. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the reactant (a) has weight-average molecular weight distribution between 2500 g/mol and 7800 g/mol.

10. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the reactant (a) has a structure represented by Formula (III):

wherein R 1 is independently C 1-10 alkyl; n is a positive integer from 4 to 31; and, Y is (MO 4/2 ) l [(MO) (4-a)/2 M(OH) a/2 ] m [MO (4-b)/2 M(OZ) b/2 ] p , wherein, M is metal element; 1 is a positive integer from 5 to 20; m is a positive integer from 2 to 8; p is a positive integer from 2 to 5; a is a positive integer from 1 to 2, b is a positive integer from 1 to 2; and, Z is —SiR 3 (R 4 ) 2 , wherein R 3 is independently C 3-12 epoxy group, C 3-12 acrylate group, C 4-12 alkylacryloxy group, or C 3-12 alkenyl group; and, R 4 is independently hydroxyl, or C 1-3 alkoxy.

11. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the reactant (b) comprises the siloxane-modified resin having the structure represented by Formula (IV) and one or more of triglycidyl isocyanurate epoxy resin, hydrogenated epoxy resin, and alicyclic epoxy resin.

12. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the siloxane-modified resin has a weight-average molecular weight between 400 and 10000.

13. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the reactant (b) further comprises triglycidyl isocyanurate epoxy resin, hydrogenated epoxy resin, alicyclic epoxy resin, or a combination thereof.

14. The organic-inorganic hybrid resin as claimed in claim 1 , wherein the organic-inorganic hybrid resin has a melting point higher than 50° C., and the organic-inorganic hybrid resin has a melt viscosity between 100 mPa·s and 10,000 mPa·s at a range of 80 ° C. to 120 ° C.

15. A molding composition, comprising:
the organic-inorganic hybrid resin as claimed in claim 1 ;
an inorganic filler;
a hardener; and
a white pigment.

16. The molding composition as claimed in claim 15 , wherein the inorganic filler comprises silicon oxide, aluminum hydroxide, magnesium hydroxide, magnesium carbonate, barium carbonate, or a combination thereof.

17. The molding composition as claimed in claim 15 , wherein the white pigment comprises titanium oxide, aluminum oxide, magnesium oxide, zirconium oxide, calcium carbonate, zinc sulfide, zinc oxide, or a combination thereof.

18. The molding composition as claimed in claim 15 , wherein the hardener is a solid non-aromatic anhydride.

19. The molding composition as claimed in claim 15 , wherein the hardener comprises tetrahydrophthalic anhydride (THPA), hexahydrophthalic anhydride (HHPA), maleic anhydride, or a combination thereof.

20. The molding composition as claimed in claim 15 , wherein the inorganic filler and the white pigment are present in an amount between 30 wt % and 84 wt %, based on the weight of the molding composition.

21. The molding composition as claimed in claim 15 , wherein the weight ratio between the white pigment and the inorganic filler is between 0.1 and 0.5.

22. The molding composition as claimed in claim 15 , wherein the organic-inorganic hybrid resin is present in an amount between 11 and 15 wt %, based on the weight of the molding composition.

23. The molding composition as claimed in claim 15 , wherein the hardener is present in an amount between 3 wt % and 15 wt %, based on the weight of the molding composition.

24. The molding composition as claimed in claim 15 , furthe

Assignees

• Ind Tech Res Inst

Inventors

• Chan Ying-Nan
• Huang Shu-Chen
• Chen Wen-Bin
• Chen Kai-Chi
• Lin Chih-Hao
• Li Hsun-Tien

Classifications

• C08G77/14

  containing silicon bound to oxygen-containing groups · CPC title

• C08G77/045

  containing less than 25 silicon atoms · CPC title

• C08G77/58 Primary

  Metal-containing linkages · CPC title

• C08L63/00 Primary

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C08L2203/20

  use in electrical or conductive gadgets · CPC title