Pad design for electrostatic chuck surface

US9613846B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9613846-B2
Application numberUS-201414550106-A
CountryUS
Kind codeB2
Filing dateNov 21, 2014
Priority dateNov 22, 2013
Publication dateApr 4, 2017
Grant dateApr 4, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.

First claim

Opening claim text (preview).

The invention claimed is: 1. An electrostatic chuck, comprising: a chuck surface; and a pattern of bumps on the chuck surface, the pattern comprising: a serpentine bump at a central region of the chuck surface; and a first group of bumps with three sub-groups spaced at equal angular distance around a periphery of the chuck. 2. The electrostatic chuck of claim 1 , wherein the pattern of bumps further comprises a second group of bumps with three sub-groups, each sub-group of the second group of bumps disposed between two sub-groups of the first group of bumps. 3. The electrostatic chuck of claim 2 , wherein the pattern of bumps further comprises a plurality of elongated bumps arranged in concentric rings. 4. The electrostatic chuck of claim 3 , wherein the serpentine bump has a central straight portion and two outer curved portions, and the pattern of bumps further comprises a group of round bumps in two sub-groups, one sub-group on either side of the central straight portion of the serpentine bump. 5. The electrostatic chuck of claim 4 , further comprising a plurality of elongated bumps between the second group of bumps and the serpentine bump. 6. The electrostatic chuck of claim 5 , wherein the bumps of the plurality of bumps between the second group of bumps and the serpentine bump are curved, radially aligned, and arranged in concentric rings. 7. The electrostatic chuck of claim 4 , wherein the plurality of bumps between the second group of bumps and the serpentine bump has a radial extent between about 22% and about 70% of a radius of the electrostatic chuck. 8. The electrostatic chuck of claim 4 , wherein the round bumps are between the central straight portion of the serpentine bump and the outer curved portions of the serpentine bump. 9. The electrostatic chuck of claim 1 , wherein the serpentine bump has a central straight portion and two outer curved portions.

Assignees

Inventors

Classifications

  • H10P72/72Primary

    using electrostatic chucks · CPC title

  • characterised by a plurality of individual support members, e.g. support posts or protrusions · CPC title

  • Slit or elongated · CPC title

  • Noncircular aperture [e.g., slit, diamond, rectangular, etc.] · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9613846B2 cover?
Embodiments are directed to an electrostatic chuck surface having minimum contact area features. More particularly, embodiments of the present invention provide an electrostatic chuck assembly having a pattern of raised, elongated surface features for providing reduced particle generation and reduced wear of substrates and chucking devices.
Who is the assignee on this patent?
Applied Materials Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/72. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Apr 04 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).