Process for the removal of polymer thermosets from a substrate

Patent metadata

Field	Value
Publication number	US-9611450-B2
Application number	US-201113814095-A
Country	US
Kind code	B2
Filing date	Aug 5, 2011
Priority date	Aug 5, 2010
Publication date	Apr 4, 2017
Grant date	Apr 4, 2017

Abstract

The present invention relates to a process for the removal of polymer thermosets from the substrates without damaging the substrates. The present invention relates to a process for the removal of polymer thermoset from the substrate retaining the physical and chemical properties of the substrates. The present invention more particularly relates to the use of bio molecules for cleaving polymer thermosets and the process to perform the cleaving.

First claim

The invention claimed is:

1. A process for the removal of polymer thermoset from a substrate by using cleaving agent without damaging the substrate and the said process comprising the steps of:
i. providing a polymer thermoset coated substrate, wherein polymer thermoset is an epoxy resin containing cross linker having at least one S—S bond,
ii. preparing 10 to 50% cleaving agent solution in a solvent, wherein the cleaving agent comprises biomolecules,
iii. removing the polymer thermoset by dipping the substrate as provided in step (i) in cleaving agent solution as prepared in step (ii) for a period in the range of 2 to 6 h at a temperature in the range of 20° C. to 100° C. to obtain the substrate on the removal of polymer thermoset.

2. The process as claimed in claim 1 , wherein the cross linker is cystamine.

3. The process as claimed in claim 1 , wherein bio molecules comprises peptides, proteins or enzymes or combinations thereof.

4. The process as claimed in claim 1 , wherein biomolecules are selected from the group consisting of glutathione, thioredoxin, peroxiredoxin or dithiothreitol (DTT) or combination thereof.

5. The process as claimed in claim 1 , wherein substrate used in step (i) are made of material selected from the group of materials consisting of glass, silicon, ITO (Indium-doped Tin Oxide) coated glass, metal, metal alloy, semi conductor and polymers.

6. The process as claimed in claim 1 , wherein solvent is water, methanol, ethanol, chloroform or acetonitrile or combinations thereof.

7. A method of removing polymer thermosets from a substrate, comprising:
applying biomolecules to the substrate which comprises peptides, proteins, enzymes glutathione, thioredoxin, peroxiredoxin or dithiothreitol (DTT) or combination thereof thereby removing polymer thermosets from the substrate, without damaging the substrate, wherein polymer thermoset is an epoxy resin containing cross linker having at least one S—S bond.

Assignees

• Kothandam Krishnamoorthy
• Council Scient Ind Res

Inventors

• Kothandam Krishnamoorthy

Classifications

• C11D3/386

  Preparations containing enzymes {, e.g. protease or amylase} · CPC title

• Y02P20/582

  Recycling of unreacted starting or intermediate materials · CPC title

• C11D7/3263 Primary

  Amides or imides · CPC title

• C11D3/38

  Products with no well-defined composition {, e.g. natural products} · CPC title

• C09D9/005 Primary

  containing organic solvents · CPC title