Printed circuit board and electronic apparatus

Patent metadata

Field	Value
Publication number	US-9609741-B1
Application number	US-201615272201-A
Country	US
Kind code	B1
Filing date	Sep 21, 2016
Priority date	Sep 24, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A printed wiring board has thereon an electronic component having a heat radiation pad, and an electrolytic capacitor provided for the electronic component. The printed wiring board further has thereon another electronic component having another heat radiation pad and exhibiting a higher heat value than that of the electronic component, and another electrolytic capacitor provided for the other electronic component. The heat radiation pad of the electronic component, a ground terminal of the electrolytic capacitor, the other heat radiation pad for the other electronic component, and another ground terminal of the other electrolytic capacitor are connected by using a ground conductor. In the ground conductor, a thermal resistance between the other heat radiation pad and other ground terminal is lower than the thermal resistance between the heat radiation pad and the ground terminal.

First claim

What is claimed is:

1. A printed circuit board comprising:
a printed wiring board;
a first electronic component having a first heat radiation pad;
a first circuit component provided for the first electronic component and having a first terminal;
a second electronic component having a second heat radiation pad and generating heat exhibiting a higher heat value than that of the first electronic component;
a second circuit component provided for the second electronic component and having a second terminal; and
a conductor provided on the printed wiring board and having a conductor pattern part,
wherein the first electronic component, the first circuit component, the second electronic component, and the second circuit component are mounted on the printed wiring board, the first heat radiation pad of the first electronic component, the first terminal of the first circuit component, the second heat radiation pad of the second electronic component, and the second terminal of the second circuit component are connected through the conductor; and
a thermal resistance between the second heat radiation pad and the first terminal is lower than a thermal resistance between the first heat radiation pad and the first terminal.

2. The printed circuit board according to claim 1 , wherein the conductor pattern part has a first conductor pattern including a first projected region acquired by projecting the first heat radiation pad in a direction perpendicular to a surface of the printed wiring board, and a second conductor pattern including a second projected region acquired by projecting the second heat radiation pad and a third projected region acquired by projecting the first terminal in the direction perpendicular to the surface of the printed wiring board; and
the first conductor pattern and the second conductor pattern are connected by using a connection conductor provided such that the thermal resistance between the first heat radiation pad and the first terminal can be higher than the thermal resistance between the second heat radiation pad and the first terminal.

3. The printed circuit board according to claim 2 , wherein
the first conductor pattern and the second conductor pattern are provided on a same layer in the printed wiring board; and
the connection conductor is a third conductor pattern narrower than the first conductor pattern and the second conductor pattern provided on the same layer.

4. The printed circuit board according to claim 3 , wherein a notch is provided between the first conductor pattern and the second conductor pattern such that the first conductor pattern and the second conductor pattern can be connected through the third conductor pattern.

5. The printed circuit board according to claim 4 , wherein the notch is provided between the first electronic component and the first circuit component, viewed from the direction perpendicular to the surface of the printed wiring board.

6. The printed circuit board according to claim 2 , wherein
the first conductor pattern and the second conductor pattern are provided on different layers in the printed wiring board; and
the connection conductor is a via conductor provided in the printed wiring board.

7. The printed circuit board according to claim 1 , wherein the first and second circuit components are passive elements.

8. The printed circuit board according to claim 7 , wherein the passive elements are aluminum electrolytic capacitors.

9. The printed circuit board according to claim 1 , wherein the conductor is a ground conductor, and the first terminal and the second terminal are ground terminals connected to the ground conductor.

10. The printed circuit board according to claim 9 , wherein the first electronic component has a power supply terminal connected to a power supply terminal of the first circuit component by using a first power supply conductor provided on the printed wiring board, and the second electronic component has a power supply terminal connected to a power supply terminal of the second circuit component by using a second power supply conductor provided on the printed wiring board.

11. The printed circuit board according to claim 1 , wherein the first electronic component and the first circuit component are mounted on mutually different surfaces or a same surface of the printed wiring board.

12. The printed circuit board according to claim 1 , wherein the second electronic component and the second circuit component are mounted on mutually different surfaces or a same surface of the printed wiring board.

13. An electronic apparatus comprising the printed circuit board according to claim 1 .

Assignees

• Canon Kk

Inventors

• Noguchi Koji

Classifications

• H05K2201/06

  Thermal details · CPC title

• H05K2201/10545

  Related components mounted on both sides of the PCB · CPC title

• H05K2201/10015

  Non-printed capacitor · CPC title

• H05K2201/09227

  Layout details of a plurality of traces, e.g. escape layout for Ball Grid Array [BGA] mounting · CPC title

• H05K1/181

  associated with surface mounted components · CPC title