Multi-chip semiconductor package with via components and method for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9607967-B1
Application number	US-201514977645-A
Country	US
Kind code	B1
Filing date	Dec 22, 2015
Priority date	Nov 4, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A multi-chip semiconductor package includes a lower RDL interposer, a first chip on the lower RDL interposer within a chip mounting area, via components mounted within a peripheral area, and a first molding compound surrounding the first chip and the via components. Each of the via components comprises a substrate portion and a connection portion coupled to the substrate portion. An upper RDL interposer is integrally constructed on the first chip, on the via components, and on the first molding compound. The upper RDL interposer is electrically connected to the connection portion of each of the via components. A second chip is mounted on the upper RDL interposer. A second molding compound surrounds the second chip.

First claim

What is claimed is:

1. A multi-chip semiconductor package, comprising:
a lower RDL interposer having a first side, a second side opposite to the first side, and a first sidewall surface extending between the first side and the second side;
a first chip mounted on the first side within a chip mounting area of the lower RDL interposer;
a plurality of via components mounted on the first side only within a peripheral area being adjacent to the chip mounting area of the lower RDL interposer, wherein the via components and the first chip are coplanar, wherein each of the via components comprises a substrate portion and a connection portion coupled to the substrate portion;
a first molding compound disposed on the first side, the first molding compound surrounding the first chip and the via components, wherein the first molding compound has a second sidewall surface;
a plurality of solder bumps mounted on the second side of the lower RDL interposer;
an upper RDL interposer being integrally constructed on the first chip, the via components, and on the first molding compound and being electrically connected to the connection portion of each of the via components, wherein the upper RDL interposer has a third sidewall surface, and wherein there is no air gap disposed between the upper RDL interposer and the lower RDL interposer;
a second chip mounted on the upper RDL interposer; and
a second molding compound surrounding the second chip, wherein the second molding compound has a fourth sidewall surface, and wherein the first sidewall surface, the second sidewall surface, the third sidewall surface, and the fourth sidewall surface are contiguous and flush with one another.

2. The multi-chip semiconductor package according to claim 1 , wherein the substrate portion comprises silicon, glass, ceramic, or metal.

3. The multi-chip semiconductor package according to claim 1 , wherein the connection portion comprises a dielectric stack and metal vias embedded in the dielectric stack.

4. The multi-chip semiconductor package according to claim 1 , wherein each of the via components has a cubic shaped or a rectangular parallelepiped structure.

5. The multi-chip semiconductor package according to claim 1 , wherein the substrate portion is in direct contact with the connection portion.

6. The multi-chip semiconductor package according to claim 1 , wherein the first chip is electrically connected to the lower RDL interposer through a plurality of first bumps, and the connection portion is electrically connected to the lower RDL interposer through a plurality of second bumps.

7. The multi-chip semiconductor package according to claim 1 , wherein the second molding compound has a glass transition temperature that is lower than that of the first molding compound.

8. The multi-chip semiconductor package according to claim 1 , wherein the via components are disposed only along three sides, only along two opposite sides, or only along two adjacent sides of the chip within the peripheral area.

9. The multi-chip semiconductor package according to claim 1 , wherein the via components comprise TSV chips.

10. The multi-chip semiconductor package according to claim 1 further comprising a dummy component disposed on the upper RDL interposer.

11. The multi-chip semiconductor package according to claim 3 , wherein the dielectric stack comprises an organic material.

12. The multi-chip semiconductor package according to claim 3 , wherein the dielectric stack comprises an inorganic material.

13. The multi-chip semiconductor package according to claim 3 , wherein each of the via component further comprises a metal shielding layer in the dielectric stack.

14. The multi-chip semiconductor package according to claim 11 , wherein the organic material comprises polyimide (PI), polybenzoxazole (PBO), or benzocyclobuten (BCB).

15. The multi-chip semiconductor package according to claim 12 , wherein the inorganic material comprises silicon oxide, silicon nitride, or silicon oxy-nitride.

16. The multi-chip semiconductor package according to claim 6 , wherein the substrate portion is mounted onto the lower RDL interposer through a plurality of third bumps.

17. The multi-chip semiconductor package according to claim 16 , wherein the second chip is mounted onto the upper RDL interposer through a plurality of fourth bumps.

18. The multi-chip semiconductor package according to claim 10 , wherein the dummy component comprises a metal bar, a pattern, or a dummy chip.

19. The multi-chip semiconductor package according to claim 10 , wherein the dummy component comprises silicon.

Assignees

• Inotera Memories Inc

Inventors

• Shih Shing-Yih

Classifications

• H10W74/142

  the encapsulations exposing the passive side of the semiconductor body · CPC title

• H10W70/63

  Vias, e.g. via plugs · CPC title

• H10W72/0198

  batch processes · CPC title

• H10W90/297

  characterised by the through-semiconductor vias [TSVs] in the stacked chips · CPC title

• H10W42/271

  the arrangements being between stacked chips · CPC title