Heat treatment apparatus and heat treatment method for heating substrate by irradiating substrate with flash of light

Patent metadata

Field	Value
Publication number	US-9607870-B2
Application number	US-201314142991-A
Country	US
Kind code	B2
Filing date	Dec 30, 2013
Priority date	Jan 24, 2013
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A flash heating part in a heat treatment apparatus includes 30 built-in flash lamps, and irradiates a semiconductor wafer held by a holder in a chamber with a flash of light. Thirty switching elements are provided in a one-to-one correspondence with the 30 flash lamps. Each of the switching elements defines the waveform of current flowing through a corresponding one of the flash lamps by intermittently supplying electrical charge thereto. Radiation thermometers measure an in-plane temperature distribution of the semiconductor wafer during flash irradiation. Based on the results of measurement with the radiation thermometers, a controller individually controls the operations of the 30 switching elements to individually define the light emission patterns of the 30 flash lamps.

First claim

What is claimed is:

1. A heat treatment apparatus for heating a substrate by irradiating the substrate with a flash of light, comprising:
a chamber for receiving a substrate therein;
a holder for holding the substrate in said chamber;
a plurality of flash lamps for irradiating the substrate held by said holder with a flash of light;
a plurality of switching elements provided in a one-to-one correspondence with said flash lamps and each defining the waveform of current flowing through a corresponding one of said flash lamps; and
a light emission controller for individually controlling the operations of said switching elements to individually define the light emission patterns of said flash lamps;
further comprising a plurality of illuminance sensors for measuring the illuminances of different regions, respectively, of the arrangement of said flash lamps, wherein
said light emission controller controls the operations of said switching elements, based on results of measurement with said illuminance sensors.

2. The heat treatment apparatus according to claim 1 , further comprising:
a plurality of capacitors provided in a one-to-one correspondence with said flash lamps and each supplying electrical charge to a corresponding one of said flash lamps; and
a plurality of charging parts provided in a one-to-one correspondence with said capacitors and charging said capacitors with individual voltages, and
wherein said light emission controller controls the charging voltages of said charging parts individually, based on results of measurement with said illuminance sensors.

3. A method of heating a substrate by irradiating the substrate with a flash of light, the method comprising the step of
individually controlling the operations of a plurality of switching elements provided in a one-to-one correspondence with a plurality of flash lamps for emitting a flash of light and each defining the waveform of current flowing through a corresponding one of said flash lamps, to individually define the light emission patterns of said flash lamps,
wherein the operations of said switching elements are controlled, based on results of measurement of illuminances of different regions, respectively, of the arrangement of said flash lamps.

4. The method according to claim 3 , wherein
charging voltages to a plurality of capacitors provided in a one-to-one correspondence with said flash lamps and each supplying electrical charge to a corresponding one of said flash lamps are individually controlled, based on said results of measurement of the illuminances.

Assignees

• Dainippon Screen Mfg
• Screen Holdings Co Ltd

Inventors

• Kiyama Hiroki

Classifications

• H10P95/90

  Thermal treatments, e.g. annealing or sintering · CPC title

• H10P74/238

  comprising acting in response to an ongoing measurement without interruption of processing, e.g. endpoint detection or in-situ thickness measurement · CPC title

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• H01L21/67115

  Electricity · mapped topic