Adaptive pattern generation

Patent metadata

Field	Value
Publication number	US-9607367-B2
Application number	US-201214382352-A
Country	US
Kind code	B2
Filing date	Apr 20, 2012
Priority date	Apr 20, 2012
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

Embodiments of the present invention provide systems and method for adaptively generating a pattern for fabricating semiconductor devices, the method comprising obtaining image data of a surface, and dynamically modifying a pattern to be applied to the surface based on the obtained image data.

First claim

The invention claimed is:

1. A method of adaptively generating a pattern for fabricating devices on a surface, the method comprising:
for each layer of a plurality of layers of the devices, as a current layer:
in an offline stage, prior to fabricating the current layer of the devices on the surface, modifying a pattern of the current layer to align with a pattern of any prior layer of the devices previously fabricated on the surface and to account for any previously identified defects on the surface;
in a realtime stage:
obtaining image data of the surface;
identifying defects on the surface from the image data;
dynamically modifying the pattern of the current layer to account for the identified defects that were not previously identified; and
fabricating the current layer of the devices on the surface according to the pattern of the current layer as has been modified in the offline stage and as has further been dynamically modified in the realtime stage.

2. The method of claim 1 wherein fabricating the current layer of the devices on the surface comprises direct-writing the current layer according to the pattern of the current layer as has been modified in the offline stage and as has further been dynamically modified in the realtime stage.

3. The method of claim 1 , wherein the devices comprise at least one of: a semiconductor device; a passive electronic device; a logic block; a MEMS device; a photonic device; and a fluidic device.

4. The method of claim 1 , wherein obtaining image data of the surface comprises capturing image data of the surface using an imaging system.

5. The method of claim 4 , wherein the imaging system comprises an imaging laser scanning the surface at an infra-red wavelength.

6. The method of claim 1 , wherein the surface comprises a surface of a polymer film.

7. A system for adaptively generating a pattern for fabricating devices on a surface, the system comprising:
an imaging system for obtaining image data of the surface; and
a processor to:
for each layer of a plurality of layers of the devices, as a current layer:
in an offline stage, prior to fabricating the current layer of the devices on the surface, modify a pattern of the current layer to align with a pattern of any prior layer of the devices previously fabricated on the surface and to account for any previously identified defects on the surface;
in a realtime stage:
obtain image data of the surface;
identify defects on the surface from the image data;
dynamically modify the pattern of the current layer to account for the identified defects that were not previously identified; and
fabricate the current layer of the devices on the surface according to the pattern of the current layer as has been modified in the offline stage and as has further been dynamically modified in the realtime stage.

8. The system of claim 7 , wherein the system is configured to operate at a rate between 1 and 7 Gpixels/s.

9. The system of claim 7 , wherein the imaging system comprises an imaging laser configured to scan the surface at an infra-red wavelength.

10. The system of claim 7 , wherein the surface comprises a surface of a polymer film.

Assignees

• Rudin John Christopher
• Hewlett Packard Development Co Lp

Inventors

• Rudin John Christopher

Classifications

• G01N21/956

  Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)} · CPC title

• G01N21/3563

  for analysing solids; Preparation of samples therefor · CPC title

• G06T7/0004 Primary

  Industrial image inspection · CPC title

• G03F7/704 Primary

  Scanned exposure beam, e.g. raster-, rotary- and vector scanning (mask projection exposure involving relative movement of patterned beam and workpiece during imaging G03F7/70358) · CPC title

• G01N2021/8854

  Grading and classifying of flaws · CPC title