High throughput test handler system

Patent metadata

Field	Value
Publication number	US-9606171-B2
Application number	US-201514607696-A
Country	US
Kind code	B2
Filing date	Jan 28, 2015
Priority date	Jan 28, 2015
Publication date	Mar 28, 2017
Grant date	Mar 28, 2017

Abstract

A test handler comprises a main rotary turret and a loading station operative to convey electronic components to functional modules of the main rotary turret. An auxiliary rotary turret incorporating multiple carrier modules then receives electronic components from the functional modules of the main rotary turret. Multiple testing stations located along a periphery of the auxiliary turret are operative to receive electronic components from the carrier modules for testing while the loading station is concurrently conveying electronic components to the functional modules of the main rotary turret, so that the impact of transfer time is reduced or eliminated in a test process cycle of the test handler.

First claim

The invention claimed is:

1. A test handler comprising:
a main rotary turret;
a loading station operative to convey electronic components to functional modules of the main rotary turret;
an auxiliary rotary turret incorporating multiple carrier modules for receiving electronic components from the functional modules of the main rotary turret; and
multiple testing stations located along a periphery of the auxiliary turret, each testing station further comprising pick heads for transferring electronic components between the carrier modules of the auxiliary rotary turret and a test platform of the testing station for testing;
wherein the testing stations are operative to receive electronic components from the carrier modules of the auxiliary rotary turret for testing while the loading station is concurrently conveying electronic components to the functional modules of the main rotary turret.

2. The test handler as claimed in claim 1 , wherein each of the testing stations is configured to conduct a same type of test on the electronic components as another testing station.

3. The test handler as claimed in claim 1 , wherein the pick heads comprise a pair of reciprocating pick heads arranged about a rotary driver.

4. The test handler as claimed in claim 3 , wherein the pick heads are separated by an angle of 180 degrees from each other, and are alternatively positioned either over the carrier modules or over the test platform.

5. The test handler as claimed in claim 3 , further comprising a vertical driver coupled to each pick head which is configured to lower the pick head to pick up an electronic component at a first position, and to raise the pick head before the pick head is rotated for transferring the electronic components to a second position.

6. The test handler as claimed in claim 1 , further comprising:
a further auxiliary rotary turret having a further set of multiple carrier modules; and
a further set of multiple testing stations located along a periphery of the further auxiliary turret for testing the electronic components.

7. The test handler as claimed in claim 6 , wherein the further set of multiple carrier modules is configured to receive electronic components from the main rotary turret.

8. The test handler as claimed in claim 7 , wherein the further set of multiple testing stations conducts a same type of test on the electronic components as the multiple testing stations of the auxiliary turret.

9. The test handler as claimed in claim 6 , wherein the further set of multiple carrier modules is configured to receive electronic components from the auxiliary rotary turret.

10. A method for testing electronic components using a test handler, comprising the steps of:
conveying electronic components from a loading station to functional modules of a main rotary turret;
transferring electronic components from the functional modules of the main rotary turret to multiple carrier modules of an auxiliary rotary turret; and
conveying the electronic components to multiple testing stations located along a periphery of the auxiliary turret;
using pick heads comprised in the multiple testing stations to transfer electronic components from the carrier modules of the auxiliary rotary turret to respective test platforms of the testing stations; and thereafter
testing the electronic components received from the carrier modules at the testing platforms of the multiple testing stations while concurrently continuing to convey electronic components from the loading station to the functional modules of the main rotary turret.

11. The method for testing electronic components as claimed in claim 10 , wherein each of the testing stations conducts a same type of test on the electronic components as another testing station.

12. The method for testing electronic components as claimed in claim 10 , further comprising the step of testing the electronic components while the auxiliary rotary turret continues to receive additional electronic components during testing of other electronic components.

13. The method for testing electronic components as claimed in claim 10 , further comprising the steps of:
transferring electronic components to a further auxiliary rotary turret including a further set of multiple carrier modules and a further set of multiple testing stations located along a periphery of the further auxiliary turret; and
testing the electronic components at the further set of multiple testing stations.

14. The method for testing electronic components as claimed in claim 13 , wherein the further set of multiple carrier modules receives electronic components from the main rotary turret.

15. The method for testing electronic components as claimed in claim 14 , wherein the further set of multiple testing stations conducts a same type of test on the electronic components as the multiple testing stations of the auxiliary turret.

16. The method for testing electronic components as claimed in claim 13 , wherein the further set of multiple carrier modules receives electronic components from the multiple carrier modules of the auxiliary rotary turret.

Assignees

• Asm Tech Singapore Pte Ltd

Inventors

• Cheung Yu Sze
• Lau Kai Fung

Classifications

• G01R31/2893 Primary

  Handling, conveying or loading, e.g. belts, boats, vacuum fingers (G01R31/2867 takes precedence; handling semiconductor devices or wafers during manufacture or treatment H10P72/00) · CPC title