Method of manufacturing flexible circuit substracts

Patent metadata

Field	Value
Publication number	US-9358789-B2
Application number	US-201313973273-A
Country	US
Kind code	B2
Filing date	Aug 22, 2013
Priority date	Dec 7, 2011
Publication date	Jun 7, 2016
Grant date	Jun 7, 2016

Abstract

A method of manufacturing a flexible circuit, including forming a first set of traces, forming a second set of traces, and cutting a gap between the first and second set of traces.

First claim

What is claimed is:

1. A method of manufacturing a flexible circuit, comprising:
forming a first set of traces on a flexible substrate;
forming a second set of traces on the flexible substrate;
connecting the first set of traces to a negative voltage supply; and
connecting the second set of traces to a positive voltage supply; and
cutting a gap in the flexible substrate between the first and second set of traces, the gap positioned to form an arc-break.

2. The method of claim 1 , wherein cutting the gap comprises using a laser to cut the gap.

3. The method of claim 1 , wherein cutting the gap comprises cutting the gap when the circuit substrate is cut from a larger piece of material.

4. The method of claim 1 , wherein cutting the gap comprises forming the gap during formation of the flexible circuit.

5. The method of claim 1 , further comprising forming a second gap between the gap and at least one of the sets of traces.

6. A method of forming a print head, comprising:
forming a first set of traces on a flexible substrate;
forming a second set of traces on the flexible substrate;
connecting the first set of traces to a negative voltage supply;
connecting the second set of traces to a positive voltage supply;
cutting a gap between the first and second set of traces in the flexible substrate, the gaps configured to for an arc-break;
stacking a set of plates together to form a jet stack;
bonding the jet stack to the flexible substrate; and
mounting an integrated circuit on the flexible substrate.

7. The method of claim 6 , wherein cutting the gap comprises using a laser to cut the gap.

8. The method of claim 6 , wherein cutting the gap comprises cutting the gap when the circuit substrate is cut from a larger piece of material.

9. The method of claim 6 , wherein cutting the gap comprises forming the gap during formation of the flexible circuit.

10. The method of claim 6 , further comprising forming a second gap between the gap and at least one of the sets of traces.

Assignees

• Xerox Corp

Inventors

• Sabanovic Mirza
• Platt David P
• Freitag Chad David
• Broderick Joseph Andrew

Classifications

• H05K1/189

  characterised by the use of flexible or folded printed circuits · CPC title

• H05K3/0029

  of inorganic insulating material · CPC title

• Y10T29/49401

  Fluid pattern dispersing device making, e.g., ink jet · CPC title

• H05K1/0256

  Electrical insulation details, e.g. around high voltage areas · CPC title

• Y10T29/49124

  On flat or curved insulated base, e.g., printed circuit, etc. · CPC title