Fan-out stacked system in package (SIP) and the methods of making the same

Patent metadata

Field	Value
Publication number	US-9601463-B2
Application number	US-201414327203-A
Country	US
Kind code	B2
Filing date	Jul 9, 2014
Priority date	Apr 17, 2014
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

An embodiment package includes a first fan-out tier having a first device die, a molding compound extending along sidewalls of the first device die, and a through intervia (TIV) extending through the molding compound. One or more first fan-out redistribution layers (RDLs) are disposed over the first fan-out tier and bonded to the first device die. A second fan-out tier having a second device die is disposed over the one or more first fan-out RDLs. The one or more first fan-out RDLs electrically connects the first and second device dies. The TIV electrically connects the one or more first fan-out RDLs to one or more second fan-out RDLs. The package further includes a plurality of external connectors at least partially disposed in the one or more second fan-out RDLs. The plurality of external connectors are further disposed on conductive features in the one or more second fan-out RDLs.

First claim

What is claimed is:

1. A method for forming a package, the method comprising:
forming one or more first fan-out redistribution layers (RDLs) comprising a conductive line;
forming a fan-out tier over the one or more first fan-out RDLs, wherein forming the fan-out tier comprises:
forming a first through intervia (TIV) over the one or more first fan-out RDLs;
bonding a first device die to the one or more first fan-out RDLs;
dispensing a first molding compound around the first device die and the first TIV; and
exposing first connectors on the first device die and the first TIV, a topmost surface of the TIV being level with topmost surfaces of the first connectors;

forming one or more second fan-out RDLs over the fan-out tier, wherein the first TIV electrically connects the one or more second fan-out RDLs to the one or more first fan-out RDLs;
bonding a second device die to the one or more second fan-out RDLs using second connectors, the second connectors being interposed between the second device die and the one or more second fan-out RDLs, wherein the one or more second fan-out RDLs electrically connects the first and the second device dies;
after bonding the second device die to the one or more second fan-out RDLs, patterning the one or more first fan-out RDLs to expose the conductive line; and
disposing an external connector on the conductive line, wherein the external connector is at least partially disposed in the one or more first fan-out RDLs.

2. The method of claim 1 wherein forming the first TIV comprises:
disposing a photoresist over the one or more first fan-out RDLs;
patterning an opening in the photoresist;
filling the opening with a conductive material; and
removing the photoresist.

3. The method of claim 2 , wherein forming the first TIV further comprises disposing seed layer between the photoresist and the one or more first fan-out RDLs, wherein the opening exposes the seed layer, and wherein filling the opening comprises using the seed layer in a uni-directional electroless or electrochemical plating process.

4. The method of claim 1 , wherein patterning the one or more first fan-out RDLs to expose the conductive line comprises laser drilling.

5. The method of claim 1 , wherein bonding the first device die comprises adhering the first device die to the one or more first fan-out RDLs using an adhesive layer on a backside of the first device die.

6. The method of claim 1 , further comprising:
forming a second TIV over the one or more second fan-out RDLs;
dispensing a second molding compound around the second device die and the second TIV;
exposing the second TIV;
forming one or more third fan-out RDLs over the second TIV and the second device die, wherein the second TIV electrically connects the one or more third fan-out RDLs to the one or more second fan-out RDLs; and
bonding a third device die to the one or more third fan-out RDLs, wherein the one or more third fan-out RDLs electrically connects the first and the third device dies.

7. A method for forming a package, the method comprising:
forming one or more first redistribution layers (RDLs) over a carrier;
attaching a first device die to the one or more first RDLs;
dispensing a first molding compound over the first device die and the one or more first RDLs, the first molding compound extending along a sidewall of the first device die;
forming one or more second RDLs over the first device die and the first molding compound, the one or more second RDLs being electrically coupled to the first device die;
attaching a second device die to the one or more second RDLs, the one or more second RDLs being electrically coupled to the second device die, the one or more second RDLs being interposed between the first device die and the second device die;
dispensing a second molding compound over the second device die and the one or more second RDLs, the second molding compound extending along a sidewall of the second device die;
forming one or more third RDLs over the second device die and the second molding compound;
attaching a third device die to the one or more third RDLs, the one or more third RDLs being electrically coupled to the third device die, the one or more third RDLs being interposed between the second device die and the third device die;
dispensing a third molding compound over the third device die and the one or more third RDLs, the third molding compound extending along a sidewall of the third device die; and
debonding the carrier from the one or more first RDLs.

8. The method of claim 7 , further comprising:
after debonding the carrier, patterning the one or more first RDLs to expose at least one conductive feature; and
disposing an external connector on the at least one conductive feature, wherein the external connector is at least partially disposed in the one or more first RDLs.

9. The method of claim 7 , further comprising:
forming a first via over the one or more first RDLs, the first via extending through the first molding compound and electrically coupling the one or more first RDLs and the one or more second RDLs; and
forming a second via over the one or more second RDLs, the second via extending through the second molding compound and electrically coupling the one or more second RDLs and the one or more third RDLs.

10. The method of claim 7 , wherein attaching the first device die to the one or more first RDLs comprises attaching a backside of the first device die to the one or more first RDLs using an adhesive.

11. The method of claim 7 , wherein attaching the second device die to the one or more second RDLs comprises bonding a front side of the second device die to the one or more second RDLs using a plurality of connectors.

12. The method of claim 7 , wherein attaching the third device die to the one or more third RDLs comprises bonding a front side of the third device die to the one or more third RDLs using a plurality of connectors.

13. The method of claim 7 , wherein attaching the second device die to the one or more second RDLs comprises bonding the second device die to the one or more second RDLs using a plurality of connectors, the plurality of connectors being interposed between the second device die and the one or more second RDLs.

14. A method for forming a package, the method comprising:
attaching a first side of a first device die to a carrier;
dispensing a first molding compound over the carrier, the first molding compound contacting a sidewall of the first device die;
forming one or more first RDLs over a second side of the first device die, the second side of the first device die being opposite the first side of the first device die;
attaching a first side of a second device die to the one or more first RDLs, the one or more first RDLs being interposed between the first device die and the second device die;
dispensing a second molding compound over the one or more first RDLs, the second molding compound contacting a sidewall of the second device die;
forming one or more second RDLs over a second side of the second device die, the second side of the second device die being opposite the first side of the second device die;
attaching a first side of a third device die to the one or more second RDLs, the one or more second RDLs being interposed between the second device die and the third device die;
dispensing a third molding compound over the one or more second RDLs, the third molding compound contacting a sidewall of the third device die;
forming one or more third RDLs over a second side of the third device die, the second side of the third device die being opposite the first side of the

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Yu Chen-Hua
• Yee Kuo-Chung

Classifications

• H10P72/7424

  used as a support during the manufacture of self-supporting substrates · CPC title

• H10P72/743

  used as a support during manufacture of interconnect decals or build up layers · CPC title

• H10P72/74

  using temporarily an auxiliary support · CPC title

• H10W90/736

  between a chip and a stacked lead frame, conducting package substrate or heat sink · CPC title

• H10W90/734

  between a chip and a stacked insulating package substrate, interposer or RDL · CPC title