High speed substrate aligner apparatus

Patent metadata

Field	Value
Publication number	US-9601362-B2
Application number	US-201314042248-A
Country	US
Kind code	B2
Filing date	Sep 30, 2013
Priority date	Mar 30, 2005
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

A substrate aligner providing minimal substrate transporter extend and retract motions to quickly align substrate without back side damage while increasing the throughput of substrate processing. In one embodiment, the aligner having an inverted chuck connected to a frame with a substrate transfer system capable of transferring substrate from chuck to transporter without rotationally repositioning substrate. The inverted chuck eliminates aligner obstruction of substrate fiducials and along with the transfer system, allows transporter to remain within the frame during alignment. In another embodiment, the aligner has a rotatable sensor head connected to a frame and a substrate support with transparent rest pads for supporting the substrate during alignment so transporter can remain within the frame during alignment. Substrate alignment is performed independent of fiducial placement on support pads. In other embodiments the substrate support employs a buffer system for buffering substrate inside the apparatus allowing for fast swapping of substrates.

First claim

What is claimed is:

1. A substrate aligner apparatus comprising:
a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus;
a substrate buffer system mounted to the frame and including a buffer frame with a first set of passive support pads depending from the buffer frame for holding a first substrate in a first plane such that each pad in the first set of passive support pads supports the first substrate in the first plane and with a second set of passive support pads depending from the buffer frame for holding a second substrate in a second plane such that each pad in the second set of passive support pads is independent of each pad in the first set of passive support pads and each pad in the second set of passive support pads supports the second substrate in the second plane;
a substrate support system, distinct from the substrate buffer system, mounted to the frame and having a third set of passive support pads independent of the first and second sets of passive support pads for holding the first or second substrate in a third plane; and
at least one sensing device mounted on the buffer frame for detecting a position determining feature of one of the first or second substrates;
wherein the substrate buffer system and substrate support system are configured to move relative to each other with all passive support pads in the first set of passive support pads, the second set of passive support pads and the third set of passive support pads being radially passive, so as to be radially static relative to each other and the substrate, for effecting substrate transfer between the substrate buffer system and the substrate support, and substrate placement at a detection position of the at least one sensing device, and effecting detection of the position determining feature and orientation of a respective one of the first or second substrates and the first, second and third set of passive support pads being configured to contact a peripheral edge of a respective substrate.

2. The substrate aligner apparatus according to claim 1 , wherein at least one of the substrate buffer system and substrate support system are configured to move relative to the other of the substrate buffer system and substrate support system and lift the first or second substrate from one of the substrate buffer system and the substrate support system.

3. The substrate aligner apparatus according to claim 1 , wherein the substrate buffer system is fixedly mounted to the frame and the substrate support system is mounted to the frame by a drive system configured for rotatably and linearly moving the substrate support system for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

4. The substrate aligner apparatus according to claim 1 , wherein the substrate support system is fixedly mounted to the frame and the substrate buffer system is mounted to the frame by a drive system configured for rotatably and linearly moving the substrate buffer system for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

5. The substrate aligner apparatus according to claim 1 , wherein the substrate support system and substrate buffer system are movably mounted to the frame by a drive system, the drive system being configured to rotate the substrate support system relative to the frame and linearly move the substrate buffer system relative to the substrate support system for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

6. The substrate aligner apparatus according to claim 1 , wherein the substrate support system and substrate buffer system are movably mounted to the frame by a drive system, the drive system being configured to rotate the substrate buffer system relative to the frame and linearly move the substrate support system relative to the substrate buffer system for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

7. The substrate aligner apparatus according to claim 1 , wherein at least one of the substrate buffer system and the substrate support system are rotatably mounted to the frame by a drive system configured for generating rotation between the substrate support system and substrate buffer system relative to each other for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

8. The substrate aligner apparatus according to claim 1 , wherein the at least one sensing device is an optical sensing device.

9. A substrate processing apparatus comprising a substrate aligner as in claim 1 .

10. A substrate aligner apparatus comprising:
a frame adapted to allow a substrate transporter to transport a substrate to and from the aligner apparatus;
a substrate buffer system mounted to the frame and including a buffer frame with a first set of passive support pads depending from the buffer frame for holding a first substrate in a first plane such that each pad in the first set of passive support pads supports the first substrate in the first plane and with a second set of passive support pads depending from the buffer frame for holding a second substrate in a second plane such that each pad in the second set of passive support pads is independent of each pad in the first set of passive support pads and each pad in the second set of passive support pads supports the second substrate in the second plane;
a substrate support system, distinct from the substrate buffer system, mounted to the frame and having a third set of passive support pads independent of the first and second sets of passive support pads for holding the first or second substrate in a third plane; and
at least one sensing device for detecting a position determining feature of one of the first or second substrates;
wherein the substrate support system and substrate buffer system are movably mounted to the frame by a drive system, the drive system being configured to rotate the substrate support system relative to the frame and linearly move the substrate buffer system relative to the substrate support system with all passive support pads in the first set of passive support pads, the second set of passive support pads and the third set of passive support pads being radially passive, so as to be radially static relative to each other and the substrate, for effecting substrate transfer between the substrate buffer system and the substrate support, and substrate placement at a detection position of the at least one sensing device, and effecting the detection of the position determining feature of the first or second substrate and a repositioning of the first or second substrate.

11. The substrate aligner apparatus according to claim 10 , wherein at least one of the substrate buffer system and substrate support system are configured to move relative to the other of the substrate buffer system and substrate support system and lift the first or second substrate from one of the substrate buffer system and the substrate support system.

12. The substrate aligner apparatus according to claim 10 , wherein the substrate support system is mounted to the frame by a drive system configured for rotatably and linearly moving the substrate support system for effecting the detection of the position determining feature of the first or second substrate and a repositioning of the f

Assignees

• Moura Jairo T
• Hosek Martin
• Bottomley Todd
• Gilchrist Ulysses
• Brooks Automation Inc

Inventors

• Moura Jairo T
• Hosek Martin
• Bottomley Todd
• Gilchrist Ulysses

Classifications

• H10P72/7626

  characterised by the construction of the shaft · CPC title

• H10P72/7624

  characterised by the mechanical construction of the susceptor, stage or support · CPC title

• H10P72/7608

  characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

• H10P72/7602

  the wafers being placed on a robot blade or gripped by a gripper for conveyance · CPC title

• H10P72/3306

  Horizontal transfer of a single workpiece · CPC title