Printhead protective coating

Patent metadata

Field	Value
Publication number	US-9597873-B2
Application number	US-201214427989-A
Country	US
Kind code	B2
Filing date	Sep 12, 2012
Priority date	Sep 12, 2012
Publication date	Mar 21, 2017
Grant date	Mar 21, 2017

Abstract

In one embodiment, a printhead includes a substrate comprising a single fluid slot with sidewall surfaces. The printhead also includes a plurality of fluid chambers in fluid communication with the fluid slot. The printhead includes a membrane disposed between the fluid slot and the fluid chambers. The membrane comprises membrane side surfaces that form fluid feed holes to provide the fluid communication between the fluid slot and the fluid chambers. A protective coating is disposed on each of the surfaces.

First claim

What is claimed is:

1. A method, comprising:
creating a self-ionized plasma (SIP) of a coating material;
establishing a bias on a printhead comprising a substrate with a fluid slot, and a membrane with fluid feed holes covering the fluid slot; and
depositing the coating material on substrate back and sidewall surfaces and on membrane back and side surfaces to form a protective coating, wherein at least portions of front surfaces of the membrane that are exposed are not coated with the coating material.

2. A method as in claim 1 , wherein depositing the coating material comprises depositing at least a portion of the coating material on at least a portion of the surfaces by resputtering.

3. A method as in claim 1 , wherein the membrane side surfaces are adjacent the fluid feed holes, and depositing the coating material on the membrane side surfaces comprises forming a protective coating within the fluid feed holes.

4. A method as in claim 1 , wherein depositing the coating material comprises depositing a material selected from the group consisting of titanium (Ti), titanium nitride (TiN), tungsten (W), tantalum (Ta), tantalum nitride (TaN) and combinations thereof.

5. A method as in claim 1 further comprising:
creating a self-ionized plasma (SIP) of a second coating material different than the coating material; and
depositing the second coating material on the first coating material deposited on the substrate back and sidewall surfaces and deposited on the membrane back and side surfaces, the coating material and the second coating material forming the protective coating.

6. A method, comprising:
creating a self-ionized plasma (SIP) of a coating material;
establishing a bias on a printhead comprising a substrate with a fluid slot, and a membrane with fluid feed holes covering the fluid slot; and
depositing the coating material on substrate back and sidewall surfaces and on membrane back and side surfaces to form a protective coating, wherein depositing the coating material comprises depositing at least two layers of the coating material to form the protective coating with the at least two layers and wherein depositing at least two layers of the coating material comprises depositing a layer of titanium (Ti) and a layer of titanium nitride (TiN), wherein the layer of titanium nitride (TiN) is outermost.

7. A method as in claim 5 , wherein the protective coating formed by the coating material and the second coating material has zero stress.

8. A method as in claim 1 , wherein forming the protective coating comprises forming a protective coating that is transparent under visible light.

9. A printhead, comprising:
a substrate comprising a single fluid slot with sidewall surfaces;
a plurality of fluid chambers in fluid communication with the fluid slot;
a membrane disposed between the fluid slot and the fluid chambers, the membrane comprising membrane side surfaces that form fluid feed holes to provide the fluid communication between the fluid slot and the fluid chambers; and
a protective coating disposed on each of the surfaces.

10. A printhead as in claim 9 , further comprising:
substrate back surfaces and membrane back surfaces, wherein the protective coating is disposed on all of the substrate back surfaces and the membrane back surfaces.

11. A printhead as in claim 9 , wherein the protective coating is formed by self ionized plasma (SIP) physical vapor deposition (PVD).

12. A printhead as in claim 9 , wherein the protective coating comprises multiple layers of different materials and wherein the protective coating has substantially zero stress.

13. A printhead as in claim 9 , wherein the protective coating comprises a material selected from the group consisting of titanium (Ti), titanium nitride (TiN), tungsten (W), tantalum (Ta), tantalum nitride (TaN), and combinations thereof.

14. A printhead as in claim 13 , wherein the protective coating comprises at least two layers of material, wherein each layer of material is different and is selected from the group consisting of titanium (Ti), titanium nitride (TiN), tungsten (W), tantalum (Ta), and tantalum nitride (TaN).

15. The printhead of claim 9 further comprising a fluid ejection device on the membrane adjacent one of the plurality of fluid chambers, wherein the protective coating does not cover the fluid ejection device on the membrane.

16. The printhead of claim 9 further comprising a fluid ejection device on the membrane, a chamber layer on the membrane forming the plurality of fluid chambers, and a nozzle layer on the chamber layer, the nozzle layer having a nozzle adjacent each one of the plurality of fluid chambers.

17. The printhead of claim 16 , wherein the protective coating does not cover portions of the chamber layer adjacent the fluid chambers.

18. The printhead of claim 16 , wherein the protective coating does not cover interior surfaces of the nozzles in the nozzle layer.

19. The printhead of claim 9 , wherein the protective coating comprises a pairing of a first coating material and a second outermost coating material on the first coating material, the pairing selected from a group of pairings consisting of: (1) the first coating material being tantalum and the second coating material being tantalum nitride; (2) the first coating material being titanium and the second coating material being tungsten; and (3) the first coating material being titanium and the second coating material being titanium nitride.

20. The printhead of claim 9 , wherein the protective coating is disposed on each of the surfaces of the substrate and the membrane side surfaces and wherein at least portions of front surfaces of the membrane adjacent the plurality of fluid chambers are not coated with the coating material.

Assignees

• Rivas Rio
• Hewlett Packard Development Co Lp

Inventors

• Rivas Rio

Classifications

• B41J2002/14185

  characterised by the position of the heater and the nozzle · CPC title

• B41J2/1642

  thin film formation by CVD [chemical vapor deposition] · CPC title

• C23C14/3457

  using other particles than noble gas ions (C23C14/0036, C23C14/46 take precedence) · CPC title

• B41J2/1606

  Coating the nozzle area or the ink chamber · CPC title

• B41J2/1645

  thin film formation by spincoating · CPC title