Manufacturing method for sensor of a thermal flow measuring device

Patent metadata

Field	Value
Publication number	US-9596795-B2
Application number	US-201213709114-A
Country	US
Kind code	B2
Filing date	Dec 10, 2012
Priority date	Aug 24, 2009
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A method for the manufacture of a sensor for a thermal flow measuring device, wherein the sensor has at least one housing with a first open end and a second open end. The first open end is securable in a sensor holder; and at least one resistance thermometer is inserted into the housing through the second open end of the housing and the second open end of the housing is closed. Cables for electrical contacting of the resistance thermometer lead out of the housing through the first open end of the housing.

First claim

The invention claimed is:

1. A method for the manufacture of a sensor for a thermal flow measuring device, comprising the steps of: providing: one housing with a first open end and a second open end; securing the first open end in a sensor holder; inserting at least one resistance thermometer into the housing through the second open end of the housing and then closing the second open end of the housing; wherein: a plug on the second open end of the housing is welded to the housing in a material bonding manner by means of a laser welding method, and the plug seals the housing closed; and loading cables for electrical contacting of the resistance thermometer lead out from the housing through the first open end of the housing.

2. The method as claimed in claim 1 , further comprising the step of:
in the case of closed second end of the housing, inserting fill material filled in through the first end of the housing.

3. The method as claimed in claim 2 , further comprising the step of:
after filling with fill material, the housing is secured at its first open end in the sensor holder.

4. The method as claimed in claim 1 , wherein:
the cables for electrical contacting of the resistance thermometer are connected with a control/evaluation unit, and the sensor holder is connected with a measuring tube.

5. The method as claimed in claim 1 , wherein:
the resistance thermometer is a thin-film resistance thermometer.

6. The method as claimed in claim 1 , wherein:
the resistance thermometer is placed on a spacer;
the spacer is inserted into the housing at least partially between resistance thermometer and the housing, and/or
the spacer is inserted into the housing at least partially between resistance thermometer and second end of the housing.

7. The method as claimed in claim 1 , wherein:
the spacer has at least one planar area, onto which the resistance thermometer is soldered, and which is produced by means of a machining manufacturing method.

8. The method as claimed in claim 6 , wherein:
preformed solder portions are applied on the resistance thermometer and/or on the planar area of the spacer before application of the resistance thermometer on the spacer.

9. The method as claimed in claim 1 , wherein:
the plug is inserted with its first end into the housing, wherein the plug has a chamfer on its first end.

10. The method as claimed in claim 1 , wherein:
the housing is produced with a tensile forming method or a compressive forming method or a tensile compressive forming method.

Assignees

• Endress & Hauser Flowtec Ag

Inventors

• Pfau Axel

Classifications

• G01F1/692

  Thin-film arrangements · CPC title

• H05K13/04 Primary

  Mounting of components {, e.g. of leadless components} · CPC title

• Y10T29/49169

  Assembling electrical component directly to terminal or elongated conductor · CPC title

• B23K26/20

  Bonding (soldering by means of radiant energy B23K1/005) · CPC title

• G01F1/684 Primary

  Structural arrangements; Mounting of elements, e.g. in relation to fluid flow · CPC title