Methods and systems for releasably attaching support members to microfeature workpieces

Patent metadata

Field	Value
Publication number	US-9595504-B2
Application number	US-201514679834-A
Country	US
Kind code	B2
Filing date	Apr 6, 2015
Priority date	Mar 14, 2006
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

Methods and apparatuses for releasably attaching support members to microfeature workpieces to support members are disclosed herein. In one embodiment, for example, a method for processing a microfeature workpiece including a plurality of microelectronic dies comprises forming discrete blocks of material at a first side of a support member. The blocks are arranged on the support member in a predetermined pattern. The method also includes depositing an adhesive material into gaps between the individual blocks of material and placing a first side of the workpiece in contact with the adhesive material and/or the blocks. The method further includes cutting through a second side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the gaps. The method then includes removing at least approximately all the adhesive material from the support member and/or the workpiece with a solvent.

First claim

We claim:

1. A method for processing a microfeature workpiece having a front side, a back side opposite the front side, and a plurality of microelectronic dies at the front side of the workpiece, the method comprising:
disposing an adhesive material in channels of a support member, wherein the support member carries a plurality of at least partially uncured support blocks separated from each other by a plurality of channels, and wherein the support blocks are arranged in a pattern such that the individual support blocks correspond to the dies of the workpiece;
adhesively attaching the front side of the workpiece to the support member such that the individual dies of the workpiece contact the support blocks of the support member;
removing material from the back side of the workpiece to thin the workpiece while the workpiece is attached to the carrier;
cutting through the back side of the workpiece to singulate the dies and to expose at least a portion of the adhesive material in the channels while the workpiece is attached to the carrier; and
removing at least a portion of the adhesive material from the channels with a solvent to separate the dies from the adhesive material.

2. The method of claim 1 , further comprising curing the support blocks.

3. The method of claim 2 wherein the support blocks are generally non-adhesive.

4. The method of claim 1 wherein the support blocks are discrete blocks of material.

5. The method of claim 1 wherein the support blocks are integral with the support member such that the blocks and the support member are a single, unitary component formed from the same material.

6. The method of claim 1 wherein cutting through the back side of the workpiece to singulate the dies comprises at least partially cutting through the adhesive material.

Assignees

• Micron Technology Inc

Inventors

• Pratt David
• Hembree David R

Classifications

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10W72/073

  of die-attach connectors · CPC title

• H10W72/0198 Primary

  batch processes · CPC title

• B32B3/30

  characterised by a layer formed with recesses or projections, e.g. {hollows, grooves, protuberances, ribs (apertured layer B32B3/266; layer with cavities or internal voids B32B3/26)} · CPC title

• B32B37/1292

  selectively, e.g. in stripes, in patterns (B32B37/0076 takes precedence) · CPC title