Managing thermal budget in annealing of substrates

Patent metadata

Field	Value
Publication number	US-9595459-B2
Application number	US-201514832564-A
Country	US
Kind code	B2
Filing date	Aug 21, 2015
Priority date	Sep 17, 2008
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A method and apparatus are provided for treating a substrate. The substrate is positioned on a support in a thermal treatment chamber. Electromagnetic radiation is directed toward the substrate to anneal a portion of the substrate. Other electromagnetic radiation is directed toward the substrate to preheat a portion of the substrate. The preheating reduces thermal stresses at the boundary between the preheat region and the anneal region. Any number of anneal and preheat regions are contemplated, with varying shapes and temperature profiles, as needed for specific embodiments. Any convenient source of electromagnetic radiation may be used, such as lasers, heat lamps, white light lamps, or flash lamps.

First claim

What is claimed is:

1. An apparatus for thermally treating a substrate, comprising:
a movable substrate support;
a first energy source for directing annealing energy in a rectangular shape toward a first portion of a surface of the substrate support;
a second energy source for directing preheat energy in a tapered shape toward a second portion of the surface of the substrate support, wherein the tapered shape surrounds and overlaps the rectangular shape; and
an optical assembly housing the first and second energy sources.

2. The apparatus of claim 1 , wherein the first energy source is a laser and the second energy source is a laser.

3. The apparatus of claim 1 , wherein the annealing energy has a power density of at least 1 W/cm 2 .

4. The apparatus of claim 3 , wherein the preheat energy has a power density of at least 0.1 W/cm 2 .

5. The apparatus of claim 1 , wherein the optical assembly further comprises a first optical tuner to shape the annealing energy and a second optical tuner to shape the preheat energy.

6. The apparatus of claim 1 , further comprising a controller coupled to the substrate support.

7. The apparatus of claim 1 , wherein the second energy source comprises a plurality of light sources disposed around the first energy source.

8. The apparatus of claim 1 , further comprising an actuator to rotate the optical assembly.

9. An apparatus for thermally treating a substrate, comprising:
a movable substrate support;
a first energy source for directing annealing energy in a rectangular shape toward a first portion of a surface of the substrate support;
a second energy source for directing preheat energy in a triangular shape toward a second portion of the surface of the substrate support, wherein the triangular shape surrounds and overlaps the rectangular shape;
a third energy source for directing a thermal energy in a zoned shape toward a third portion of the surface of the substrate support, wherein the zoned shape surrounds the triangular shape and has a temperature gradient that increases toward the triangular shape; and
an optical assembly housing the first and second energy sources.

10. The apparatus of claim 9 , wherein the first energy source is a laser and the second energy source is a laser.

11. The apparatus of claim 9 , wherein the annealing energy has a power density of at least 1 W/cm 2 .

12. The apparatus of claim 11 , wherein the preheat energy has a power density of at least 0.1 W/cm 2 .

13. The apparatus of claim 9 , wherein the optical assembly further comprises a first optical tuner to shape the annealing energy and a second optical tuner to shape the preheat energy.

14. The apparatus of claim 9 , wherein the second energy source comprises a plurality of light sources disposed around the first energy source.

15. An apparatus for thermally treating a substrate, comprising:
a movable substrate support;
a first energy source for directing shaped annealing energy in a rectangular shape toward a first portion of a surface of the substrate support, wherein the first portion is maintained at a first temperature;
a second energy source for directing shaped preheat energy in a tapered shape toward a second portion of the surface of the substrate support, wherein the second portion is maintained at a second temperature that is different from the first temperature, wherein the tapered shape surrounds and overlaps the rectangular shape; and
an optical assembly housing the first and second energy sources.

16. The apparatus of claim 15 , wherein the first energy source is a laser and the second energy source is a laser.

17. The apparatus of claim 15 , wherein the annealing energy has a power density of at least 1 W/cm 2 .

18. The apparatus of claim 15 , wherein the preheat energy has a power density of at least 0.1 W/cm 2 .

19. The apparatus of claim 15 , wherein the optical assembly further comprises a first optical tuner to shape the annealing energy and a second optical tuner to shape the preheat energy.

20. The apparatus of claim 15 , wherein the second energy source comprises a plurality of light sources disposed around the first energy source.

Assignees

• Applied Materials Inc

Inventors

• Moffatt Stephen
• Mayur Abhilash J
• Ramamurthy Sundar
• Ranish Joseph M
• Hunter Aaron Muir

Classifications

• H10P72/0602

  Temperature monitoring · CPC title

• H10P72/0436 Primary

  mainly by radiation · CPC title

• F27B17/0025

  specially adapted for treating semiconductor wafers · CPC title

• B23K26/08

  Devices involving relative movement between laser beam and workpiece · CPC title

• H01L21/67115 Primary

  Electricity · mapped topic