Shrink films and related combinations and methods

US9593262B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9593262-B2
Application numberUS-201313956960-A
CountryUS
Kind codeB2
Filing dateAug 1, 2013
Priority dateAug 1, 2012
Publication dateMar 14, 2017
Grant dateMar 14, 2017

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is dissolved, the adhesive layer is exposed and is capable of forming a permanent bond. The adhesive can be used to form a seam in the film and/or can be used to form a bond between the film and a substrate. The water soluble layer facilitates removal of an optional release liner from the adhesive. A substrate with the shrink film attached thereto and a related method of attaching a heat shrinkable film to a substrate are also disclosed.

First claim

Opening claim text (preview).

What is claimed is: 1. A shrink film comprising: a heat shrinkable film; an adhesive layer on the heat shrinkable film; a water soluble layer disposed directly on the adhesive layer; wherein at least a portion of the adhesive layer is exposed, the heat shrinkable film configured in a tube form by the exposed adhesive layer bonding at least two peripheral portions of the heat shrinkable film together. 2. The shrink film of claim 1 further comprising a release liner covering the water soluble layer, the release liner being free of silicon-containing and fluorine-containing material; and wherein the water soluble layer remains substantially disposed on the adhesive layer upon removal of the release liner from the shrink film. 3. The shrink film of claim 1 wherein the release liner is selected from the group consisting of paper, a polymeric film, and combinations thereof. 4. The shrink film of claim 3 wherein the release liner includes the polymeric film, and the polymeric film comprises polyethylene terephthalate. 5. The shrink film of claim 1 wherein the tube is configured to be placed around an associated substrate and shrunk to conform to the contours of the substrate. 6. The shrink film of claim 1 wherein the entire adhesive layer is exposed and a portion of the adhesive layer, not bonding at least two peripheral portions of the heat shrinkable together, is capable of forming an adhesive bond with the substrate. 7. A method for attaching a heat shrinkable film to a substrate comprising: providing a shrink film comprising a heat shrinkable film, an adhesive layer on the heat shrinkable film, and a water soluble layer on the adhesive layer; dissolving at least a portion of the water soluble layer to expose at least a portion of the adhesive layer; applying the shrink film to the substrate; and shrinking the heat shrinkable film so the heat shrinkable film conforms to the contours of the substrate, wherein the adhesive layer is disposed on only a peripheral portion of the heat shrinkable film; and the applying operation comprises forming the shrink film into a tube by bonding at least two peripheral portions of the shrink film together with the exposed adhesive layer, and placing the tube around the substrate. 8. The method of claim 7 wherein: the shrink film further has a release liner covering the water soluble layer, the release liner being free of silicon-containing and fluorine-containing material; the method further comprising removing the release liner from the shrink film to reveal the water soluble layer. 9. A combination comprising a shrink film attached to a substrate wherein the shrink film comprises a heat shrinkable film, an adhesive layer on the heat shrinkable film forming a seam in the heat shrinkable film, and an amorphous polyvinyl alcohol polymer in contact with the adhesive layer, wherein the amorphous polyvinyl alcohol is dissolved and mixed with the adhesive layer. 10. A combination comprising a shrink film attached to a substrate wherein the shrink film comprises a heat shrinkable film, an adhesive layer on the heat shrinkable film forming a bond with the substrate, and an amorphous polyvinyl alcohol polymer at an interface between the substrate and shrink film, wherein the amorphous polyvinyl alcohol is dissolved and mixed with the adhesive layer.

Assignees

Inventors

Classifications

  • Shrinkable · CPC title

  • using interposed adhesives or interposed materials with bonding properties · CPC title

  • Next to addition polymer from unsaturated monomers · CPC title

  • of synthetic resin · CPC title

  • Polymer or resin containing [i.e., natural or synthetic] · CPC title

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Frequently asked questions

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What does patent US9593262B2 cover?
The present subject matter provides a shrink film free of silicon-containing material, fluorine-containing material, and solvent-formed seams. The shrink film utilizes a water soluble layer covering an adhesive layer. The water soluble layer is in dry form and non-tacky, allowing processing of the shrink film subsequent to adhesive application to the shrink film. When the water soluble layer is…
Who is the assignee on this patent?
Avery Dennison Corp
What technology area does this patent fall under?
Primary CPC classification C09J7/0232. Mapped technology areas include Chemistry & Metallurgy.
When was this patent published?
Publication date Tue Mar 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).