Method for preparing microstructured laminating adhesive articles

Patent metadata

Field	Value
Publication number	US-9555602-B2
Application number	US-37275906-A
Country	US
Kind code	B2
Filing date	Mar 10, 2006
Priority date	Mar 10, 2006
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A method of making a microstructured adhesive article that includes (a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing; and (b) embossing the surface of the crosslinked pressure sensitive adhesive layer to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface.

First claim

What is claimed is:

1. A method of making a microstructured adhesive article comprising:
(a) providing an article comprising a crosslinked pressure sensitive adhesive layer disposed on a backing, wherein the crosslinked pressure sensitive adhesive layer has a thickness of from about 10 micrometers to about 1500 micrometers, wherein the crosslinked pressure sensitive adhesive does not interfere with light transmission of light in the visible region, having a luminous transmittance of at least 95% and a haze of less than 5% as measured according to ASTM D 1003-95 after dry lamination; and
(b) embossing the surface of the crosslinked pressure sensitive adhesive layer with a microstructured liner or a molding tool to form a crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface structure, wherein the structure consists of V-grooves or channels and wherein the surface structure is unstable when not in contact with the microstructured liner or molding tool, and the adhesive layer is able to wet out a substrate surface by flattening of the microstructured surface structures and displays complete wet out to a glass substrate after 48 hours.

2. A method according to claim 1 wherein embossing comprises contacting the surface of the crosslinked pressure sensitive adhesive layer with a microstructured release liner.

3. A method according to claim 1 wherein embossing comprises contacting the surface of the crosslinked pressure sensitive adhesive layer with a microstructured molding tool.

4. A method according to claim 1 wherein the crosslinked pressure sensitive adhesive layer comprises a covalently crosslinked pressure sensitive adhesive layer.

5. A method according to claim 1 wherein the crosslinked pressure sensitive adhesive layer comprises a physically crosslinked pressure sensitive adhesive layer.

6. A method according to claim 1 wherein the crosslinked pressure sensitive adhesive layer comprises a crosslinked acrylic adhesive layer.

7. A method according to claim 1 wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed is removable from the adhesive layer.

8. A method according to claim 1 wherein the backing on which the crosslinked pressure sensitive adhesive layer is disposed comprises a microstructured release liner.

9. A method according to claim 1 wherein the crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface is capable of being dry laminated to a substrate to form a laminate, wherein the adhesive layer has a haze value after dry lamination, measured according to ASTM D 1003-95, of less than about 50% of the haze value of the layer prior to lamination.

10. A method according to claim 1 wherein the crosslinked pressure sensitive adhesive layer having a microstructured adhesive surface is capable of being dry laminated to a substrate to form a laminate, wherein the adhesive layer has an opacity value of less than about 3% after dry lamination.

11. A microstructured adhesive article prepared according to the method of claim 1 .

12. An article comprising a crosslinked pressure sensitive adhesive layer disposed on a structured liner, wherein the crosslinked pressure sensitive adhesive does not interfere with light transmission of light in the visible region, having a luminous transmittance of at least 95% and a haze of less than 5% as measured according to ASTM D 1003-95 after dry lamination, and wherein the crosslinked pressure sensitive adhesive has a microstructured surface structure, wherein the surface structure consists of V-grooves or channels and wherein the surface structure is unstable when not in contact with the structured liner, and the adhesive layer is able to wet out a substrate surface by flattening of the microstructured surface structures due to the minimization of the formation of stresses within the adhesive upon removal of the structured liner, and wherein the crosslinked pressure sensitive adhesive layer has a thickness of from about 10 micrometers to about 1500 micrometers, and wherein the crosslinked pressure sensitive adhesive having a microstructured surface structure displays complete wet out to a glass substrate after 48 hours.

Assignees

• Sherman Audrey A
• Winkler Wendi J
• Mazurek Mieczyslaw H
• Garcia Henri
• Toro Daniel
• 3M Innovative Properties Co

Inventors

• Sherman Audrey A
• Winkler Wendi J
• Mazurek Mieczyslaw H
• Garcia Henri
• Toro Daniel

Classifications

• B32B17/10036

  comprising two outer glass sheets · CPC title

• B32B17/10743

  containing acrylate (co)polymers or salts thereof · CPC title

• B32B38/06

  Embossing · CPC title

• B32B2405/00

  Adhesive articles, e.g. adhesive tapes · CPC title

• B32B27/08 Primary

  of synthetic resin · CPC title