Compound, photocurable composition, and methods for producing patterned film, optical component, circuit board, electronic component by using the photocurable composition, and cured product

Patent metadata

Field	Value
Publication number	US-9593170-B2
Application number	US-201414889793-A
Country	US
Kind code	B2
Filing date	May 2, 2014
Priority date	May 9, 2013
Publication date	Mar 14, 2017
Grant date	Mar 14, 2017

Abstract

A compound that increases the photocuring rate of a photocurable composition and reduces the force for releasing a cured product from a mold is provided.
A compound is represented by general formula (1):
where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

First claim

The invention claimed is:

1. A photocurable composition comprising:
a component (A) which is a polymerizable compound;
a component (B) which is a photopolymerization initiator; and
a component (C) which is a compound represented by general formula (1):

where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents a repeated structure of an oxyalkylene group or an oxypropylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

2. A photocurable composition comprising:
a component (A) which is a polymerizable compound;
a component (B) which is a photopolymerization initiator; and
a component (C) which is a compound represented by general formula (1):

where R f represents an alkyl group at least part of which is substituted with fluorine, R O represents an oxyalkylene group or a repeated structure of an oxyalkylene group, N represents a nitrogen atom, R A represents an alkyl group, and R B represents an alkyl group or a hydrogen atom.

3. The photocurable composition according to claim 2 , wherein R B represents an alkyl group.

4. The photocurable composition according to claim 3 , wherein R A and R B each represent a linear alkyl group having 1 to 5 carbon atoms.

5. The photocurable composition according to claim 2 , wherein the compound represented by general formula (1) is a compound represented by general formula (5):

where a represents an integer in a range of 1 to 25, b represents an integer in a range of 0 to 25, c represents an integer in a range of 1 to 25, R 1 represents an alkyl group, and R 2 represents an alkyl group or hydrogen.

6. The photocurable composition according to claim 5 , wherein a, b, and c in general formula (5) each independently represent an integer in a range of 1 to 10.

7. The photocurable composition according to claim 5 , wherein b in general formula (5) represents an integer in a range of 1 to 5.

8. The photocurable composition according to claim 5 , wherein R 2 in general formula (5) represents an alkyl group.

9. The photocurable composition according to claim 8 , wherein R 1 and R 2 in general formula (5) each represent a linear alkyl group having 1 to 5 carbon atoms.

10. A method for producing a patterned film, the method comprising:
a placement step of placing the photocurable composition according to claim 2 on a substrate;
a mold contact step of bringing the photocurable composition into contact with a mold having an original pattern for transferring a pattern shape;
an irradiation step of irradiating the photocurable composition with light to form a cured film; and
a mold releasing step of releasing the cured film from the mold.

11. The method according to claim 10 , wherein a surface of the original pattern of the mold has hydroxyl groups.

12. The method according to claim 11 , wherein the surface of the original pattern of the mold is composed of quartz.

13. The method according to claim 10 , wherein the mold contact step is performed in an atmosphere composed of a gas containing a condensable gas.

14. The method according to claim 13 , wherein the gas containing the condensable gas is a gas mixture containing helium and the condensable gas.

15. The method according to claim 13 , wherein the condensable gas is 1,1,1,3,3-pentafluoropropane.

16. A method for producing an optical component, the method comprising:
a step of obtaining a patterned film on a substrate by the method according to claim 10 .

17. A method for producing an optical component, the method comprising:
a step of obtaining a patterned film by the method according to claim 10 ; and
a step of etching or ion-implanting the substrate by using a pattern shape of the obtained patterned film as a mask.

18. A method for producing a circuit board, the method comprising:
a step of obtaining a patterned film by the method according claim 10 ;
a step of etching or ion-implanting the substrate by using a pattern shape of the obtained patterned film as a mask; and
a step of forming an electronic part on the substrate.

19. A method for forming an electronic component, the method comprising:
a step of obtaining a circuit board by the method according to claim 18 ; and
a step of connecting the circuit board to a controlling mechanism for controlling the circuit board.

20. A cured product obtained by curing the photocurable composition according to claim 2 .

21. The photocurable composition according to claim 2 , wherein a blend ratio of the component (C) is 0.001% by weight or more and 10% by weight or less relative to a total weight of the polymerizable compound serving as the component (A).

22. The photocurable composition according to claim 2 , further comprising a hydrogen donor, wherein the ratio of the hydrogen donor is 0% or more and 20% by weight or less relative to a total weight of the polymerizable compound serving as the component (A).

23. The photocurable composition according to claim 2 , wherein a viscosity of the photocurable composition is 5 cP or more and 50 cP or less in terms of a viscosity of a mixture of the components other than a solvent at 23° C.

Assignees

• Canon Kk

Inventors

• Ito Toshiki
• Honma Takeshi
• Yonezawa Shiori
• Sato Hitoshi
• Kawasaki Youji

Classifications

• H10P50/692

  characterised by their composition, e.g. multilayer masks or materials · CPC title

• H10P50/28

  of insulating materials · CPC title

• H10P14/683

  carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC · CPC title

• H05K2203/0548

  Masks · CPC title

• H05K3/30

  Assembling printed circuits with electric components, e.g. with resistors · CPC title