Methods and apparatus for large diameter wafer handling

US9592930B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9592930-B2
Application numberUS-201414558445-A
CountryUS
Kind codeB2
Filing dateDec 2, 2014
Priority dateJan 13, 2008
Publication dateMar 14, 2017
Grant dateMar 14, 2017

How to read this patent

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  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively latchable to the container portion. Optimized sag control is provided as well as enhanced structural rigidity, and wafer seating features.

First claim

Opening claim text (preview).

The invention claimed is: 1. A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising: a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior; a plurality of interconnected wafer supports disposed within said container portion and extending from proximate one of said closed lateral sides to proximate said closed back, said plurality of interconnected wafer supports defining a plurality of V-shaped grooves therebetween, each of said plurality of V-shaped grooves defining a first apex, where each of the plurality of interconnected wafer supports meet for registration of a respective one of a plurality of wafers therein, said first apex defining a first acute apex angle; and a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots each defining a lower leg having an upward-facing engagement surface and an upper leg having a downward-facing engagement surface, each of said plurality of V-shaped slots defining a second apex where the lower leg and the upper leg of each of the plurality of V-shaped slots meet, the second apex in substantial planar alignment with said first apex of a corresponding one of said plurality of V-shaped grooves for registration of said respective one of said plurality of wafers, said second apex defining a second acute apex angle, wherein said second acute apex angle is less than said first acute apex angle. 2. The front opening wafer container of claim 1 , wherein said first acute apex angle varies continuously along said V-shaped groove. 3. The front opening wafer container of claim 1 , wherein said first acute apex angle is greater proximate said lateral side than proximate said closed back. 4. The front opening wafer container of claim 3 , wherein said first acute apex angle varies continuously along said V-shaped groove. 5. The front opening wafer container of claim 1 , wherein for each of the plurality of V-shaped slots, said upward-facing engagement surface of said lower leg extends further in a direction towards said open front than said downward-facing engagement surface of said upper leg. 6. The front opening wafer container of claim 5 , wherein, in said direction towards said open front, said lower leg of a first V-shaped slot of said plurality of V-shaped slots extends beyond said upper leg of a second V-shaped slot of said plurality of V-shaped slots, said second V-shaped slot being adjacent and below said first V-shaped slot. 7. The front opening wafer container of claim 1 , comprising: a door attachable to said container portion to close said open front; a wafer retainer disposed on an inside surface of said door, said wafer retainer comprising a plurality of vertically aligned horizontally-extending interconnected wafer supports for engagement of peripheral edges of a plurality of wafers as said door is closes said open front, each of said plurality of wafer supports having a length and each including: a base portion non-movably attached to said container; a deflectable initial wafer engagement portion; and an intermediate portion connecting said base portion and said wafer engagement portion, said intermediate portion and said deflectable initial wafer engagement portion cantilevered from said base portion. 8. The front opening wafer container of claim 7 , wherein: adjacent wafer supports are interconnected to each other along respective base portions and are not connected along respective intermediate portions or wafer engagement portions; and when viewed in profile, an upper leg portion extends outwardly from said door and upwardly and a lower leg portion extends outwardly from said door and downwardly defining a generally V-shaped portion with an apex including a V-shaped wafer engagement surface with an apex, said upper leg portion and lower leg portion extending said length of said wafer support; and said intermediate portion having an elongated aperture therethrough providing a pair of fingers extending horizontally intermediate said base portion and said deflectable wafer engagement portion. 9. The front opening wafer container of claim 7 , said door being selectively latchable to said container portion. 10. A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising: a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior; and a plurality of interconnected wafer supports disposed within said container portion and extending from proximate one of said closed lateral sides to proximate said closed back, said plurality of interconnected wafer supports defining a plurality of V-shaped grooves therebetween, each of said plurality of V-shaped grooves defining a first apex, where each of the plurality of interconnected wafer supports meet, for registration of a respective one of a plurality of wafers therein, said first apex defining a first acute apex angle, a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots each defining a lower leg having an upward-facing engagement surface and an upper leg having a downward-facing engagement surface, each of said plurality of V-shaped slots defining a second apex where the lower leg and the upper leg of each of the plurality of V-shaped slots meet, the second apex in substantial planar alignment with said first apex of a corresponding one of said plurality of V-shaped grooves for registration of said respective one of said plurality of wafers, said second apex defining a second acute apex angle, wherein said first acute apex angle varies depending on a positional location along said V-shaped groove, and said second acute apex angle is less than said first acute apex angle. 11. The front opening wafer container of claim 10 , wherein said first acute apex angle varies continuously along said V-shaped groove. 12. The front opening wafer container of claim 10 , wherein said first acute apex angle is greater proximate said lateral side than proximate said closed back. 13. The front opening wafer container of claim 10 , wherein for each of the plurality of V-shaped slots, said upward-facing engagement surface of said lower leg extend further in a direction towards said open front than said downward-facing engagement surface of said upper leg. 14. The front opening wafer container of claim 13 , wherein, in said direction towards said open front, said lower leg of a first V-shaped slot of said plurality of V-shaped slots extends beyond said upper leg of a second V-shaped slot of said plurality of V-shaped slots, said second V-shaped slot being adjacent and below said first V-shaped slot. 15. A front opening wafer container for receiving a plurality of wafers positioned in a stacked array with a vertical axis, the container comprising: a container portion having closed lateral sides extending between a closed back and an open front and defining an open interior; and a back wafer restraint disposed within said container portion proximate said closed back, said back wafer restraint defining a plurality of V-shaped slots, each of said plurality of V-shaped slots defining an apex for registration of said respective one of said plurality of wafers, said apex defining an acute apex angle, wherein each of said plurality of V-shaped slots defi

Assignees

Inventors

Classifications

  • characterised by the construction of the closed carrier · CPC title

  • characterised by substrate supports · CPC title

  • characterised by shock absorbing elements, e.g. retainers or cushions · CPC title

  • the wafers being stored in a carrier, involving loading and unloading · CPC title

  • H10P72/14Primary

    Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls · CPC title

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What does patent US9592930B2 cover?
A front semiconductor opening wafer container for large diameter wafers includes a container portion and a door. The container portion includes a left closed side, a right closed side, a closed back, an open front, and an open interior including a plurality of slots for receiving and containing the wafers. The door is attachable to the container portion to close the open front and selectively l…
Who is the assignee on this patent?
Entegris Inc
What technology area does this patent fall under?
Primary CPC classification H10P72/1921. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Mar 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).