Ostomy appliance

US9592147B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9592147-B2
Application numberUS-201113814248-A
CountryUS
Kind codeB2
Filing dateAug 16, 2011
Priority dateAug 16, 2010
Publication dateMar 14, 2017
Grant dateMar 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

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Abstract

Official abstract text for this publication.

The present invention discloses an ostomy device comprising an adhesive wafer, wherein said adhesive wafer comprises means for preventing deformation and tearing when the adhesive wafer is removed from the skin. In particular, the present invention relates to adhesive wafers formed of soft adhesives.

First claim

Opening claim text (preview).

The invention claimed is: 1. An adhesive wafer for removable placement onto skin, the adhesive wafer comprising: a backing layer with a stoma receiving hole formed in the backing layer; a first adhesive layer disposed on the backing layer around the stoma receiving hole and a second adhesive layer disposed on the first adhesive layer and around the stoma receiving hole, with a radial extent of the first adhesive layer from the stoma receiving hole being larger than a radial extent of the second adhesive layer from the stoma receiving hole; a pulling tab providing an outermost peripheral edge of the adhesive wafer, with the pulling tab abutting the first adhesive layer; the first adhesive layer comprising a reinforced area provided by an inner annular area connected to a lip portion, with the inner annular area formed around the second adhesive layer and the lip portion extending in a radial direction from the inner annular area to the pulling tab; wherein a first thickness of the first adhesive layer at the inner annular area and at the lip portion is greater than a second thickness of the first adhesive layer outside of the reinforced area. 2. An adhesive wafer according to claim 1 , wherein an outer perimeter of the lip portion extends along an arc having an arc length less than an entirety of a perimeter of the adhesive wafer. 3. An adhesive wafer according to claim 1 , wherein the first adhesive layer has a higher tack than the second adhesive layer, and the second adhesive layer is more moisture absorbing than the first adhesive layer. 4. The adhesive wafer according to claim 1 , wherein the first adhesive layer in the reinforced area is disposed to comprise a transition between the inner annular area and the lip portion defining an angle of approximately 135°. 5. The adhesive wafer according to claim 2 , wherein the arc length of the outer perimeter of the lip portion is a first arc length that constitutes less than an entirety of a second arc length of the pulling tab wherein it is abutting the first adhesive layer. 6. The adhesive wafer according to claim 2 , wherein the arc of the outer perimeter of the lip portion is coincident with an outer peripheral edge of the backing layer. 7. The adhesive wafer according to claim 1 , wherein the backing layer is made from a stretchable material.

Assignees

Inventors

Classifications

  • A61F5/443Primary

    having {adhesive seals for securing to the body, e.g. of} hydrocolloid type seals, e.g. gels, starches, karaya gums · CPC title

  • with reinforcing layers · CPC title

  • Means for securing receptacles or bags to the body otherwise than by adhesives, e.g. belts, straps or harnesses (A61F5/449 takes precedence) · CPC title

  • Means for attaching bag to seal ring · CPC title

  • Colostomy, {ileostomy or urethrostomy} devices (A61F5/441, A61F5/442, A61F5/443 take precedence) · CPC title

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Frequently asked questions

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What does patent US9592147B2 cover?
The present invention discloses an ostomy device comprising an adhesive wafer, wherein said adhesive wafer comprises means for preventing deformation and tearing when the adhesive wafer is removed from the skin. In particular, the present invention relates to adhesive wafers formed of soft adhesives.
Who is the assignee on this patent?
Buus Hasse, Coloplast As
What technology area does this patent fall under?
Primary CPC classification A61F5/443. Mapped technology areas include Human Necessities.
When was this patent published?
Publication date Tue Mar 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).