Fabrication method of semiconductor piece

Patent metadata

Field	Value
Publication number	US-9589812-B2
Application number	US-201514884168-A
Country	US
Kind code	B2
Filing date	Oct 15, 2015
Priority date	Nov 6, 2014
Publication date	Mar 7, 2017
Grant date	Mar 7, 2017

Abstract

A fabrication method of a semiconductor piece includes forming a groove that has a first groove portion, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching; affixing a retention member including an adhesive layer to the surface in which the groove on the front side is formed; thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and removing the retention member from the surface after the thinning.

First claim

What is claimed is:

1. A fabrication method of a semiconductor piece comprising:
forming a groove that has a first groove portion whose width is gradually narrowed from a front side of a substrate toward a back side of the substrate, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching;
affixing a retention member including an adhesive layer to the front side in which the groove on the front side is formed;
thinning the substrate from the back side of the substrate in a state in which the retention member is affixed; and
removing the retention member from the front side after the thinning.

2. The fabrication method of a semiconductor piece according to claim 1 , further comprising:
forming the groove on the front side by starting formation of the groove on the front side by the dry etching with etching strength by which a width of the groove on the front side is gradually narrowed toward the back side, and, during formation of the groove on the front side, switching a flow amount of gas for forming a protective film included in etching gas which is used for the dry etching, from a first flow amount to a second flow amount which is less than the first flow amount in a range without stopping a flow amount of the gas for forming the protective film.

3. The fabrication method of a semiconductor piece according to claim 1 , further comprising:
forming the groove on the front side by starting formation of the groove on the front side by the dry etching with etching strength by which a width of the groove on the front side is gradually narrowed toward the back side, and, during formation of the groove on the front side, switching a flow amount of gas for etching included in etching gas which is used for the dry etching, from a first flow amount to a second flow amount which is more than the first flow amount.

4. The fabrication method of a semiconductor piece according to claim 1 ,
wherein the second groove portion has a shape whose width is not wider than a width of a lowermost portion of the first groove portion, and which downwardly extends.

5. The fabrication method of a semiconductor piece according to claim 1 ,
wherein a depth of the first groove portion is deeper than a depth into which the adhesive layer enters, and
wherein the second groove portion has a shape whose width is wider than a width of a lowermost portion of the first groove portion toward a lower part.

6. A fabrication method of a semiconductor piece comprising:
forming a groove that has a first groove portion whose width is gradually narrowed from a front side of a substrate toward a back side of the substrate, and a second groove portion which is a groove portion formed to communicate with a lower part of the first groove portion and extends toward a lower part at a steeper angle than an angle of the first groove portion, has a shape without an angle portion between the first groove portion and the second groove portion, is positioned on the front side, and is formed by dry etching;
affixing a retention member including an adhesive layer to the front side in which the groove on the front side is formed;
forming a groove on a back side using a cutting member which rotates from the back side of the substrate toward the groove on the front side, in a state in which the retention member is affixed; and
removing the retention member from the front side after the groove on the back side is formed.

7. The fabrication method of a semiconductor piece according to claim 6 , further comprising:
forming the groove on the front side by starting formation of the groove on the front side by the dry etching with etching strength by which a width of the groove on the front side is gradually narrowed toward the back side, and, during formation of the groove on the front side, switching a flow amount of gas for forming a protective film included in etching gas which is used for the dry etching, from a first flow amount to a second flow amount which is less than the first flow amount in a range without stopping a flow amount of the gas for forming the protective film.

8. The fabrication method of a semiconductor piece according to claim 6 , further comprising:
forming the groove on the front side by starting formation of the groove on the front side by the dry etching with etching strength by which a width of the groove on the front side is gradually narrowed toward the back side, and, during formation of the groove on the front side, switching a flow amount of gas for etching included in etching gas which is used for the dry etching, from a first flow amount to a second flow amount which is more than the first flow amount.

9. The fabrication method of a semiconductor piece according to claim 6 ,
wherein the second groove portion has a shape whose width is not wider than a width of a lowermost portion of the first groove portion, and which downwardly extends.

10. The fabrication method of a semiconductor piece according to claim 6 ,
wherein a depth of the first groove portion is deeper than a depth into which the adhesive layer enters, and
wherein the second groove portion has a shape whose width is wider than a width of a lowermost portion of the first groove portion toward a lower part.

Assignees

• Fuji Xerox Co Ltd

Inventors

• Takahashi Mutsuya
• Yamada Shuichi
• Murata Michiaki

Classifications

• H10P72/7416

  used during dicing or grinding · CPC title

• H10P72/744

  Details of chemical or physical process used for separating the auxiliary support from a device or a wafer · CPC title

• H10P72/7402

  Wafer tapes, e.g. grinding or dicing support tapes · CPC title

• H10P54/00 Primary

  Cutting or separating of wafers, substrates or parts of devices · CPC title

• H10P52/00

  Grinding, lapping or polishing of wafers, substrates or parts of devices · CPC title