Semiconductor device

Patent metadata

Field	Value
Publication number	US-9585279-B2
Application number	US-201314655011-A
Country	US
Kind code	B2
Filing date	Mar 21, 2013
Priority date	Mar 21, 2013
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

An electrode ( 3 ) is joined to a wiring substrate ( 2 ). A nut box ( 7 ) is inserted in the bent portion ( 5 ) of the electrode ( 3 ) so that the nut ( 6 ) is positioned in alignment with the opening ( 4 ) of the electrode ( 3 ). A case ( 8 ) covers the wiring substrate ( 2 ). The nut box ( 7 ) and the case ( 8 ) are members separate from each other. The nut box ( 7 ) is fixed in the electrode ( 3 ) so as not to come off from the bent portion 5 ).

First claim

The invention claimed is:

1. A semiconductor device comprising:
a wiring substrate;
an electrode having an opening and a bent portion and joined to the wiring substrate;
a nut box having a nut and inserted in the bent portion of the electrode so that the nut is positioned in alignment with the opening of the electrode; and
a case covering the wiring substrate,
wherein the nut box and the case are members separate from each other, and
the nut box is fixed in the electrode so as not to come off from the bent portion.

2. The semiconductor device of claim 1 , wherein the electrode has a supporting portion for supporting the nut box,
an indentation is provided in the supporting portion,
the nut box has a projection, and
the nut box is fixed in the electrode by fitting the projection of the nut box in the indentation of the supporting portion.

3. The semiconductor device of claim 2 , wherein a lead for leading the projection of the nut box into the indentation is provided in the supporting portion.

4. The semiconductor device of claim 1 , wherein the electrode has a hole,
the nut box has a projection, and
the projection of the nut box is inserted in the hole in the electrode and molten and fixed on the electrode.

5. The semiconductor device of claim 1 , wherein the nut box is fixed on the electrode with any one of a metal screw, a resin screw, and a snap-fit.

6. The semiconductor device of claim 1 , wherein the nut box has a claw,
when the nut box is inserted in the bent portion of the electrode, the claw is deformed, and
the nut box is fixed on the electrode by reforming the claw after the nut box is inserted.

7. The semiconductor device of claim 1 , wherein the nut box is directly welded to the electrode.

Assignees

• Mitsubishi Electric Corp

Inventors

• YASUTOMI Goro
• Hayashida Yukimasa
• Date Ryutaro

Classifications

• H10W90/701

  characterised by the relative positions of pads or connectors relative to package parts · CPC title

• H10W76/15

  Containers comprising an insulating or insulated base · CPC title

• H10W76/136 Primary

  having other interconnections perpendicular to the conductive base · CPC title

• H05K7/14329

  specially adapted for the configuration of power bus bars · CPC title

• H05K7/1427 Primary

  Housings · CPC title