Connector and semiconductor testing device having the same

Patent metadata

Field	Value
Publication number	US-9583854-B2
Application number	US-201113105548-A
Country	US
Kind code	B2
Filing date	May 11, 2011
Priority date	May 11, 2010
Publication date	Feb 28, 2017
Grant date	Feb 28, 2017

Abstract

To provide a connector wherein ground terminals can be designed easily, which not only suppresses the occurrence of impedance mismatch and crosstalk, but which does not lead to interferences between contacting portions. A ground terminal for a connector has a cylindrical main body. A plurality of contacting portions, for contacting a circuit board, are formed on the bottom edge of the cylindrical main body. The ground terminal has, as contacting portions, inner contacting portions and outer contacting portions. The inner contacting portions extend toward the inside of the cylindrical main body and in the downward direction, and the outer contacting portions extend toward the inside of the cylindrical main body and in the downward direction.

First claim

What is claimed is:

1. A connector, the connector comprising:
a plurality of ground terminals, each ground terminal including a cylindrical main body, the main body being disposed on a circuit board so that the axes of the main bodies are perpendicular relative to the circuit board; and
a plurality of signal terminals, the signal terminals being disposed on the inside of respective main bodies;
wherein:
each ground terminal includes a plurality of ground terminal contacting portions for contacting the circuit board, the ground terminal contacting portions extending from the bottom edges of the main bodies;
each of the plurality of ground terminal contacting portions includes an inner contacting portion and an outer contacting portion, a tip end of the inner contacting portion extending toward the inside of the cylindrical main body in the downward direction, a tip end of the outer contacting portion extending toward the outside of the cylindrical main body in the downward direction;
the inner contacting portions and the outer contacting portions are positioned on mutually-opposing halves of the respective cylindrical main body;
each signal terminal includes, on the bottom edge thereof, a signal terminal contacting portion adapted to contact the circuit board; and
each signal terminal contacting portion comprises a plate-shaped spring that extends obliquely in the downward direction to be positioned on the opposite half from the respective inner contacting portions.

2. The connector of claim 1 , wherein each outer contacting portion is disposed within a second half of the main body.

3. The connector of claim 2 , wherein each ground terminal contacting portion includes two outer contacting portions.

4. The connector of claim 3 , wherein each inner contacting portion is disposed within a first half of the main body.

5. The connector of claim 4 , wherein each ground terminal contacting portion includes two inner contacting portions.

6. The connector of claim 5 , wherein the inner contacting portions and the outer contacting portions encompass the signal terminal.

7. A semiconductor testing device, the semiconductor testing device comprising:
a connector, the connector including:
a plurality of ground terminals, each ground terminal including a cylindrical main body, the main body being disposed on a circuit board so that the axes of the main bodies are perpendicular relative to the circuit board; and
a plurality of signal terminals, the signal terminals being disposed on the inside of respective main bodies;
wherein:
each ground terminal includes a plurality of ground terminal contacting portions for contacting the circuit board, the ground terminal contacting portions extending from the bottom edges of the main bodies; and
each of the plurality of ground terminal contacting portions includes an inner contacting portion and an outer contacting portion, a tip end of the inner contacting portion extending toward the inside of the cylindrical main body in the downward direction, a tip end of the outer contacting portion extending toward the outside of the cylindrical main body in the downward direction;
the inner contacting portions and the outer contacting portions of each ground terminal are positioned on mutually-opposing halves of that cylindrical main body;
each signal terminal includes, on the bottom edge thereof, a signal terminal contacting portion adapted to contact the circuit board; and
each signal terminal contacting portion comprises a plate-shaped spring that extends obliquely in the downward direction to be positioned on the opposite half of that cylindrical main body from the inner contacting portions.

8. The semiconductor testing device of claim 7 , wherein each ground terminal includes two inner contacting portions and two outer contacting portions.

9. The semiconductor testing device of claim 8 , wherein a conductive pattern for contact by the signal terminal contacting portion, and a conductive pattern for contacting the outer contacting portions and the inner contacting portions, are formed on the surface of the circuit board.

10. The semiconductor testing device of claim 9 , wherein the conductive pattern for contacting the outer contacting portions and the inner contacting portions encompass the signal conductive pattern.

11. The semiconductor testing device of claim 10 , wherein the outer contacting portions radially extends from the main body so as to contact the conductive pattern for contacting the outer contacting portions and the inner contacting portions.

12. The semiconductor testing device of claim 11 , wherein the outer contacting portions do not contact the conductive pattern for contact by the signal terminal contacting portion.

13. The connector of claim 6 , wherein the ground terminal outer contacting portion extends radially away from the main body.

14. The connector of claim 13 , wherein a conductive pattern for contact by the signal terminal contacting portion, and a conductive pattern for contacting the outer contacting portions and the inner contacting portions, are formed on the surface of the circuit board, and the conductive pattern for contacting the outer contacting portions and the inner contacting portions encompass the signal conductive pattern.

15. The connector of claim 14 , wherein the outer contacting portions radially extends from the main body so as to contact the conductive pattern for contacting the outer contacting portions and the inner contacting portions.

16. The connector of claim 15 , wherein the outer contacting portions do not contact the conductive pattern for contact by the signal terminal contacting portion.

17. The semiconductor testing device of claim 7 , wherein the signal terminal is electrically connected to a semiconductor device.

18. The connector of claim 1 , wherein the ground terminal contacting portions extend from top edges of cutouts formed on the bottom edges of the main bodies, the cutouts extending in an upward direction from the bottom edges of the main bodies.

Assignees

• Uesaka Ryo
• Watanabe Jun
• Mizumura Akinori
• Wagata Hirotaka
• Molex Japan Co Ltd
• Advantest Corp

Inventors

• Uesaka Ryo
• Watanabe Jun
• Mizumura Akinori
• Wagata Hirotaka

Classifications

• H01R12/714 Primary

  with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit · CPC title

• G01R31/2822

  of microwave or radiofrequency circuits (of attenuation, gain, e.g. using network analyzers G01R27/28) · CPC title

• H01R24/50

  mounted on a PCB [Printed Circuit Board] · CPC title

• G01R1/0416

  Connectors, terminals (G01R1/0425 and G01R1/0433 take precedence; with measurement function for battery poles G01R31/364) · CPC title

• H01R13/646

  specially adapted for high-frequency, e.g. structures providing an impedance match or phase match (non-coaxed protective earth or shield arrangements H01R13/648; coaxed connectors specially adapted for high frequency H01R24/40) · CPC title