Frame-shaped connector having reduced contact member pitch

US9196992B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9196992-B2
Application numberUS-201313891951-A
CountryUS
Kind codeB2
Filing dateMay 10, 2013
Priority dateJun 11, 2012
Publication dateNov 24, 2015
Grant dateNov 24, 2015

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  2. Abstract

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  5. First independent claim

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Abstract

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A connector capable of realizing a narrower pitch of contact members, and suppressing displacement of the contact members. A connector comprises a frame and a plurality of contact members held by the frame. The contact members held by the frame are elastically deformed by being sandwiched between an IC package and a printed board. At this time, terminal portions of the IC package and terminal portions of the printed board are electrically connected via a plurality of conductive path portions of each contact member. The frame is formed by a frame portion, a plurality of longitudinal ribs extending in a manner bridging the frame portion, and a plurality of transverse ribs extending orthogonal to the longitudinal ribs in a manner bridging the frame portion. The contact members are held in slits formed by the longitudinal ribs and the transverse ribs.

First claim

Opening claim text (preview).

What is claimed is: 1. A connector that electrically connects between a first object to be connected and a second object to be connected, comprising: a frame that includes: a frame portion, a plurality of longitudinal members each extending in a manner bridging said frame portion, each of said plurality of longitudinal members being separate from said frame portion; and a plurality of transverse members each extending orthogonal to said plurality of longitudinal members in a…

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What does patent US9196992B2 cover?
A connector capable of realizing a narrower pitch of contact members, and suppressing displacement of the contact members. A connector comprises a frame and a plurality of contact members held by the frame. The contact members held by the frame are elastically deformed by being sandwiched between an IC package and a printed board. At this time, terminal portions of the IC package and terminal p…
Who is the assignee on this patent?
Japan Aviation Electron
What technology area does this patent fall under?
Primary CPC classification H01R12/714. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Nov 24 2015 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).