Stand for supporting solar panels on a flat roof
US-9194612-B2 · Nov 24, 2015 · US
US9577129B1 · US · B1
| Field | Value |
|---|---|
| Publication number | US-9577129-B1 |
| Application number | US-201414306008-A |
| Country | US |
| Kind code | B1 |
| Filing date | Jun 16, 2014 |
| Priority date | Jun 16, 2014 |
| Publication date | Feb 21, 2017 |
| Grant date | Feb 21, 2017 |
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A method of bonding solar cell component to a support and the solar cell assembly thus obtained. The method of bonding solar cell component to a support comprises: disposing metallized traces on the support; dispensing bonding adhesive on front of the support or on back of the solar cell component; and laying down the solar cell component on the support and soldering the solar cell component to the metallized traces on the support. The support is a glass support with integrated circuits.
Opening claim text (preview).
What is claimed is: 1. A method of bonding solar cell component to a support, the method comprising: a. disposing metallized traces on the support, wherein the support is a glass support with metallized integrated circuit traces; b. dispensing bonding adhesive on front of the glass support or on back of the solar cell component; and c. laying down the solar cell component on the glass support such that the bonding adhesive is between the glass support and the solar cell component, and soldering the solar cell component to the metallized traces on the glass support. 2. The method of claim 1 , wherein the glass support has a thickness between 25 μm and 250 μm. 3. The method of claim 1 , wherein the glass support is flexible, having a bend stress less than 200 millipascal for a bend radius greater than 10 cm. 4. The method of claim 1 wherein the glass support comprises alkali-free borosilicate. 5. The method of claim 1 wherein the metallized integrated circuit traces are internal to the glass support. 6. The method of claim 1 wherein the bonding adhesive is dispensed in a pattern on the front of the glass support or on the back of the solar cell component. 7. The method of claim 6 wherein the pattern includes lines of bonding adhesive that intersect a central line of bonding adhesive. 8. The method of claim 1 wherein the bonding adhesive is dispensed in a pattern on the front of the glass support or on the back of the solar cell component. 9. The method of claim 8 wherein the pattern includes lines of bonding adhesive that intersect a central line of bonding adhesive. 10. A method of bonding solar cell component to a support, the method comprising: a. disposing metallized traces on the support, wherein the support is a glass support with metallized integrated circuit traces; b. disposing a polyimide intermediate layer on front of the glass support with the metallized traces exposed; c. dispensing bonding adhesive on front of the polyimide intermediate layer or on back of the solar cell component; and d. laying down the solar cell component over the glass support such that the bonding adhesive is between the polyimide intermediate layer and the solar cell component, and soldering the solar cell component to the metallized traces on the glass support. 11. The method of claim 10 , wherein the glass support has a thickness between 25 μm and 250 μm. 12. The method of claim 10 , wherein the glass support is flexible, having a bend stress less than 200 millipascal for a bend radius greater than 10 cm. 13. The method of claim 10 wherein the metallized integrated circuit traces are internal to the glass support.
Photovoltaic [PV] energy · CPC title
Electricity · mapped topic
the metallic or insulating substrates being flexible · CPC title
for photovoltaic devices or modules · CPC title
Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title
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