Flexible glass support for a solar cell assembly

US9577129B1 · US · B1

Patent metadata
FieldValue
Publication numberUS-9577129-B1
Application numberUS-201414306008-A
CountryUS
Kind codeB1
Filing dateJun 16, 2014
Priority dateJun 16, 2014
Publication dateFeb 21, 2017
Grant dateFeb 21, 2017

How to read this patent

A practical reading order for non-experts. Skip the full description unless you need deep technical detail.

  1. Title

    What the patent document calls the invention.

  2. Abstract

    A short plain-language summary of the technical disclosure.

  3. Assignees and inventors

    Who owns or filed the patent and who is credited as inventor.

  4. Key dates

    Filing, priority, publication, and grant dates set the timeline.

  5. First independent claim

    The legal scope of protection — read this for what is actually claimed.

  6. CPC / IPC classifications

    Technology tags used to group this patent with similar filings.

  7. Citations and related patents

    Prior art links and similar publications in this corpus.

Abstract

Official abstract text for this publication.

A method of bonding solar cell component to a support and the solar cell assembly thus obtained. The method of bonding solar cell component to a support comprises: disposing metallized traces on the support; dispensing bonding adhesive on front of the support or on back of the solar cell component; and laying down the solar cell component on the support and soldering the solar cell component to the metallized traces on the support. The support is a glass support with integrated circuits.

First claim

Opening claim text (preview).

What is claimed is: 1. A method of bonding solar cell component to a support, the method comprising: a. disposing metallized traces on the support, wherein the support is a glass support with metallized integrated circuit traces; b. dispensing bonding adhesive on front of the glass support or on back of the solar cell component; and c. laying down the solar cell component on the glass support such that the bonding adhesive is between the glass support and the solar cell component, and soldering the solar cell component to the metallized traces on the glass support. 2. The method of claim 1 , wherein the glass support has a thickness between 25 μm and 250 μm. 3. The method of claim 1 , wherein the glass support is flexible, having a bend stress less than 200 millipascal for a bend radius greater than 10 cm. 4. The method of claim 1 wherein the glass support comprises alkali-free borosilicate. 5. The method of claim 1 wherein the metallized integrated circuit traces are internal to the glass support. 6. The method of claim 1 wherein the bonding adhesive is dispensed in a pattern on the front of the glass support or on the back of the solar cell component. 7. The method of claim 6 wherein the pattern includes lines of bonding adhesive that intersect a central line of bonding adhesive. 8. The method of claim 1 wherein the bonding adhesive is dispensed in a pattern on the front of the glass support or on the back of the solar cell component. 9. The method of claim 8 wherein the pattern includes lines of bonding adhesive that intersect a central line of bonding adhesive. 10. A method of bonding solar cell component to a support, the method comprising: a. disposing metallized traces on the support, wherein the support is a glass support with metallized integrated circuit traces; b. disposing a polyimide intermediate layer on front of the glass support with the metallized traces exposed; c. dispensing bonding adhesive on front of the polyimide intermediate layer or on back of the solar cell component; and d. laying down the solar cell component over the glass support such that the bonding adhesive is between the polyimide intermediate layer and the solar cell component, and soldering the solar cell component to the metallized traces on the glass support. 11. The method of claim 10 , wherein the glass support has a thickness between 25 μm and 250 μm. 12. The method of claim 10 , wherein the glass support is flexible, having a bend stress less than 200 millipascal for a bend radius greater than 10 cm. 13. The method of claim 10 wherein the metallized integrated circuit traces are internal to the glass support.

Assignees

Inventors

Classifications

  • Photovoltaic [PV] energy · CPC title

  • Electricity · mapped topic

  • the metallic or insulating substrates being flexible · CPC title

  • for photovoltaic devices or modules · CPC title

  • Manufacture or treatment of devices covered by this subclass (patterning processes to connect thin photovoltaic cells in integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/33; manufacture or treatment of encapsulations or containers for integrated devices, or assemblies of multiple devices, having photovoltaic cells H10F19/80; manufacture or treatment of integrated devices, or assemblies of multiple devices, comprising at least one element in which radiation controls the flow of current H10F39/00) · CPC title

Patent family

Related publications grouped by family.

External sources

Frequently asked questions

Answers are generated from the same data shown on this page.

What does patent US9577129B1 cover?
A method of bonding solar cell component to a support and the solar cell assembly thus obtained. The method of bonding solar cell component to a support comprises: disposing metallized traces on the support; dispensing bonding adhesive on front of the support or on back of the solar cell component; and laying down the solar cell component on the support and soldering the solar cell component to…
Who is the assignee on this patent?
Solaero Tech Corp
What technology area does this patent fall under?
Primary CPC classification H01L31/0422. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 21 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B1). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).