Transistor and method of making

US9570595B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9570595-B2
Application numberUS-201213704613-A
CountryUS
Kind codeB2
Filing dateDec 14, 2012
Priority dateDec 14, 2012
Publication dateFeb 14, 2017
Grant dateFeb 14, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A SiGe HBT has an inverted heterojunction structure, where the emitter layer is formed prior to the base layer and the collector layer. The frequency performance of the SiGe HBT is significantly improved through a better thermal process budget for the base profile, essential for higher cut-off frequency (f T ) and a minimal collector-base area for a reduced parasitic capacitance, essential for higher maximum oscillation frequency (f max ). This inverted heterojunction structure can be fabricated by using ALE processes to form an emitter on a preformed epitaxial silicide, a base over the emitter and a collector over the base.

First claim

Opening claim text (preview).

We claim: 1. A method of making an HBT for operating in the TeraHertz Gap, comprising: epitaxially growing a single crystal metal silicide layer on a semiconductor substrate; epitaxially growing a single crystal silicon emitter on the metal silicide layer; epitaxially growing a base over the emitter; and epitaxially growing a single crystal silicon collector on the base; wherein the emitter is grown using an atomic layer epitaxy (ALE) process; wherein photons from a laser source are used during the ALE process to help release hydrogen atoms from a substrate surface. 2. The method of claim 1 , wherein the metal silicide layer is NiSi 2 grown on Si(100) using a solid-state reaction (SSR) epitaxy process. 3. The method of claim 1 , wherein the SSR process comprises sputter-deposition of a Ni film that is equal to or less than about ˜2-nm thick followed by heat treatment. 4. The method of claim 1 , wherein the emitter is in situ doped with carbon during the ALE process.

Assignees

Inventors

Classifications

  • Silicon, silicon germanium or germanium · CPC title

  • using chemical vapour deposition [CVD] · CPC title

  • Monocrystalline · CPC title

  • Doping during depositing · CPC title

  • Physical vapour deposition [PVD] · CPC title

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Frequently asked questions

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What does patent US9570595B2 cover?
A SiGe HBT has an inverted heterojunction structure, where the emitter layer is formed prior to the base layer and the collector layer. The frequency performance of the SiGe HBT is significantly improved through a better thermal process budget for the base profile, essential for higher cut-off frequency (f T ) and a minimal collector-base area for a reduced parasitic capacitance, essential for …
Who is the assignee on this patent?
Wu Dongping, Fu Chaochao, Zhang Wei, and 2 more
What technology area does this patent fall under?
Primary CPC classification H01L29/7378. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Feb 14 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 8 related publications on this page (citations in our corpus or others sharing the same primary CPC).