Multilevel memory stack structure with joint electrode having a collar portion and methods for manufacturing the same

Patent metadata

Field	Value
Publication number	US-9570463-B1
Application number	US-201514883966-A
Country	US
Kind code	B1
Filing date	Oct 15, 2015
Priority date	Oct 15, 2015
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A three-dimensional memory device including multiple stack structures can be formed with a joint region electrode, which is an electrode formed at a joint region located near the interface between an upper stack structure and a lower stack structure. A memory stack structure is formed through the multiple stack structures. The joint region electrode laterally surrounds a portion of the memory stack structure in proximity to the interface between different stack structures. The joint region electrode includes a layer portion having a thickness and a collar portion that laterally surrounds the memory stack structure and having a greater vertical extent than the thickness of the layer portion. The increased vertical extent of the collar portion with respect to the vertical extent of the layer portion provides enhanced control of a portion of a semiconductor channel in the memory stack structure located near the interface between different stack structures.

First claim

What is claimed is:

1. A monolithic three-dimensional memory device comprising:
a lower stack structure comprising a first alternating stack including first insulating layers and first electrically conductive control gate layers and located over a substrate;
an upper stack structure comprising a second alternating stack including second insulating layers and second electrically conductive control gate layers and located over the lower stack structure;
a memory stack structure extending through the lower stack structure and the upper stack structure; and
an electrode overlying the first electrically conductive layers and underlying the second electrically conductive layers, and comprising a layer portion having a thickness and a collar portion that laterally surrounds the memory stack structure and having a greater vertical extent than the thickness of the layer portion.

2. The monolithic three-dimensional memory device of claim 1 , wherein a topmost horizontal surface of the collar portion is located above a horizontal plane including a top surface of the layer portion of the electrode.

3. The monolithic three-dimensional memory device of claim 2 , wherein the topmost horizontal surface of the collar portion is within a same horizontal plane as a top surface of a topmost insulator layer within the lower stack structure.

4. The monolithic three-dimensional memory device of claim 2 , wherein a bottommost horizontal surface of the collar portion is located above a horizontal plane including a bottom surface of the layer portion.

5. The monolithic three-dimensional memory device of claim 2 , wherein the collar portion has an upper tapered sidewall and a lower tapered sidewall having a less taper angle than the upper tapered sidewall.

6. The monolithic three-dimensional memory device of claim 2 , wherein the collar portion comprises a doped semiconductor material.

7. The monolithic three-dimensional memory device of claim 6 , wherein the layer portion comprises another doped semiconductor material having a same or a different material composition than the semiconductor material of the collar portion.

8. The monolithic three-dimensional memory device of claim 2 , wherein the electrode comprises a different material than the first electrically conductive layers.

9. The monolithic three-dimensional memory device of claim 1 , wherein a topmost horizontal surface of the collar portion and a top surface of the layer portion are within a same horizontal plane.

10. The monolithic three-dimensional memory device of claim 9 , wherein a bottommost horizontal surface of the collar portion is located within a horizontal plane including an interface between the lower stack structure and the upper stack structure and below a bottom of the layer portion.

11. The monolithic three-dimensional memory device of claim 9 , wherein the collar portion has a vertical outer sidewall and a vertical inner sidewall.

12. The monolithic three-dimensional memory device of claim 9 , wherein the collar portion comprises a same conductive material as the layer portion.

13. The monolithic three-dimensional memory device of claim 9 , wherein the electrode contacts a top surface and a sidewall surface of a bottommost layer in the upper stack structure.

14. The monolithic three-dimensional memory device of claim 1 , wherein the memory stack structure comprises, from inside to outside:
a semiconductor channel;
a tunneling dielectric layer laterally surrounding the semiconductor channel; and
charge storage regions laterally surrounding the tunneling dielectric layer.

15. The monolithic three-dimensional memory device of claim 14 , wherein the electrode is a dummy word line to which voltage is applied to generate a depletion region in a joint region of the semiconductor channel between the upper stack and the lower stack.

16. The monolithic three-dimensional memory device of claim 1 , wherein:
each second electrically conductive layer that underlies at least another second electrically conductive layer laterally extends farther than any overlying layer among the second electrically conductive layers;
each first electrically conductive layer that underlies at least another first electrically conductive layer laterally extends farther than any overlying layer among the first electrically conductive layers;
the lower stack structure further comprises a first dielectric material portion located on, and over, first stepped surfaces of the first alternating stack;
the upper stack structure further comprises a second dielectric material portion located on, and over, second stepped surfaces of the second alternating stack;
the first stepped surfaces and the second stepped surfaces are located within a contact region; and
a subset of control gate contact via structures extends through the first dielectric material portion and the second dielectric material portion.

17. The monolithic three-dimensional memory device of claim 1 , wherein:
the thickness of the layer portion of the electrode comprises a uniform thickness; and
the first and the second electrically conductive control gate layers have a uniform thickness and no collar portion.

18. The monolithic three-dimensional memory device of claim 1 , wherein:
the monolithic three-dimensional memory structure comprises a monolithic three-dimensional NAND memory device;
the first and second electrically conductive layers comprise, or are electrically connected to, a respective word line of the monolithic three-dimensional NAND memory device;
the substrate comprises a silicon substrate;
the monolithic three-dimensional NAND memory device comprises an array of monolithic three-dimensional NAND strings over the silicon substrate;
at least one memory cell in a first device level of the array of monolithic three-dimensional NAND strings is located over another memory cell in a second device level of the array of monolithic three-dimensional NAND strings;
the silicon substrate contains an integrated circuit comprising a driver circuit for the memory device located thereon; and
the array of monolithic three-dimensional NAND strings comprises:
a plurality of semiconductor channels, wherein at least one end portion of each of the plurality of semiconductor channels extends substantially perpendicular to a top surface of the substrate;
a plurality of charge storage elements, each charge storage element located adjacent to a respective one of the plurality of semiconductor channels; and
a plurality of control gate electrodes having a strip shape extending substantially parallel to the top surface of the substrate, the plurality of control gate electrodes comprise at least a first control gate electrode located in the first device level and a second control gate electrode located in the second device level.

Assignees

• Sandisk Technologies Inc
• Sandisk Technologies Llc

Inventors

• Zhang Yanli
• Makala Raghuveer S
• Liu Jin
• Chowdhury Murshed
• Lee Yao-Sheng
• Alsmeier Johann

Classifications

• H01L27/11582 Primary

  Electricity · mapped topic

• H01L27/1157

  Electricity · mapped topic

• H10D30/025

  of vertical IGFETs (of VDMOS H10D30/0291; of vertical TFTs H10D30/0318) · CPC title

• H10B43/40

  characterised by the peripheral circuit region · CPC title

• H10B43/27 Primary

  the channels comprising vertical portions, e.g. U-shaped channels · CPC title