Heat-conductive connection arrangement

Patent metadata

Field	Value
Publication number	US-9568259-B2
Application number	US-201414501273-A
Country	US
Kind code	B2
Filing date	Sep 30, 2014
Priority date	Sep 30, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

A heat-conductive connection arrangement for connecting a printed circuit board to a cooling body. The connection arrangement has a carrier which is flat. At least part of the carrier includes at least one balloon body which faces away from the carrier and is connected to the carrier. The balloon body includes an envelope which encloses an interior, and the interior is at least in part filled with a preferably free-flowing, in particular viscous, heat-conducting substance. The envelope is configured so as to tear open under the influence of pressure and to thus release the heat-conducting substance.

First claim

What is claimed is:

1. A connection arrangement, comprising:
at least one electronic component to be cooled;
at least one cooling body; and
at least one connection means for connecting a printed circuit board to the at least one cooling body, having a carrier that is substantially flat, wherein at least part of the carrier includes at least one balloon body which faces away from the carrier and is connected directly to the carrier, wherein the balloon body includes an envelope which encloses an interior, wherein the interior is at least in part filled with a viscous heat-conducting means and the envelope having a structure that tears open under the influence of pressure and thus release the heat-conducting means, and
wherein the at least one cooling body includes a recess in which the connection means is disposed, and the at least one electronic component is at least indirectly connected in a heat-conducting manner to the cooling body by means of the at least one connection means.

2. The connection means according to claim 1 , wherein the carrier further comprises a fabric.

3. The connection means according to claim 1 , wherein the carrier further comprises a carrier film.

4. The connection means according to claim 1 , wherein the envelope is formed by a plastic envelope.

5. The connection means according to claim 1 , wherein the connection means further includes at least one pin which, under the influence of pressure on the carrier, is configured and disposed so as to penetrate the envelope and to thus release the heat-conducting means.

6. The connection means according to claim 1 , wherein the envelope is formed by a polyimide film.

7. The connection means according to claim 1 , wherein the balloon body is configured so as to be spherically shaped or pillow-shaped.

8. The connection arrangement according to claim 1 , wherein the carrier further comprises a plastic film.

Assignees

• Bosch Gmbh Robert

Inventors

• Mayer Frank
• Jerg Juergen

Classifications

• F28F21/00 Primary

  Constructions of heat-exchange apparatus characterised by the selection of particular materials {(coatings for modifying heat-transfer F28F13/18; coatings for preventing the formation of deposits or corrosion F28F19/02)} · CPC title

• H05K7/20472 Primary

  Sheet interfaces · CPC title

• H05K1/0206

  by printed thermal vias · CPC title