Heat-transfer structure

Patent metadata

Field	Value
Publication number	US-9308571-B2
Application number	US-201414491360-A
Country	US
Kind code	B2
Filing date	Sep 19, 2014
Priority date	Jun 20, 2008
Publication date	Apr 12, 2016
Grant date	Apr 12, 2016

Abstract

An apparatus comprising a first substrate having a first surface, a second substrate having a second surface facing the first surface and an array of metallic raised features being in contact with the first surface to the second surface, a portion of the raised features having a mechanical bend or buckle plastic deformation produced therein via a compressive force. One or more of the metallic raised features has one or more surface singularities therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force.

First claim

What is claimed is:

1. An apparatus, comprising:
a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the one or more surface singularities are configured as caldera.

2. The apparatus of claim 1 , wherein the metallic raised features are hollow.

3. The apparatus of claim 1 , wherein there are at least two groups of the metallic raised features having two different heights.

4. The apparatus of claim 1 , wherein
the first substrate is a first integrated circuit having a first surface; and
the second substrate is a second integrated circuit having a second surface, each of the first and second surfaces being in direct physical contact with deformable ones of the raised features of one of the arrays.

5. The apparatus of claim 1 , wherein the mechanically deformable metallic raised features provide physical connections between portions of a region of the first surface and the second surface, wherein the region of the first surface is non-planar.

6. The apparatus of claim 1 , wherein the one or more surface singularities are in a vicinity of initial locations of the mechanical bend or the buckle plastic deformation.

7. An apparatus, comprising:
a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the metallic raised features include a first cone-shaped portion and a second inverted cone-shaped portion and the surface singularity is located at a connection point between the first cone-shaped portion and the second inverted cone-shaped portion.

8. An apparatus, comprising:
a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the metallic raised features include a plurality of merged cone-shaped features and the surface singularities are located at discontinuous merger points between adjacent one of the merged cone-shaped features.

9. The apparatus of claim 8 , wherein the metallic raised features are cones.

10. An apparatus, comprising:
a metallic planar substrate having a front surface and a back surface, the back surface being opposite the front surface;
an array of metallic raised features located directly on each of the front and back surfaces, wherein a portion of the raised features are configured to be mechanically bend or buckle plastically deformable via a compressive force applied between a first substrate and a second substrate, wherein one or more of the metallic raised features has a surface singularity therein prior to the mechanical bend or the buckle plastic deformation produced by the compressive force and wherein the surface singularities are located at cross-cut points in the length of the metallic raised feature.

11. The apparatus of claim 10 , wherein the metallic raised feature. are fins.

12. The apparatus of claim 10 , wherein the metallic raised features are posts.

Assignees

• Alcatel Lucent

Inventors

• Kempers Roger Scott
• Krishnan Shankar
• Lyons Alan Michael
• Salamon Todd Richard

Classifications

• H10W90/288

  characterised by arrangements for thermal management of the stacked chips · CPC title

• H10W90/231

  the stacked chips being on both top and bottom sides of an auxiliary carrier having no electrical connection structure · CPC title

• H10W90/00

  Package configurations · CPC title

• H10W72/01

  Manufacture or treatment · CPC title

• H10W72/00

  Interconnections or connectors in packages · CPC title