Method of processing substrate, method of manufacturing semiconductor device, recording medium, and substrate processing apparatus
US-2024234132-A1 · Jul 11, 2024 · US
US9567670B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9567670-B2 |
| Application number | US-201414584034-A |
| Country | US |
| Kind code | B2 |
| Filing date | Dec 29, 2014 |
| Priority date | Oct 16, 2010 |
| Publication date | Feb 14, 2017 |
| Grant date | Feb 14, 2017 |
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An ALD coating method to provide a coating surface on a substrate is provided. The ALD coating method comprises: providing a deposition heading including a unit cell having a first precursor nozzle assembly and a second precursor nozzle assembly; emitting a first precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; emitting a second precursor from the first precursor nozzle assembly into chamber under atmospheric conditions in a direction substantially normal to the coating surface; removing moving the substrate under the deposition head such that the first precursor is directed onto a first area of the coating surface prior to the second precursor being directed onto the first area of the coating surface.
Opening claim text (preview).
What is claimed: 1. A deposition system for coating a surface of a substrate under atmospheric conditions comprising: a substrate including a coating surface; a first precursor supply system including a first gas flow regulator; a second precursor supply system including a second gas flow regulator, wherein the first and second gas flow regulators are independently controllable; an inert gas supply system including a third gas flow regulator; a deposition head including a unit cell having a first precursor nozzle assembly, a second precursor nozzle assembly, a first inert gas nozzle assembly disposed between the first precursor nozzle assembly and the second precursor nozzle assembly, and a first exhaust channel arranged between the first precursor nozzle assembly and the first inert gas nozzle assembly and a second exhaust channel arranged between the second precursor nozzle assembly and the first inert gas nozzle assembly, wherein the first precursor nozzle assembly is in fluid communication with the first gas flow regulator and the first precursor nozzle is arranged so as to emit a first precursor into atmospheric conditions in a direction substantially normal to the coating surface wherein the second precursor nozzle assembly is in fluid communication with the second gas flow regulator and the second precursor nozzle is arranged so as to emit a second precursor into atmospheric conditions in a direction substantially normal to the coating surface, wherein the first precursor and the second precursor are dissimilar precursors, and wherein the first inert gas nozzle assembly in in fluid communication with the third gas flow regulator; and an actuator associated with the deposition head and/or the substrate, the actuator configured to generate relative motion between the deposition head and the substrate for exposing a first area of the coating surface to the first precursor followed by exposing the first area of the coating surface to the second precursor. 2. The system of claim 1 , wherein the first exhaust channel is isolated from the second exhaust channel. 3. The system of claim 2 , wherein the deposition head includes multiple unit cells. 4. The system of claim 3 wherein the system further includes first and second exhaust collection manifolds, wherein the first exhaust channel of each unit cell is in fluid communication with the first exhaust collection manifold and the second exhaust channel of each unit cell is in fluid communication with the second exhaust collection manifold such that the outflows from the first and second exhaust channels of the unit cells are kept from coming into contact with one another. 5. The system of claim 4 wherein the system further comprises an exhaust gas collection module in separate fluid communication with each of the first and second exhaust collection manifolds and configured to separately process the respective outflows therefrom in order to separately reclaim a different unreacted precursor from each respective outflow. 6. The system of claim 1 , wherein the actuator comprises a mechanical linear displacement mechanism associated with the substrate. 7. The system of claim 6 , wherein the mechanical linear displacement mechanism associated with the substrate is configured to advance the substrate past the deposition head at a velocity in the range of 3 to 35 meters/minute. 8. The system of claim 1 , wherein the unit cell is configured with a channel width ranging from 0.7 - 1.5 mm. 9. The system of claim 1 , wherein the deposition system is configured to operate with a Dwell Time ranging from 5-50 msec. 10. The system of claim 1 , wherein the deposition head is separated from the coating surface by a distance of between 0.5 and 5 mm. 11. The system of claim 1 , wherein each nozzle assembly comprises a precursor orifice plate including one or more orifices passing through the precursor orifice plate wherein the location where gas exits from the one or more orifices is separated from the coating surface by a distance of between 0.5 and 5 mm. 12. The system of claim 1 , wherein the first precursor nozzle assembly, the second precursor nozzle assembly and the inert gas nozzle assembly each comprise a precursor orifice plate including one or more orifices passing through the precursor orifice plate along a normal axis to the coating surface wherein, the precursor orifice plate separates chambers filled with pressurized gas from atmospheric conditions and wherein each of the one or more orifices is sized to cause choked gas flow exiting from the chambers filled with pressurized gas. 13. The system of claim 1 wherein the unit cell further comprises a second inert gas nozzle assembly disposed such that the first precursor nozzle assembly is disposed between the first inert gas nozzle assembly and the second inert gas nozzle assembly.
Nozzles for more than one gas · CPC title
the substrate being rotated · CPC title
passing the reaction gases through burners or torches, e.g. atmospheric pressure CVD (C23C16/513 takes precedence; for flame or plasma spraying of coating material in the molten state C23C4/00) · CPC title
characterized by the apparatus · CPC title
for coating elongated substrates · CPC title
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