Thermosetting resin composition

Patent metadata

Field	Value
Publication number	US-9567435-B2
Application number	US-201414778164-A
Country	US
Kind code	B2
Filing date	Mar 18, 2014
Priority date	Mar 25, 2013
Publication date	Feb 14, 2017
Grant date	Feb 14, 2017

Abstract

There is provided novel thermosetting resin composition. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1):

{wherein each of R 1 and R 2 is independently a hydrogen atom or a C 1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2):

(wherein Z 1 is a carbonyl group or a —CONH— group, Z 2 is a C 1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z 3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C 1-5 alkyl group)}.

First claim

The invention claimed is:

1. A thermosetting resin composition comprising a polymer having at least one structural unit of the following Formula (1):

{wherein each of R 1 and R 2 is independently a hydrogen atom or a C 1-4 alkyl group, X is a single bond or a divalent organic group, and Y is an arylene group of the following Formula (2):

(wherein Z 1 is a carbonyl group or a —CONH— group, Z 2 is a C 1-5 alkylene group or a 5- or 6-membered divalent saturated heterocyclic group containing at least one nitrogen atom, and Z 3 is a 5- or 6-membered aromatic heterocyclic group containing two nitrogen atoms in which at least one of hydrogen atoms may be substituted by a C 1-5 alkyl group)}.

2. The thermosetting resin composition according to claim 1 , wherein Z 3 in Formula (2) is an imidazoryl group.

3. The thermosetting resin composition according to claim 1 , wherein Z 2 in Formula (2) is a C 1-5 alkylene group.

4. The thermosetting resin composition according to claim 1 , wherein Z 1 in Formula (2) is a —CONH— group.

5. The thermosetting resin composition according to claim 1 , wherein X in Formula (1) is a divalent organic group containing a C 1-6 alkylene group in which at least one of hydrogen atoms may be substituted by a halogen atom, a cyclic alkylene group, an arylene group in which at least one of hydrogen atoms may be substituted by a halogen atom, a sulfonyl group, a carbonyl group, a —O— group, or a —COO— group.

6. The thermosetting resin composition according to claim 1 , wherein X in Formula (1) is a divalent organic group of the following Formula (3):

(wherein each of R 3 and R 4 is independently a hydrogen atom or a methyl group in which at least one of hydrogen atoms may be substituted by a halogen atom, and m is 0 or 1).

7. The thermosetting resin composition according to claim 6 , wherein the divalent organic group of Formula (3) is the following Formula (3-a) or (3-b):

8. The thermosetting resin composition according to claim 1 , wherein the polymer further has a structural unit of Formula (4):

{wherein R 1 , R 2 , and X are the same as the definitions according to claim 1 , and Q is a divalent organic group of the following Formula (5) or (6):

(wherein T is a single bond, a sulfonyl group, or a —O— group, each of R 3 and R 4 is independently a hydrogen atom or a methyl group in which at least one of hydrogen atoms may be substituted by a halogen atom, four R 5 are each independently a hydrogen atom, a methyl group, an ethyl group, or a methoxy group, and n is 0 or 1)}.

9. The thermosetting resin composition according to claim 8 , wherein the divalent organic group of Formula (5) or (6) is the following Formula (5-a), (6-a), (6-b) or (6-c):

10. The thermosetting resin composition according to claim 1 , wherein the polymer has a weight average molecular weight of 1,000 to 100,000.

11. The thermosetting resin composition according to claim 1 , further comprising an epoxy resin.

12. The thermosetting resin composition according to claim 1 , further comprising a solvent.

13. The thermosetting resin composition according to claim 1 , which is an adhesive composition or an underfill composition.

14. The thermosetting resin composition according to claim 1 , further comprising a silane coupling agent.

15. The thermosetting resin composition according to claim 1 , further comprising inorganic fillers with a particle diameter of 1 nm or more and 700 nm or less.

Assignees

• Nissan Chemical Ind Ltd

Inventors

• Tamura Mamoru
• Ohashi Takuya
• Enomoto Tomoyuki

Classifications

• C09J163/00

  Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins · CPC title

• C08G59/40

  characterised by the curing agents used · CPC title

• C08L63/00

  Compositions of epoxy resins; Compositions of derivatives of epoxy resins · CPC title

• C09J161/34

  Condensation polymers of aldehydes or ketones with monomers covered by at least two of the groups C09J161/04, C09J161/18 and C09J161/20 · CPC title

• C08K3/013

  Fillers, pigments or reinforcing additives · CPC title