Environmental sensitive electronic device package

Patent metadata

Field	Value
Publication number	US-9565793-B2
Application number	US-201314051460-A
Country	US
Kind code	B2
Filing date	Oct 11, 2013
Priority date	Oct 31, 2012
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

An environmental sensitive electronic device package including a first substrate, a second substrate, an environmental sensitive electronic device, at least one first side wall barrier structure, at least one thermal protrusion, and a first filler layer is provided. The second substrate is disposed above the first substrate. The environmental sensitive electronic device is disposed on the first substrate and located between the first substrate and the second substrate. The first side wall barrier structure is disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device. The thermal protrusion is located on the second substrate. The first filler layer is located between the first substrate and the second substrate and covers the environmental sensitive electronic device, the first side wall barrier structure, and the thermal protrusion.

First claim

What is claimed is:

1. An environmental sensitive electronic device package, comprising:
a first substrate;
a second substrate disposed above the first substrate;
an environmental sensitive electronic device disposed on the first substrate and located between the first substrate and the second substrate;
at least one first side wall barrier structure disposed on the second substrate and located between the first substrate and the second substrate, wherein the first side wall barrier structure is located on at least one side of the environmental sensitive electronic device;
at least one thermal protrusion located on the second substrate, wherein the at least one thermal protrusion protrudes from the second substrate toward the environmental sensitive electronic device, and the at least one thermal protrusion is overlapped with the environmental sensitive electronic device; and
a first filler layer located between the first substrate and the second substrate, wherein the first filler layer covers the environmental sensitive electronic device, the thermal protrusion, and the first side wall barrier structure.

2. The environmental sensitive electronic device package according to claim 1 , wherein the first side wall barrier structure comprises a closed structure that surrounds the environmental sensitive electronic device, and the first side wall barrier structure surrounds the thermal protrusion.

3. The environmental sensitive electronic device package according to claim 1 , wherein a cross-section of the first side wall barrier structure is in a shape of a trapezoid, rectangle, polygon, circle or ellipse, and the cross-section is perpendicular to the first substrate.

4. The environmental sensitive electronic device package according to claim 1 , wherein a base area of the thermal protrusion is in a shape of a square, rectangle, polygon, circle or ellipse.

5. The environmental sensitive electronic device package according to claim 1 , wherein the thermal protrusion is arranged in array on the second substrate.

6. The environmental sensitive electronic device package according to claim 1 , wherein the first filler layer comprises a heat conductive material.

7. The environmental sensitive electronic device package according to claim 1 further comprising a conductive wire, wherein the conductive wire is disposed on the first substrate and located between the first substrate and the second substrate, and is electrically connected to the environmental sensitive electronic device.

8. The environmental sensitive electronic device package according to claim 1 further comprising:
a third substrate disposed below the first substrate, wherein the first substrate is located between the second substrate and the third substrate;
at least one second side wall barrier structure disposed on the third substrate and located between the first substrate and the third substrate;
a thermal layer disposed on the third substrate and located between the first substrate and the third substrate, wherein the thermal layer covers the third substrate and the second side wall barrier structure;
a thermal structure disposed on the first substrate and located between the first substrate and the third substrate, wherein the thermal structure surrounds the second side wall barrier structure, and the thermal structure is engaged with the thermal layer on the third substrate; and
a second filler layer located between the first substrate and the third substrate, wherein the second filler layer covers the second side wall barrier structure.

9. The environmental sensitive electronic device package according to claim 8 , wherein the thermal structure comprises a closed structure that surrounds the environmental sensitive electronic device.

10. The environmental sensitive electronic device package according to claim 8 , wherein the thermal structure comprises a structure comprising a plurality of separated patterns that surrounds the environmental sensitive electronic device.

11. The environmental sensitive electronic device package according to claim 8 , wherein the thermal layer is a heat conductive material.

12. The environmental sensitive electronic device package according to claim 8 , wherein the second filler layer comprises a heat conductive material.

13. The environmental sensitive electronic device package according to claim 8 further comprising a case, wherein the first substrate, the second substrate, and the third substrate are installed in the case.

14. The environmental sensitive electronic device package according to claim 8 , wherein a cross-section of the second side wall barrier structure is in a shape of a trapezoid, rectangle, polygon, circle or ellipse, and the cross-section is perpendicular to the first substrate.

Assignees

• Ind Tech Res Inst

Inventors

• Chen Kuang-Jung
• Ho Jia-Chong

Classifications

• H10K59/8794

  Arrangements for heating and cooling · CPC title

• H10K59/874

  including getter material or desiccant · CPC title

• H05K1/0201

  Thermal arrangements, e.g. for cooling, heating or preventing overheating · CPC title

• H01L51/5246

  Electricity · mapped topic

• H01L2924/00

  Electricity · mapped topic