Alkali silicate glass based coating and method for applying

Patent metadata

Field	Value
Publication number	US-9565758-B2
Application number	US-201314140192-A
Country	US
Kind code	B2
Filing date	Dec 24, 2013
Priority date	Aug 23, 2006
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A coating for reducing interaction between a surface and the environment around the surface includes an alkali silicate glass material configured to protect the surface from environmental corrosion due to water or moisture. The alkali silicate glass material is doped with a first element to affect various forms of radiation passing through the coating. The electromagnetic radiation is at least one of ultraviolet, x-ray, atomic (gamma, alpha, beta), and electromagnetic or radio wave radiation. The coating may also be used to protect a solar cell from the environment and UV rays while retransmitting received light as usable light for conversion into electrical energy. The coating may also be used to prevent whisker formation in metal finishes of tin, cadmium, zinc, etc.

First claim

What is claimed is:

1. A method for preventing the oxidation of a solder joint or electrical interconnect of an electronic device, comprising:
applying an alkali silicate glass material solution to the soldering joint or electrical interconnect; and
curing the alkali silicate glass material solution at a temperature less than or equal to approximately 160° C. to form an alkali silicate glass based coating on the soldering joint or electrical interconnect.

2. The method of claim 1 , wherein the alkali silicate glass based coating is applied to the soldering joint, the soldering joint being a lead free soldering joint.

3. The method of claim 2 , wherein the lead free soldering joint comprises a surface finish.

4. The method of claim 3 wherein the lead free soldering joint comprises a whisker and the coating covers the whisker.

5. The method of claim 4 , wherein the surface finish comprises tin, cadmium, or zinc.

6. The method of claim 1 , wherein the soldering joint is one of a plurality of a solder bumps provided upon a bottom surface of a circuit board and the alkali silicate glass coating provides a planar layer covering the solder bumps.

7. The method of claim 1 , wherein the alkali silicate glass based coating comprises at least one material selected from the group consisting of lithium silicate, sodium silicate, and potassium silicate.

8. The method of claim 7 , wherein the alkali silicate glass based coating comprises lithium silicate and potassium silicate.

9. The method of claim 1 , wherein the alkali silicate glass based coating comprises thermally conductive particles provided therein.

Assignees

• Rockwell Collins Inc

Inventors

• Lower Nathan P
• Boone Alan P
• Wilcoxon Ross K
• Hillman David D

Classifications

• H01F1/113

  in a bonding agent · CPC title

• B29D23/00

  Producing tubular articles (B29D24/00 takes precedence) · CPC title

• H01F1/083

  in a bonding agent · CPC title

• C23D5/00

  Coating with enamels or vitreous layers · CPC title

• C09D1/02 Primary

  alkali metal silicates · CPC title