Polishing agent, polishing method, and liquid additive for polishing

Patent metadata

Field	Value
Publication number	US-2016222253-A1
Application number	US-201615014296-A
Country	US
Kind code	A1
Filing date	Feb 3, 2016
Priority date	Feb 4, 2015
Publication date	Aug 4, 2016
Grant date	—

Abstract

The present invention relates to a polishing agent including: cerium oxide particles; a water-soluble organic polymer having at least one selected from a carboxylic acid group and a salt of carboxylic acid; a water-soluble polyamide having at least one selected from a tertiary amino group and an oxyalkylene chain in a molecule thereof; and water, in which the polishing agent has a pH of 7 or less.

First claim

What is claimed is:

1 . A polishing agent comprising:
cerium oxide particles; a water-soluble organic polymer having at least one selected from a carboxylic acid group and a salt of carboxylic acid; a water-soluble polyamide having at least one selected from a tertiary amino group and an oxyalkylene chain in a molecule thereof; and water, wherein the polishing agent has a pH of 7 or less.

2 . The polishing agent according to claim 1 , wherein the water-soluble polyamide has the tertiary amino group in at least one selected from a main chain and a side chain thereof.

3 . The polishing agent according to claim 1 , wherein the water-soluble polyamide has the oxyalkylene chain in the main chain thereof.

4 . The polishing agent according to claim 1 , wherein the water-soluble polyamide is a copolymer obtained from at least one selected from aminoethyl piperazine and a modified polyalkylene glycol, and a lactam.

5 . The polishing agent according to claim 1 , wherein the water-soluble organic polymer contains at least one selected from polyacrylic acid and ammonium polyacrylate.

6 . The polishing agent according to claim 1 , wherein the water-soluble organic polymer has a weight average molecular weight of from 1,000 to 50,000.

7 . The polishing agent according to claim 1 , wherein the water-soluble polyamide is contained in an amount of from 0.00005 to 0.01 mass % based on a total amount of the polishing agent.

8 . The polishing agent according to claim 1 , wherein the water-soluble organic polymer is contained in an amount of from 0.01 to 0.5 mass % based on the total amount of the polishing agent.

9 . The polishing agent according to claim 1 , having the pH of from 4 to 6.5.

10 . The polishing agent according to claim 1 , wherein the cerium oxide particles have an average secondary particle size of from 0.01 to 0.5 μm.

11 . The polishing agent according to claim 1 , wherein the cerium oxide particles are contained in an amount of from 0.05 to 2 mass % based on the total amount of the polishing agent.

12 . A polishing method comprising: bringing a polishing pad into contact with a surface to be polished while supplying a polishing agent to perform polishing by relative movement therebetween,
wherein the surface to be polished including a surface comprising silicon oxide of a semiconductor substrate is polished using the polishing agent according to claim 1 as the polishing agent.

13 . A liquid additive for polishing, which is a liquid additive for preparing a polishing agent by mixing with a dispersion of cerium oxide particles, the liquid additive comprising:
a water-soluble organic polymer having at least one selected from a carboxylic acid group and a salt of carboxylic acid; a water-soluble polyamide having at least one selected from a tertiary amino group and an oxyalkylene chain in a molecule thereof; and water, wherein the liquid additive has a pH of 7 or less.

14 . The liquid additive for polishing according to claim 13 , wherein the water-soluble polyamide has at least one selected from: the tertiary amino group bonded to at least one selected from a main chain and a side chain thereof; and the oxyalkylene chain bonded to the main chain thereof.

15 . The liquid additive for polishing according to claim 13 , wherein the water-soluble polyamide is a copolymer obtained from at least one selected from aminoethyl piperazine and a modified polyalkylene glycol, and a lactam.

16 . The liquid additive for polishing according to claim 13 , wherein the water-soluble organic polymer contains at least one selected from polyacrylic acid and ammonium polyacrylate.

Assignees

• Asahi Glass Co Ltd

Inventors

• YOSHIDA Yuiko

Classifications

• H10P52/402

  of semiconductor materials · CPC title

• H10P95/062 Primary

  involving a dielectric removal step · CPC title

• C09G1/02 Primary

  containing abrasives or grinding agents {(abrasives as such C09K3/14; polishing of semi-conductors H10P52/40)} · CPC title

• H01L21/31055

  Electricity · mapped topic

• C09K3/1463

  Aqueous liquid suspensions · CPC title