Micro-electro-mechanical system devices

Patent metadata

Field	Value
Publication number	US-9565488-B2
Application number	US-201514716940-A
Country	US
Kind code	B2
Filing date	May 20, 2015
Priority date	May 20, 2015
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

In various embodiments, a micro-electro-mechanical system device is provided. The micro-electro-mechanical system device may include a carrier, a particle filter structure coupled to the carrier, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole, and a micro-electro-mechanical system structure disposed on a side of the particle filter structure opposite the carrier. A height of the plurality of grid elements is greater than a width of the corresponding grid elements.

First claim

What is claimed is:

1. A micro-electro-mechanical system device, comprising:
a carrier having a front side and a rear side opposite the front side, the carrier comprising a cavity;
a particle filter structure coupled to the carrier and disposed in the cavity between the front side and the rear side of the carrier, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole; and
a micro-electro-mechanical system structure disposed on the front side of the carrier, wherein a side of the micro-electro-mechanical system structure facing the carrier is at least partially exposed by the cavity;
wherein a height of the plurality of grid elements is greater than a width of the corresponding grid elements.

2. The micro-electro-mechanical system device of claim 1 ,
wherein at least a portion of the grid element has a width in the range from about 0.3 μm to about 2 μm.

3. The micro-electro-mechanical system device of claim 1 ,
wherein at least a portion of the grid element has a height in the range from about 3 μm to about 20 μm.

4. The micro-electro-mechanical system device of claim 1 ,
wherein the grid comprises a first grid layer and a second grid layer disposed over the first grid layer;
wherein the micro-electro-mechanical system structure is disposed on the same side as the second grid layer with respect to the first grid layer;
wherein the second grid layer has a greater width than the first grid layer.

5. The micro-electro-mechanical system device of claim 4 ,
wherein the second grid layer is electrically conductive.

6. The micro-electro-mechanical system device of claim 4 ,
wherein the second grid layer has a smaller mesh width than the first grid layer.

7. The micro-electro-mechanical system device of claim 1 ,
wherein the micro-electro-mechanical system structure is configured as a microphone or a loudspeaker.

8. The micro-electro-mechanical system device of claim 7 ,
wherein the particle filter structure forms at least a portion of a backplate of the microphone or a loudspeaker.

9. The micro-electro-mechanical system device of claim 1 ,
wherein the grid comprises silicon.

10. The micro-electro-mechanical system device of claim 1 ,
wherein the particle filter structure is at least partially coated with a hydrophobic layer.

11. The micro-electro-mechanical system device of claim 1 ,
wherein the particle filter structure is at least partially coated with a oleophobic layer.

12. A micro-electro-mechanical system device, comprising:
a first substrate;
a second substrate bonded to the first substrate;
wherein the second substrate comprises a particle filter structure, the particle filter structure comprising a grid, wherein the grid comprises a plurality of grid elements, each grid element comprising at least one through hole; and
a micro-electro-mechanical system structure disposed over the first substrate opposite the second substrate;
wherein a height of the plurality of grid elements is greater than a width of the corresponding grid elements, and
wherein the grid comprises a first grid layer and a second grid layer disposed over the first grid layer;
wherein the micro-electro-mechanical system structure is disposed on the same side as the second grid layer with respect to the first grid layer;
wherein the second grid layer has a greater width than the first grid layer.

13. The micro-electro-mechanical system device of claim 12 ,
wherein at least a portion of the grid element has a width in the range from about 0.3 μm to about 2 μm.

14. The micro-electro-mechanical system device of claim 12 ,
wherein at least a portion of the grid element has a height in the range from about 3 μm to about 20 μm.

15. The micro-electro-mechanical system device of claim 12 ,
wherein the second grid layer has a smaller mesh width than the first grid layer.

16. The micro-electro-mechanical system device of claim 12 ,
wherein the second grid layer has a larger mesh width than the first grid layer.

17. The micro-electro-mechanical system device of claim 12 ,
wherein the micro-electro-mechanical system structure is configured as a microphone or a loudspeaker.

18. The micro-electro-mechanical system device of claim 17 ,
wherein the particle filter structure forms at least a portion of a backplate of the microphone or a loudspeaker.

19. The micro-electro-mechanical system device of claim 12 ,
wherein the grid comprises silicon.

20. The micro-electro-mechanical system device of claim 12 ,
wherein the particle filter structure is at least partially coated with a hydrophobic layer.

21. The micro-electro-mechanical system device of claim 12 ,
wherein the particle filter structure is at least partially coated with a oleophobic layer.

22. A micro-electro-mechanical system device, comprising:
a carrier;
a particle filter structure coupled to the carrier, the particle filter structure comprising a silicon grid, wherein the silicon grid comprises a plurality of grid elements, each grid element comprising at least one through hole; and
a micro-electro-mechanical system structure disposed over the particle filter structure, wherein the micro-electro-mechanical system structure comprises a plurality of electrodes and a membrane coupled to the plurality of electrodes;
wherein at least a portion of the grid element has a width in the range from about 0.3 μm to about 1 μm; and
wherein at least a portion of the grid element has a height in the range from about 3 μm to about 20 μm,
wherein the grid comprises a first grid layer and a second grid layer disposed over the first grid layer;
wherein the micro-electro-mechanical system structure is disposed on the same side as the second grid layer with respect to the first grid layer;
wherein the second grid layer has a greater width than the first grid layer.

23. The micro-electro-mechanical system device of claim 22 ,
wherein the first grid layer has a width in the range from about 0.3 μm to about 1 μm.

24. The micro-electro-mechanical system device of claim 22 ,
wherein the second grid layer has a width in the range from about 1 μm to about 3 μm.

25. The micro-electro-mechanical system device of claim 22 ,
wherein the second grid layer has a height in the range from about 0.5 μm to about 5 μm.

26. The micro-electro-mechanical system device of claim 22 ,
wherein at least a portion of the grid element has a height that is greater than its width by a factor of at least 2.

27. The micro-electro-mechanical system device of claim 22 ,
wherein the micro-electro-mechanical system structure is configured as a microphone or a loudspeaker; and
wherein the particle filter structure forms at least a portion of a backplate of the microphone or a loudspeaker.

28. The micro-electro-mechanical system device of claim 22 ,
wherein the grid comprises polysilicon.

29. The micro-electro-mechanical system device of claim 22 ,
wherein the particle filter structure is at least partially coated with a hydrophobic layer.

30. The micro-electro-mechanical system device of claim 22 ,
wherein the particle filter structure is at least partially coated with a oleophobic layer.

Assignees

• Infineon Technologies Ag

Inventors

• Friza Wolfgang
• Dehe Alfons

Classifications

• B81B7/02 Primary

  containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS] (B81B7/04 takes precedence) · CPC title

• H04R19/005

  using semiconductor materials · CPC title

• H04R19/04

  Microphones (H04R19/01 takes precedence) · CPC title

• B81C1/00

  Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) · CPC title

• H04R1/023 Primary

  Screens for loudspeakers · CPC title