Pressure sensor, manufacturing method thereof and pressure detection device
US-2024426680-A1 · Dec 26, 2024 · US
Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence)
Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) · Cooperative Patent Classification (CPC)
Separating, mixing, shaping, printing, and transporting materials.
Related technology areas
Mapped technology topics for this CPC code.
| Metric | Value |
|---|---|
| CPC code | B81C1/00 |
| Official title | Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) |
| Display label | Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence) |
| Total patents | 397 |
Filing trend
Year-over-year patent counts classified under this CPC code.
Filing activity over the last five years is declining.
| Year | Patents |
|---|---|
| 2015 | 57 |
| 2016 | 72 |
| 2017 | 59 |
| 2018 | 58 |
| 2019 | 49 |
| 2020 | 31 |
| 2021 | 16 |
| 2022 | 10 |
| 2023 | 15 |
| 2024 | 16 |
| 2025 | 11 |
| 2026 | 3 |
Representative patents
Representative publications under this CPC code from precomputed stats, or recent filings when stats are unavailable.
Microfluidic chips and methods of producing microfluidic chips
US-2024351025-A1 · Oct 24, 2024 · US
Micromachined piezoelectric x-axis gyroscope
US-9459099-B2 · Oct 4, 2016 · US
Semiconductor structures including self-assembled polymer domains registered to the underlying self-assembled polymer domains, templates comprising the same, and methods of forming the same
US-2015380260-A1 · Dec 31, 2015 · US
MEMS anchor and spacer structure
US-9213181-B2 · Dec 15, 2015 · US
Micro electro mechanical systems component and method of manufacturing the same
US-2015344292-A1 · Dec 3, 2015 · US
MEMS microphone package structure having an improved carrier and a method of manufacturing same
US-9193581-B1 · Nov 24, 2015 · US
Method for producing microchannel, and microchannel
US-2015329354-A1 · Nov 19, 2015 · US
Structures with PZT Nanoparticle Ink Based Piezoelectric Sensor Assembly
US-2015333250-A1 · Nov 19, 2015 · US
Pressure sensor device with high sensitivity and high accuracy
US-2015330856-A1 · Nov 19, 2015 · US
Multi-die mems package
US-2015321904-A1 · Nov 12, 2015 · US
MEMS Device
US-2015289046-A1 · Oct 8, 2015 · US
Micro electrical mechanical system with bending deflection of backplate structure
US-9148726-B2 · Sep 29, 2015 · US
Extensions of self-assembled structures to increased dimensions via a “bootstrap” self-templating method
US-9142420-B2 · Sep 22, 2015 · US
MEMS device structure and methods of forming same
US-9139420-B2 · Sep 22, 2015 · US
Method of fabrication of Al/Ge bonding in a wafer packaging environment and a product produced therefrom
US-9139428-B2 · Sep 22, 2015 · US
Process for manufacturing electro-mechanical systems
US-9139425-B2 · Sep 22, 2015 · US
Display device and method for manufacturing the same
US-9134531-B2 · Sep 15, 2015 · US
Method of manufacturing mirror device
US-2015248007-A1 · Sep 3, 2015 · US
Micromechanical component and method for producing a micromechanical component having a thin-layer cap
US-9114975-B2 · Aug 25, 2015 · US
Frequently asked questions
Answers are generated from the same data shown on this page.
- What is CPC B81C1/00?
- CPC B81C1/00 is the Cooperative Patent Classification code for “Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence).”
- How many patents are filed under CPC B81C1/00 (Manufacture or treatment of devices or systems in or on a substrate (B81C3/00 takes precedence))?
- Our database includes 397 publications tagged with this CPC code.
- Is patent activity under CPC B81C1/00 growing?
- Publication counts under this code: 16 in 2024 vs 11 in 2025 (latest complete years).