Interconnects based on subtractive etching of silver

Patent metadata

Field	Value
Publication number	US-9564362-B2
Application number	US-201514615077-A
Country	US
Kind code	B2
Filing date	Feb 5, 2015
Priority date	Feb 5, 2015
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A method for forming at least one Ag or Ag based alloy feature in an integrated circuit, including providing a blanket layer of Ag or Ag based alloy in a multi-layer structure on a substrate. The method further includes providing a hard mask layer over the blanket layer of Ag or Ag based alloy. The method further includes performing an etch of the blanket layer of Ag or Ag based alloy, wherein a portion of the blanket layer of Ag or Ag based alloy that remains after the etch forms one or more conductive lines. The method further includes forming a liner that surrounds the one or more conductive lines. The method further includes depositing a dielectric layer on the multi-layer structure.

First claim

What is claimed is:

1. A method of forming at least one Ag or Ag based alloy feature in an integrated circuit, the method comprising:
providing a blanket layer of Ag or Ag based alloy in a multi-layer structure on a substrate;
providing a hard mask layer over the blanket layer of Ag or Ag based alloy;
performing an etch of the blanket layer of Ag or Ag based alloy, wherein a portion of the blanket layer of Ag or Ag based alloy that remains after the etch forms one or more conductive lines, and wherein the etch of the blanket layer of Ag or Ag based alloy is performed using a plasma that is capable of forming a polymeric compound and/or complex on the portion of the blanket layer of Ag or Ag based alloy that remains after the etch;
forming a liner that surrounds the one or more conductive lines; and
depositing a dielectric layer on the multi-layer structure.

2. The method of claim 1 , wherein each of the one or more conductive lines has a width of less than approximately fifty nanometers.

3. The method of claim 1 , wherein a pitch between at least two conductive lines of the one or more conductive lines is less than approximately one hundred nanometers.

4. The method of claim 1 , wherein the multi-layer structure comprises:
a first dielectric layer formed on the substrate;
a first liner layer formed on the first dielectric layer;
the blanket layer of Ag or Ag based alloy formed on the first liner layer;
the hard mask layer formed on the blanket layer of Ag or Ag based alloy;
an organic underlayer formed on the hard mask layer; and
a resist layer formed on the organic underlayer.

5. The method of claim 1 , wherein the hard mask layer comprises a first hard mask layer and a second hard mask layer formed on the first hard mask layer.

6. The method of claim 5 , wherein the first hard mask layer comprises tantalum.

7. The method of claim 5 , further comprising, prior to performing the etch:
transferring a pattern from the organic underlayer and the second hard mask layer to the first hard mask layer.

8. The method of claim 7 , wherein the transferring comprises:
developing the resist layer;
etching the second hard mask layer down to the first hard mask layer, such that only a portion of the second hard mask layer residing directly beneath the organic underlayer remains and becomes a patterned second hard mask layer;
removing the organic underlayer and the resist layer;
exposing the patterned second hard mask layer; and
etching the first hard mask layer down to the blanket layer of Ag or Ag based alloy, such that only a portion of the first hard mask layer residing directly beneath the patterned second hard mask layer metal remains and becomes a patterned first hard mask layer.

9. The method of claim 1 , wherein the etch of the blanket layer of Ag or Ag based alloy is performed using the plasma is performed at a temperature between 15 degrees Celsius and 80 degrees Celsius.

10. The method of claim 1 , wherein the etch of the blanket layer of Ag or Ag based alloy is performed using the plasma at a pressure less than 100 mTorr.

11. The method of claim 1 , wherein the plasma is generated from a hydrocarbon-containing precursor, wherein the hydrocarbon-containing precursor is an organic compound that consists entirely of hydrogen and carbon.

12. The method of claim 11 , wherein the hydrocarbon-containing precursor is one of: an alkane, an alkene, an alkyne, a cycloalkane, and an arene.

13. The method of claim 1 , wherein the plasma is generated from a generated from CO and hydrogen.

14. The method of claim 1 , wherein the plasma is generated from a generated from CO 2 and hydrogen.

Assignees

• IBM

Inventors

• Baker-O'Neal Brett C
• Joseph Eric A
• Miyazoe Hiroyuki

Classifications

• H10W20/0633

  using subtractive patterning of the conductive members · CPC title

• H10P76/4085

  characterised by the processes involved to create the masks · CPC title

• H10P76/405

  characterised by their composition, e.g. multilayer masks · CPC title

• H10P76/204

  of organic photoresist masks · CPC title

• H10P50/267

  using plasmas · CPC title