Method of fabricating MEMS devices having a plurality of cavities

Patent metadata

Field	Value
Publication number	US-9561954-B2
Application number	US-201414577628-A
Country	US
Kind code	B2
Filing date	Dec 19, 2014
Priority date	Mar 1, 2013
Publication date	Feb 7, 2017
Grant date	Feb 7, 2017

Abstract

A method for forming an integrated circuit having Micro-electromechanical Systems (MEMS) includes forming at least two recesses into a first layer, forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer. An intermediate layer is bonded onto the second layer, the intermediate layer includes through-holes corresponding to the recesses of the second layer. The first layer is bonded to the intermediate layer such that cavities are formed, the cavities to act as operating environments for MEMS devices. The two cavities have different pressures.

First claim

What is claimed is:

1. A method for forming an integrated circuit, the method comprising:
forming at least two recesses into a first layer;
forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the at least two recesses of the first layer;
bonding an intermediate layer onto the second layer, wherein the bonding includes aligning the intermediate layer comprising through-holes with the at least two recesses of the second layer;
bonding the first layer to the intermediate layer, wherein the bonding includes forming at least two cavities of the at least two recesses of the first layer and the at least two recesses of the second layer; and
providing different pressures in the at least two cavities by forming a material on one of the recesses.

2. The method of claim 1 , wherein the providing different pressures includes forming a first material on one of the recesses and a second material, different than the first material, on another one of the recesses.

3. The method of claim 1 , wherein the bonding the second layer to the intermediate layer includes performing a fusion bonding.

4. The method of claim 1 , wherein the bonding the first layer to the intermediate layer includes performing a eutectic bonding.

5. The method of claim 1 , wherein the forming the material includes depositing a layer including a metal.

6. The method of claim 5 , wherein the deposited layer comprises one of: Al, Ti, AlOx, AlSiN, TiN, Au and Ag.

7. A method for forming an integrated circuit, the method comprising:
forming at least two recesses into a first layer;
forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the at least two recesses of the first layer;
bonding an intermediate layer onto the second layer, wherein the bonding includes aligning the intermediate layer comprising through-holes with the at least two recesses of the second layer;
bonding the first layer to the intermediate layer, wherein the bonding includes forming at least two cavities; and
absorbing gases in at least one of the at least two formed cavities using a material on the sidewalls of the cavity.

8. The method of claim 7 , wherein the absorbing gases includes forming an absorbing material on a sidewall of the at least one of the at least two formed cavities.

9. The method of claim 7 , further comprising:
forming a metal containing material on a sidewall of at least one of the recesses in the first or second layers.

10. The method of claim 9 , further comprising:
using the metal containing material to provide a different pressure in the at least one of the at least two formed cavities.

11. The method of claim 10 , wherein the metal containing material performs the absorbing.

12. A method for forming an integrated circuit having Micro-Electro-Mechanical Systems (MEMS), the method comprising:
forming at least two recesses into a first layer;
forming at least two recesses into a second layer, the at least two recesses of the second layer being complementary to the recesses of the first layer;
bonding an intermediate layer onto the second layer, the intermediate layer comprising through-holes corresponding to the recesses of the second layer; and
bonding the first layer to the intermediate layer such that at least two cavities are formed, the cavities to act as operating environments for MEMS devices;
providing different pressures in the at least two cavities.

13. The method of claim 12 , further comprising: depositing a metal containing material in at least one of the recesses to cause the different pressures.

14. The method of claim 12 , further comprising:
depositing a material in at least one of the recesses; and
using the material to absorb gases formed in the cavity defined by that at least one recess, wherein the absorbing changes the pressure in the cavity.

15. The method of claim 12 , wherein the MEMS device comprises one of: a gyroscope, an accelerometer, a pressure sensor, a motion detector, RF resonator, or other MEMS devices.

16. The method of claim 12 , further comprising, depositing a material in at least one of the recesses to cause the different pressures.

17. The method of claim 16 , wherein the deposited material comprises one of: Al, Ti, AlOx, AlSiN, TiN, Au and Ag.

18. The method of claim 12 , wherein at least one recess is of a different size to cause the different pressures.

19. The method of claim 18 , wherein a different sized recess varies in width or length from other recesses.

20. The method of claim 18 , wherein a different sized recess varies in depth from other recesses.

Assignees

• Taiwan Semiconductor Mfg Co Ltd

Inventors

• Cheng Shyh-Wei
• Weng Jui-Chun
• Hsu Hsi-Cheng
• Wang Chih-Yu
• Tu Jung-Kuo
• Chu Che-Jung
• Hsu Yu-Ting

Classifications

• B81C2203/0118

  Bonding a wafer on the substrate, i.e. where the cap consists of another wafer · CPC title

• B81B7/0041

  maintaining a controlled atmosphere with techniques not provided for in B81B7/0038 · CPC title

• B81C3/001

  Bonding of two components · CPC title

• B81C1/00269

  Bonding of solid lids or wafers to the substrate · CPC title

• B81C1/00277 Primary

  for maintaining a controlled atmosphere inside of the cavity containing the MEMS · CPC title