Thermal stabilization of temperature sensitive components

Patent metadata

Field	Value
Publication number	US-9560779-B2
Application number	US-201414504948-A
Country	US
Kind code	B2
Filing date	Oct 2, 2014
Priority date	Oct 2, 2014
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

An enclosure for thermally stabilizing a temperature sensitive component on a circuit board is provided. The enclosure comprises a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted. The first cover section includes a first lid, and at least one sidewall that extends from a perimeter of the first lid. The enclosure also comprises a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section. The second cover section includes a second lid, and at least one sidewall that extends from a perimeter of the second lid. The first and second cover sections are configured to releasably connect with the circuit board.

First claim

What is claimed is:

1. An enclosure for thermally stabilizing a temperature sensitive component on a circuit board, the enclosure comprising:
a first cover section configured to be mounted over a portion of a first side of the circuit board where at least one temperature sensitive component is mounted, the first cover section including a first lid, a first sidewall, and a second sidewall opposite from the first sidewall, the first and second sidewalls extending from a perimeter of the first lid, the first sidewall including a first flexible pad that extends in a perpendicular direction away from the first lid, the second sidewall including a second flexible pad and a third flexible pad that each extend in a perpendicular direction away from the first lid, the first sidewall including a first slot and a second slot each respectively located on opposite sides of the first flexible pad, and the second sidewall including a third slot located between the second and third flexible pads; and
a second cover section configured to be mounted over a portion of a second side of the circuit board opposite from the first cover section, the second cover section including a second lid and at least one sidewall that extends from a perimeter of the second lid;
wherein the first and second cover sections are configured to releasably connect with the circuit board;
wherein the first and second cover sections include the same structural features such that the first and second cover sections are mountable interchangeably over either the first side or the second side of the circuit board.

2. The enclosure of claim 1 , wherein:
the first flexible pad includes a tapered flange at a distal end thereof;
the second flexible pad includes a tapered flange at a distal end thereof; and
the third flexible pad includes a tapered flange at a distal end thereof.

3. The enclosure of claim 2 , wherein the first cover section includes a third sidewall and a fourth sidewall opposite from the third sidewall, the third sidewall including at least one nub that protrudes from an edge of the third sidewall opposite from the first lid, and the fourth sidewall including at least one nub that protrudes from an edge of the fourth sidewall opposite from the first lid.

4. The enclosure of claim 1 , wherein the second cover section includes a first sidewall and a second sidewall opposite from the first side wall, the first sidewall of the second cover section including a first flexible pad that extends in a perpendicular direction away from the second lid, the second sidewall of the second cover section including a second flexible pad and a third flexible pad that each extend in a perpendicular direction away from the second lid.

5. The enclosure of claim 4 , wherein the first sidewall of the second cover section includes a first slot and a second slot each respectively located on opposite sides of the first flexible pad, and the second sidewall of the second cover section includes a third slot located between the second and third flexible pads.

6. The enclosure of claim 5 , wherein:
the first flexible pad of the second cover section includes a tapered flange at a distal end thereof;
the second flexible pad of the second cover section includes a tapered flange at a distal end thereof; and
the third flexible pad of the second cover section includes a tapered flange at a distal end thereof.

7. The enclosure of claim 6 , wherein the second cover section includes a third sidewall, and a fourth sidewall opposite from the third sidewall, the third sidewall including at least one nub that protrudes from an edge of the third sidewall opposite from the second lid, and the fourth sidewall including at least one nub that protrudes from an edge of the fourth sidewall opposite from the second lid.

8. An electronic assembly, comprising:
a printed circuit board having a first side and an opposing second side;
at least one temperature sensitive component mounted on the first side of the printed circuit board;
an enclosure coupled to a portion of the printed circuit board where the at least one temperature sensitive component is mounted, the enclosure comprising:
a first cover section mounted over a portion of the first side of the printed circuit board, the first cover section including a first lid and at least two sidewalls that extend from a perimeter of the first lid, the first cover section defining a cavity that contains the at least one temperature sensitive component, wherein the at least two sidewalls have a first set of flexible pads that each include tapered flanges that are engaged with the second side of the printed circuit board; and
a second cover section mounted over a portion of the second side of the printed circuit board opposite from the first cover section, the second cover section including a second lid and at least one sidewall that extends from a perimeter of the second lid; and

a heater mounted on the first side or the second side of the printed circuit board and located within the enclosure, the heater separate from the temperature sensitive component;
wherein the first and second cover sections are releasably connected with the printed circuit board, and the enclosure is configured to thermally stabilize the at least one temperature sensitive component;
wherein the first and second cover sections include the same structural features such that the first and second cover sections are mountable interchangeably over either the first side or the second side of the printed circuit board.

9. The electronic assembly of claim 8 , wherein the enclosure is configured as an oven that maintains a predetermined temperature range within the enclosure to thermally stabilize the temperature sensitive component.

10. The electronic assembly of claim 8 , wherein the at least one temperature sensitive component comprises a sensor, an oscillator, or an analog-to-digital converter.

11. The electronic assembly of claim 10 , wherein the sensor comprises a micro-electrical-mechanical systems (MEMS) sensor.

12. The electronic assembly of claim 8 , wherein the second cover section includes at least two sidewalls having a second set of flexible pads that each include tapered flanges that are engaged with the first side of the printed circuit board.

13. The electronic assembly of claim 12 , wherein the at least two sidewalls of the first cover section include a first set of slots that receive the tapered flanges of the second set of flexible pads, and the at least two sidewalls of the second cover section include a second set of slots that receive the tapered flanges of the first set of flexible pads.

14. The electronic assembly of claim 13 , wherein the first cover section includes at least two sidewalls having a first set of nubs that protrude into a first set of cut-outs in the printed circuit board, and the second cover section includes at least two sidewalls having a second set of nubs that protrude into a second set of cut-outs in the printed circuit board.

15. The electronic assembly of claim 8 , further comprising a thermal insulation material within the enclosure.

Assignees

• Honeywell Int Inc

Inventors

• Novysedlak Peter
• Hajek Ondrej
• Konecny Martin
• Vasicek Milan

Classifications

• B81B2201/0235

  Accelerometers · CPC title

• G01D3/028

  mitigating undesired influences, e.g. temperature, pressure · CPC title

• H05K1/18

  structurally associated with non-printed electric components (H05K1/16 takes precedence) · CPC title

• G01P1/023

  for acceleration measuring devices · CPC title

• H05K2201/06

  Thermal details · CPC title