Laser diode with cooling along even the side surfaces

Patent metadata

Field	Value
Publication number	US-9559491-B2
Application number	US-201414910813-A
Country	US
Kind code	B2
Filing date	Aug 14, 2014
Priority date	Aug 21, 2013
Publication date	Jan 31, 2017
Grant date	Jan 31, 2017

Abstract

A laser component includes a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip, wherein an underside of the laser chip is arranged in a manner bearing on a carrier, a top side of the laser chip is arranged in a manner bearing on a further carrier, the laser chip is hermetically tightly encapsulated between the carrier and the further carrier, a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and the first side surface of the laser chip thermally conductively connects to a heat sink.

First claim

The invention claimed is:

1. A laser component comprising a laser chip having a top side, an underside, a first side surface and a second side surface, which are oriented parallel to a resonator of the laser chip,
wherein the underside of the laser chip is arranged in a manner bearing on a carrier,
the top side of the laser chip is arranged in a manner bearing on a further carrier,
the laser chip is hermetically tightly encapsulated between the carrier and the further carrier,
a second electrical contact pad of the laser chip, said second electrical contact pad being formed on the top side of the laser chip, electrically conductively connects to a second electrical mating contact pad formed on the further carrier, and
the first side surface of the laser chip thermally conductively connects to a heat sink.

2. The laser component as claimed in claim 1 , wherein a respective soldering contact pad that electrically contacts the laser component is arranged on the carrier and on the further carrier.

3. The laser component as claimed in claim 1 , wherein the laser component comprises a cover glass arranged in front of a radiation emission face of the laser chip.

4. The laser component as claimed in claim 3 , wherein the cover glass comprises an integrated optical lens.

5. The laser component as claimed in claim 1 , wherein a first electrical contact pad of the laser chip, said first electrical contact pad being formed on the underside of the laser chip, electrically conductively connects to a first electrical mating contact pad, which is formed on the carrier.

6. The laser component as claimed in claim 1 , wherein the laser component comprises a further laser chip.

7. The laser component as claimed in claim 1 , wherein the heat sink comprises an electrically insulating material bearing on at least one part of the first side surface of the laser chip.

8. The laser component as claimed in claim 7 , wherein the electrically insulating material comprises AlN.

9. The laser component as claimed in claim 7 , wherein the electrically insulating material comprises granules.

10. The laser component as claimed in claim 7 , wherein the electrically insulating material also bears on at least one part of the second side surface and one part of the top side of the laser chip.

11. The laser component as claimed in claim 1 , wherein the heat sink is fixed to the first side surface by a soft solder.

12. The laser component as claimed in claim 1 ,
wherein a depression is formed on a top side of the carrier,
the underside of the laser chip is arranged on the base of the depression, and
a region of the depression surrounding the laser chip is at least partly filled with a filling material.

13. The laser component as claimed in claim 12 , wherein the filling material comprises a solder, AlN or Cu.

14. The laser component as claimed in claim 12 ,
wherein the depression has a depth of 10 μm to 200 μm, and
the filling material above the base of the depression has a height of 10 μm to 150 μm.

15. The laser component as claimed in claim 1 , wherein the heat sink is formed by a metallization formed on the top side of the carrier.

16. The laser component as claimed in claim 1 ,
wherein an electrically conductive material is arranged on a top side of the carrier,
the electrically conductive material has a depression,
the underside of the laser chip is arranged on the base of the depression, and
the first side surface thermally conductively connects to a side wall of the depression.

Assignees

• Osram Opto Semiconductors Gmbh

Inventors

• Horn Markus
• Stojetz Bernhard

Classifications

• H01S5/4018

  Lasers electrically in series · CPC title

• H01S5/02476

  Heat spreaders, i.e. improving heat flow between laser chip and heat dissipating elements · CPC title

• H01S5/4031

  Edge-emitting structures · CPC title

• H01S5/0222

  Gas-filled housings · CPC title

• H01S5/02272

  Electricity · mapped topic