Method of manufacturing a semiconductor package having conductive pillars
US-2024387343-A1 · Nov 21, 2024 · US
US9559054B2 · US · B2
| Field | Value |
|---|---|
| Publication number | US-9559054-B2 |
| Application number | US-201314111798-A |
| Country | US |
| Kind code | B2 |
| Filing date | Jun 30, 2013 |
| Priority date | Jun 27, 2013 |
| Publication date | Jan 31, 2017 |
| Grant date | Jan 31, 2017 |
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Official abstract text for this publication.
The present invention discloses a repairing line structure for repairing a breakage at a crossing point of electric wires extending along different directions on a thin film transistor panel. The repairing line structure includes a repair line extending from a same side of the electric wire where the breakage is defined and connecting opposite ends of the breakage and an amorphous silicon protection pattern. The repairing line traverses the other electric wire crossing with the electric wire where the breakage is defined. The amorphous silicon protection pattern is located between the repairing line and the electric wire traversed by the repairing line.
Opening claim text (preview).
What is claimed is: 1. A repairing line structure for repairing a breakage at a crossing point of electric wires extending along different directions on a thin fin transistor panel, the thin film transistor panel comprising a plurality of gate lines extending along a first direction, a plurality of data lines extending along a second direction, a plurality of thin film transistors correspondingly located at crossing points of the gate lines and the data lines, and a plurality of pixel electrodes correspondingly connected to the thin film transistors, the repairing line structure comprising: a repairing line extending from a same side of the electric wire where the breakage is defined and connecting opposite ends of the breakage; and an amorphous silicon protection pattern; wherein the repairing line traverses first electric wire crossing the electric wire where the breakage is defined, and the amorphous silicon protection pattern is located between the repairing line and the first electric wire traversed by the repairing line, wherein a part of pixel electrode of a pixel overlapped with the repairing line is cut off from another part of pixel electrode of the pixel. 2. The repairing line structure of claim 1 , wherein the amorphous silicon protection pattern is extended to adjacent pixel electrodes that are overlapped by the repairing line. 3. The repairing line structure of claim 1 , wherein the amorphous silicon protection pattern only overlaps on the electric wire where the breakage is defined. 4. The repairing line structure of claim 1 , wherein the repairing line is made of a conductive metal deposited on the thin film transistor substrate by a laser chemical vapor deposition, two ends of the repairing line are fused to connect with the data line by a laser beam. 5. A repairing line structure for repairing a breakage at a crossing point of electric wires extending along different directions on a thin film transistor panel, the thin film transistor panel comprising a plurality of gate tines extending along a first direction, a plurality of data lines extending along a second direction, a plurality of thin film transistors correspondingly located at crossing points of the gate lines and the data lines, and a plurality of pixel electrodes correspondingly connected to the thin film transistors, the repairing line structure comprising: a repairing line extending from a same side of the electric wire where the breakage is defined and connecting opposite ends of the breakage; and an amorphous silicon protection pattern; wherein the repairing line traverses the other electric wire crossing the electric wire where the breakage is defined, and the amorphous silicon protection pattern is located between the repairing line and the electric wire traversed by the repairing line, wherein the amorphous silicon protection pattern is extended to adjacent pixel electrodes that are overlapped by the repairing line.
by modifying the pattern of conductive parts · CPC title
Adapting interconnections, e.g. making engineering charges, repairing · CPC title
by using a laser, e.g. laser cutting or laser direct writing · CPC title
Adaptable interconnections, e.g. fuses or antifuses · CPC title
Electricity · mapped topic
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