Substrate holding apparatus and substrate cleaning apparatus

US9558971B2 · US · B2

Patent metadata
FieldValue
Publication numberUS-9558971-B2
Application numberUS-201414309287-A
CountryUS
Kind codeB2
Filing dateJun 19, 2014
Priority dateJun 24, 2013
Publication dateJan 31, 2017
Grant dateJan 31, 2017

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  1. Title

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  2. Abstract

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  3. Assignees and inventors

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  4. Key dates

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  5. First independent claim

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  6. CPC / IPC classifications

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  7. Citations and related patents

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Abstract

Official abstract text for this publication.

A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate.

First claim

Opening claim text (preview).

What is claimed is: 1. A substrate holding apparatus comprising: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate. 2. The substrate holding apparatus according to claim 1 , wherein the at least one support member comprises a plurality of support members disposed around a center of the substrate. 3. The substrate holding apparatus according to claim 2 , wherein the chucks and the support members are arranged alternately along a circumferential direction of the substrate. 4. The substrate holding apparatus according to claim 1 , wherein the actuating device comprises: a first spring configured to move the chucks until the chucks contact the peripheral edge of the substrate; a second spring configured to elevate the support member to bring the support member into contact with the lower surface of the substrate; and an actuator configured to move the chucks in the direction away from the peripheral edge of the substrate while lowering the support member away from the lower surface of the substrate. 5. The substrate holding apparatus according to claim 1 , further comprising: a rotating device configured to rotate the chucks and the support member about an axis of the substrate. 6. A substrate cleaning apparatus comprising: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; an actuating device configured to bring the chucks into contact with the peripheral edge of the substrate while elevating the support member to bring the support member into contact with a lower surface of the substrate, and configured to move the chucks in a direction away from the peripheral edge of the substrate while lowering the support member to separate the support member away from the lower surface of the substrate; a cleaning liquid supply nozzle configured to supply a cleaning liquid onto the substrate when held by the substrate holding apparatus; and a cleaning tool configured to scrub the substrate in the presence of the cleaning liquid. 7. The substrate holding apparatus according to claim 1 , further comprising: support posts having substrate support surfaces on which the substrate can be placed. 8. The substrate holding apparatus according to claim 7 , further comprising: support shafts which rotatably support the chucks, respectively, the support shafts being supported by the support posts.

Assignees

Inventors

Classifications

  • using mechanical means, e.g. clamps or pinches · CPC title

  • characterised by a plurality of separate clamping members, e.g. clamping fingers · CPC title

  • using mainly spraying means, e.g. nozzles · CPC title

  • using mainly scrubbing means, e.g. brushes · CPC title

  • Electricity · mapped topic

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Frequently asked questions

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What does patent US9558971B2 cover?
A substrate holding apparatus capable of reducing an amount of deflection of a substrate, such as a wafer, is disclosed. The substrate holding apparatus includes: a plurality of chucks configured to hold a peripheral edge of a substrate; at least one support member disposed below the substrate; and an actuating device configured to bring the chucks into contact with the peripheral edge of the s…
Who is the assignee on this patent?
Ebara Corp
What technology area does this patent fall under?
Primary CPC classification H10P72/0412. Mapped technology areas include Electricity.
When was this patent published?
Publication date Tue Jan 31 2017 00:00:00 GMT+0000 (Coordinated Universal Time) (B2). Legal status and post-grant events are not shown on this page.
What related patents are in patentsdb?
We list 1 related publication on this page (citations in our corpus or others sharing the same primary CPC).